HUAWEI MC509 CDMA LGA Module Hardware Guide Issue 01 Date 2011-04-08
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HUAWEI MC509 CDMA LGA Module Hardware Guide About This Document About This Document History Version Date 01 2011-04-08 Issue 01 (2011-04-08) Chapter Descriptions Creation Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MC509 CDMA LGA Module Hardware Guide About This Document Summary This document provides information about the major functions, supported services, system architecture, and technical references of HUAWEI MC509 CDMA LGA Module. Packing System Certifications Environmental Protection Certification and Test National Compulsory Certification The following table lists the contents of this document. Chapter Details 1 Introduction Describes the short introduction of the product.
HUAWEI MC509 CDMA LGA Module Hardware Guide Content Content 1 Introduction.................................................................................................................................... 8 2 Overall Description ...................................................................................................................... 9 2.1 About This Chapter ........................................................................................................................... 9 2.
HUAWEI MC509 CDMA LGA Module Hardware Guide Content 3.10 JTAG Interface ............................................................................................................................. 41 3.11 RF Antenna Interface.................................................................................................................... 41 3.12 NC Pins ........................................................................................................................................
HUAWEI MC509 CDMA LGA Module Hardware Guide Content 7.3 National Compulsory Certification .................................................................................................. 62 7.3.1 Product Certification .............................................................................................................. 62 7.3.2 Importance of Product Certification ....................................................................................... 62 7.3.3 Product Certification Test Items ....
HUAWEI MC509 CDMA LGA Module Hardware Guide Introduction 1 Introduction This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI MC509 CDMA LGA Module (hereinafter referred to as the MC509 module) is used. This document helps you to understand the interface specifications, electrical features, and related product information of the MC509 module.
HUAWEI MC509 CDMA LGA Module Hardware Guide Overall Description 2 Overall Description 2.1 About This Chapter This chapter gives a general description of the MC509 module and provides: Function Overview Circuit Block Diagram Application Block Diagram 2.2 Function Overview Table 2-1 Feature Feature Description Physical Features Dimensions (L × W × H): 30mm×30mm×2.6mm Working Bands CDMA2000 1x, CDMA2000 EV-DO Rev 0, CDMA2000 EV-DO Rev A Weight about 5.
HUAWEI MC509 CDMA LGA Module Hardware Guide Overall Description Feature Description Application Interface (145pin LGA interface) Universal Asynchronous Receiver-Transmitter (UART) Supporting 8-wire UART One standard user interface Module (UIM) card (3V or 1.8V) Audio (OPTION): (only telematics version supports this function) For detailed information about the working bands supported, see 错误！未找到引用源。. 2×Micphone in 1×Speaker out 1×handset out 1×PCM USB 2.
HUAWEI MC509 CDMA LGA Module Hardware Guide Overall Description Feature Description Certification Information Restriction of the use of certain Hazardous Substances (RoHS) Federal Communications Commission (FCC) China Compulsory Certification(CCC) China Telecommunications Equipment Network Access Approval(CTA) Waste Electrical and Electronic Equipment Directive(WEEE) 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MC509 module.
HUAWEI MC509 CDMA LGA Module Hardware Guide Overall Description 2.4 Application Block Diagram Figure 2-2 Application block diagram of the MC509 module UART Interface： The module supports 3-line or 5-line or full serial port interface. USB Interface： The USB interface supports USB 2.0 full speed standard. UIM Interface： The UIM interface provides the interface for a UIM card. The UIM card can be inserted into the host side. Power Supply： DC 3.8V is recommended.
HUAWEI MC509 CDMA LGA Module Hardware Guide 3 Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MC509 module, including: LGA Interface Power Interface Signal Control Interface UART Interface USB Interface UIM Card Interface Audio Interface General Purpose I/O Interface JTAG Interface RF Antenna Interface NC Pins 3.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Table 3-1 Definitions of pins on the LGA interface PIN No.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No. Pin Name Normal MUX 55 GPIO - I/O 56 GND - 57 GND 58 I/O Description of the Application Interfaces Description DC Characteristics (V) Min Typical Max General I/O pins. The function of these pins has not been defined -0.3 2.6 2.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No. Pin Name Normal MUX 77 UART_RING GPIO O 78 UART_RX GPIO 79 UART_DTR 80 I/O Description of the Application Interfaces Description DC Characteristics (V) Min Typical Max UART Ring Indicator -0.3 2.6 2.9 I UART receive data input -0.3 2.6 2.9 GPIO I Data Terminal Ready -0.3 2.6 2.9 UART_CTS GPIO I UART Clear to Send -0.3 2.6 2.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No. Pin Name Normal MUX 108 GND - - 109 GPIO - 110 GND 111 I/O Description of the Application Interfaces Description DC Characteristics (V) Min Typical Max GND - - - I/O General I/O pins. The function of these pins has not been defined -0.3 2.6 2.9 - - GND - - - GPS_ANT - - RF GPS antenna interface - - - 112 GND - - GND - - - 113 GPIO - I/O General I/O pins.
