User's Manual

MB5601L Module User's manual

Hua shu Communication (Shenzhen) Company

6.4.16

Data reception (main mode)

.................................................................. 24

6.4.17

Disconnect (Master Mode)

................................................................... 24

7. Packaging Information and Reflow Soldering ...................................................... 25

7.1 Mechanical Dimensions .......................................................................25

7.2 Reflow profile .............................................................................. 26

8. Reference circuit design ........................................................................ 27

8.1 The most basic connection method of the module .................................................. 27

8.2MIC circuit design ........................................................................... 28

9. Packaging Information ......................................................................... 29