HUAWEI MC509 CDMA LGA Module Hardware Guide PIN No.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-1 Bottom view of sequence of LGA interface pins 3.3 Power Interface 3.3.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Table 3-2 lists the definitions of the pins on the power supply interface. Table 3-2 Definitions of the pins on the power supply interface Pin No. Signal Name I/O Description DC Characteristics (V) Min Typical Max 12, 13 VBAT P Pins for power voltage input 3.3 3.8 4.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces For detailed information about power supply design and printed circuit board (PCB) design, see the HUAWEI Module Power Supply Design Guide and the HUAWEI LGA Module PCB Interconnection Design Guide 3.3.3 VCOIN Interface VCOIN pin of MC509 module is used as backup power from the 3 V coin cell for SMPL, RTC, and 32 kHz crystal oscillator backup; a capacitor (rather than a coin cell) can be used if only SMPL is supported.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Table 3-4 Coin cell characteristics Parameter Specifications HB-414 ML-series Nominal voltage 3V 3V Nominal capacity 0.3mAh 3.4mAh Continuous standard load 5mA 10mA Operating temperature -20℃ ~ +60℃ -20℃ ~ +60℃ Diameter 4.8mm 6.8mm Height 1.4mm 1.45mm Weight 0.07g 0.17g An interrupt is generated if the coin cell voltage drops too low (and the main battery is not present).
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Through the Output Power Supply interface, the MC509 module can supply 2.6V and 1.8V power externally with an output current of 20mA (typical value) for external level conversion or other applications. If the MC509 module is in Sleep mode, the Output Power Supply interface is in the low power consumption state (< 500μA). If the MC509 module is in Power Down mode, the Output Power Supply is in the disabled state. 3.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces It is recommended that use resistance of 0ohm in the DTE to isolate signals transmitted from above pins in Table 3-5 3.4.2 Input Signal Control Pins The MC509 module implements power-on and power-off and resets the hardware through the input signal control pins.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-3 shows the connections of the POWER_ON_OFF and RESIN_N pins. Figure 3-3 Connections of the POWER_ON_OFF and RESIN_N pins Power-On Time Sequence After VBAT has been applied and is stable, the module will generate an on board power on reset signal and on the release of the reset, the module will boot up.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Table 3-6 Power on timing Parameter Comments Time(Nominal values) Units TPON POWER_ON_OFF turn on time. 0.5< TPON <1 sec TPD+ POWER_ON_OFF Valid to USB D+ high 4 sec If the DTE needs to detect the PID/VID of module during the BIOS phase, the detection time should exceed the TPD+ time.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces For detailed information about power supply design and printed circuit board (PCB) design, see the HUAWEI LGA Module Power Supply Design Guide and the HUAWEI MC509 CDMA LGA Module PCB Interconnection Design Guide. RESIN_N The MC509 module supports hardware reset function. If the software of the MC509 module stops responding, the MC509 module can be reset through the RESIN_N signal.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-6 Connections of the WAKEUP_IN and WAKEUP_OUT pins 3.5 UART Interface 3.5.1 Overview The MC509 module provides the RS-232 UART (9-wire UART) interface for one asynchronous communication channel. As the UART interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART interface.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Table 3-8 UART interface signals Pin No. Pin Name 76 UART_TX O Data sending on the wireless module 78 UART_RX I 77 UART_RIN G 74 I/O Description Feature DC Characteristics (V) Min Typical Max The DTE receives serial data. -0.3 2.6 2.9 Data receive end of the module The DTE transmits serial data. -0.3 2.6 2.9 O Ringing indication on the wireless module The DTE is notified of a remote call.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-7 Connection of the UART interface in the MC509 module (DCE) with the host (DTE) The RS-232 Transceivers can be used to connect the MC509 module to the RS-232C interface. In this connection, the complementary metal oxide semiconductor (COMS) level and the Electronic Industries Association (EIA) level are converted mutually.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces The USB interface is powered directly from the 3.3 V supply. The USB input/output lines are compatible with the USB 2.0 3.3 V signal specifications. Table 3-10 DC Electrical Characteristics of USB VOHmin VOLmax VIHmin VILmax 2.8V 0.3V 2V 0.8V Figure 3-8 Recommended circuit of USB interface Issue 01 (2011-04-08) Since the USB interface of MC509 module supports USB 2.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces 3.7 UIM Card Interface 3.7.1 Overview The MC509 module provides a UIM card interface complying with the ISO 7816-3 standard and supports automatic detection of a 3.0V UIM card or a 1.8V UIM card. Table 3-11 lists the UIM card interface signals. Table 3-11 UIM card interface signals Pin No. Pin Name I/O Description DC Characteristics (V) Min Typical Max 34 UIM_VCC O Power source for the external UIM. -0.3 1.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-9 Circuit of the UIM card interface Figure 3-10 Pin definition of UIM Socket pin1： UIM_PWR pin2： UIM_RESET pin3： UIM_CLK pin4： GND pin5： NULL pin6： UIM_DATA Issue 01 (2011-04-08) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces To meet the requirements of ETSI TS 102 230protocols and electromagnetic compatibility (EMC) authentication, the UIM card socket should be placed near the LGA interface (it is recommended that the PCB circuit connecting the LGA interface and the UIM card socket not exceed 100mm), because a long circuit may lead to wave distortion, thus affecting signal quality.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces The two audio I/O channels are completely different and thus have good performance of resisting RF interferences. The routes on the printed circuit board (PCB) should be placed in parallel with each other and should be short. The filter circuit on the two sides should be symmetric. The differential signals should be close to each other.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-13 Circuit diagram of the interface of the second audio channel ESD protection ferrite bead SPKR_OUT_P ferrite bead 1nF SPKR_OUT_N 1nF + _ 1nF Module (DCE) Speaker MIC2_P 1nF ferrite bead MIC2_N 1nF ESD protection ferrite bead + _ 1nF MIC It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-14 Circuit diagram of the interface of the PCM (MC509 is used as PCM master) PCM_SYNC: Output when PCM master PCM_CLK: Output when PCM master It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. Data only edition does not support the voice function.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces 3.10 JTAG Interface LGA MC509 module provides one JTAG interface (Joint Test Action Group). Set the pins in the following table as the test pins. And place the test points in the DTE for debug. Pin No. Pin Name I/O Description DC Characteristics (V) Min Type Max 31 VCC_EXT2 O 2.6V POWER output - 2.6 - 100 RESIN_N I Reset module -0.3 1.8 2.1 30 JTAG_TMS I -0.3 2.6 2.
HUAWEI MC509 CDMA LGA Module Hardware Guide Description of the Application Interfaces Table 3-13 Signals on RF Antenna interface Pin No. Pin Name I/O Description DC Characteristics (V) Min Typical Max 107 MAIN_ANT - RF main antenna interface - - - 111 GPS_ANT - RF GPS antenna interface - - - 115 AUX_ANT RF divert antenna interface - - - 3.12 NC Pins The LGA module has 45 NC pins. All the NC interfaces should not be connected. Please keep this pin open. Pin No.
错误！未知的文档属性名称 Hardware Guide RF Specifications 4 RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MC509 module, including: Antenna Installation Guidelines Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements 4.2 Antenna Installation Guidelines Install the antenna in a place covered by the signal.
错误！未知的文档属性名称 Hardware Guide RF Specifications 4.4 Conducted RF Measurement 4.4.1 Test Environment Test instrument Agilent 8960 Power supply KEITHLEY 2306 RF cable for testing L08-C014-350 of DRAKA COMTEQ or Rosenberger Cable length: 29cm Compensation for CDMA 850MHz:0.8dB Compensation for CDMA 2100MHz:1dB The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions. 4.4.
错误！未知的文档属性名称 Hardware Guide RF Specifications The test values are the average of some test samples. 4.5.2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MC509. The conducted transmit power refers to the maximum power that the module tested at the antenna port can transmit. According to the 3GPP2 protocol, the required transmit power varies with the power class. Table 4-2 lists the required ranges of the conducted transmit power of MC509.
错误！未知的文档属性名称 Hardware Guide RF Specifications expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 values are recommended for the antenna of MC509: S11 of the master antenna < –6dB Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of MC509.
错误！未知的文档属性名称 Hardware Guide RF Specifications 4.6.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply.
错误！未知的文档属性名称 Hardware Guide RF Specifications 4.6.4 Radio Test Environment The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and TIS can be tested in a microwave testing chamber. Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380MHz to 6GHz.
错误！未知的文档属性名称 Hardware Guide 5 Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MC509 module, including: Extreme Working Conditions Working and Storage Temperatures and Humidity Power Supply Features Reliability Features EMC and ESD Features 5.2 Extreme Working Conditions Table 5-1 lists the extreme working conditions for the MC509 module.
错误！未知的文档属性名称 Hardware Guide Electrical and Reliability Features 5.3 Working and Storage Temperatures and Humidity Table 5-2 lists the working and storage temperatures and humidity for the MC509 module.
错误！未知的文档属性名称 Hardware Guide Electrical and Reliability Features Parameter Description Minimum Value IOL Low-level output current Maximum Value Unit -1.5 mA VDD_PX is 2.6V or 1.8V, about the voltage, please refer to Table 3-1 . 5.5 Power Supply Features 5.5.1 Input Power Supply Table 5-4 lists the requirements for input power of the MC509 module. Table 5-4 Requirements for input power of the MC509 module Parameter Minimum Value Typical Value Maximum Value Ripple Unit VBAT 3.0 3.8 4.
错误！未知的文档属性名称 Hardware Guide Electrical and Reliability Features 5.5.2 Power Consumption The power consumptions of MC509 in different scenarios are respectively listed in Table 5-6 . The power consumption listed in this section is tested when the power supply of MC509 module is 3.8V. Typical values are measured at room temperature, and minimum and maximum values are measured over the entire operating temperature range.
错误！未知的文档属性名称 Hardware Guide Electrical and Reliability Features Item Test Condition Standard Damp heat cycling High temperature: 55±2 ºC IEC60068 Low temperature: 25±2 ºC Humidity: 95% Repetition times: 4 Test duration: 12h + 12h Temperature shock Low temperature: –40±2 ºC IEC60068 High temperature: 85±2 ºC Temperature change interval: < 30s Test duration: 15min Repetition times: 100 Salty fog test Temperature: 35°C IEC60068 Density of the NaCl solution: 5±1 % Spraying interval: 8h Duration of
错误！未知的文档属性名称 Hardware Guide Electrical and Reliability Features 5.7 EMC and ESD Features EMC tests have to be performed on the application as soon as possible to detect any potential problems. When designing, special attention should be paid to the following: Possible harmful emissions radiated by the application to the RF receiver in the receiver band.
错误！未知的文档属性名称 Hardware Guide 6 Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the following aspects of the MC509 module: Dimensions and interfaces PCB Pad Design Label Packing System 6.2 Dimensions and interfaces The dimension of MC509 is 30mm (length) × 30mm (width) × 2.6mm (height). Figure 6-1 shows the dimensions of MC509 in details.
错误！未知的文档属性名称 Hardware Guide Mechanical Specifications 6.3 PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the size of the pad in the middle region is the same as the pad size of the product package; other pads are 0.05 mm larger than the unilateral pad of the product package. For details, see Figure 6-2 . Issue 01 (2011-04-08) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
错误！未知的文档属性名称 Hardware Guide Mechanical Specifications Figure 6-2 PCB pad design 6.4 Label The label is made from deformation-resistant, fade-resistant, and high-temperatureresistant material and is able to endure the high temperature of 260°C. Issue 01 (2011-04-08) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
错误！未知的文档属性名称 Hardware Guide Mechanical Specifications Figure 6-3 Nameplate The picture mentioned above is only for reference. Make the film according to the drawing. The silk-screen should be clear, without burrs, and dimension should be accurate. This nameplate should not be covered by the film. The material and surface finishing and coatings which used have to make satisfied with the EU WEEE and RoHS directives.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications 7 Certifications 7.1 About This Chapter This chapter gives a general description of certifications: Environmental Protection Certification and Test National Compulsory Certification GCF and PTCRB Table 7-1 Product Certifications Certification MC509 CE FCC CCC NCC A-TICK Jate&Telec IC EU RoHS JGPSSI SGS RoHS PVC-Free GCF PTCRB SUPL 1.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications 7.2 Environmental Protection Certification and Test 7.2.1 RoHS RoSH stands for the restriction of the use of certain hazardous substances in electrical and electronic equipment. The following table lists the substances restricted by the RoHS and upper thresholds of their density.
HUAWEI MC509 CDMA LGA Module Hardware Guide Element Polymeric Material Certifications Metallic Material Electronic Component Chemical analysis − Use the ICP-AES, ICP-MS, and AAS to measure cadmium and lead in polymeric materials. − Use the CV-AAS, AFS, ICP-AES, and ICP-MS to measure mercury in polymeric materials, metals, and electronic components. − Test the chromized ferrous or non-ferrous metals by using the spot test method or boiling water extraction.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications specified in the agreements are responsible for recycling the telecommunication products. 7.2.3 PVC-free PVC-free products are free of polyvinyl chloride (PVC) that is harmful to human beings. PVC is used to produce soft plastic products such as artificial leather, membrane, and cable sheaths, and hard plastic products such as plates, windows, doors, pipes, and valves.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications Testing the product according to relevant safety regulations and ensuring that the product does no harm to users RF Measuring whether the radio transmitter meets relevant requirements Specific absorption rate (SAR) Measuring the RF energy absorbed by the body when an electronic product is used 7.3.4 Product Certification Classifications Product certification is classified into compulsory certification and non-compulsory certification.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications 7.3.6 Certification Types CE Certification According to the R&TTE Directive 1999/95/EC, all wireless equipment and telecommunications terminals sold in EU must meet all the stipulated health, safety, RF, and EMC requirements that provide for CE mark. Wireless equipment using frequency bands whose use is not harmonized throughout the EU should pass the certification test of a notified body.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications FCC regulations, as part of federal laws, are divided into several parts. Different parts define regulations for different products. A product, however, probably is required to meet the regulations in two or more parts. All terminals should be certified by the FCC or TCB and granted with an FCC ID. The FCC ID format is as follows: XXXYYYYYYYY XXX is the identification number of the applicant manufacturer (Huawei: QIS).
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications An example of the DGT mark: A-Tick Certification The A-Tick is a compliance mark produced by the Australian Communications and Media Authority (ACMA) for telecommunications equipment. The A-Tick indicates that a product is compliant with the mandatory technical and safety standards specified by ACMA and can legally be connected to a telecommunications network in Australia.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications wireless products require type approval (mainly for the RF part) by Japan Telecom before entering Japanese market. JATE JATE certification is mandatory for telecommunications equipment in Japan according to the Telecommunications Business Law.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications YYYYYYYY YYYYYYYY is the unique product number (UPN) consisting of up to eight capital letters in English and/or digits. Chinese Certifications Network access licensing (NAL) The Ministry of Information Industry (MII, former Ministry of Posts and Telecommunications) applies NAL to telecommunications equipment.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications License number Equipment type Scrambling code The following figure shows the anti-counterfeiting measures of NAL marks. − A means the fluorescent anti-counterfeiting string inside the mark. The anticounterfeiting string is visible under UV light and can be exposed with a knife. − B means the anti-counterfeiting shading that supports anti-photography and anti-forgery.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications xxxxCPxxxx xxxx before the letters CP is four Arabic numerals, indicating the year of issue of the certificate. xxxx following the letters CP is four Arabic numerals, indicating the sequence number of the certificate. CCC The China National Certification and Accreditation Administration of People's Republic of China (CNCA) is responsible for managing and organizing the CCC.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications The EU does not specify any RoHS mark. Huawei, however, designs the preceding RoHS mark to distinguish between environment-friendly and environment-unfriendly products. For Huawei RoHS marks, any color is acceptable. REACH: Regulation (EC) No.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications − When designing and manufacturing electronic information products, the manufacturers should use materials, technologies, and processes that are easily recyclable and environment-friendly in accordance with the relevant industrial or national standards. − All electronic information products sold on Chinese market should be marked with the names and contents of toxic and harmful substances and elements, safety period, and recyclability.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications In the case of certification of the laptops installed with Huawei modules, the relevant test reports of Huawei modules can be directly used in accordance with the following rules: The conductivity test data in the Huawei RF test report can be directly used by the laptop manufacturer. The laptop manufacturer should determine whether the radio test data in Huawei RF test report can be used according to the antenna gain.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications system approved by all members to ensure that the terminals meet network deployment requirements. All GCF members approve the terminals if the terminals are certified by the GCF. The GCF certifies both test cases and test systems. The GCF certification originates in Europe and now is accepted by mainstream operators in both Europe and Asia. The GCF certification is a DOC of equipment manufacturers.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications 7.4.2 PTCRB Certification The PTCRB requirements are certification standards in North America. The PTCRB was created in March 1997. GSM 850 MHz requirements were added to the PTCRB requirements in May 2001, which is an important development milestone in the history of standardization organizations in U.S.A. Similar to the GCF, the PTCRB comprises of operators and mainstream mobile phone manufacturers, and approved laboratories.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications Overall-System GCF Certification Huawei modules pass the GCF certification before being released to the market. Huawei performs 2000 to 3000 test items for each type of modules. The major tests are as follows: Protocol conformance test RF conformance test UIM conformance test The details about the certification tests are defined in the 3GPP test standards.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications the GCF and the PTCRB. Therefore, the test organizations are able to provide high quality and high efficiency test services and are widely recognized by operators. 3. Discuss test details with the test organization. Provide the test organization with the test report of Huawei modules and the modifications of the integrated equipment. The test organization then can determine the detailed test items and determine the test schedule accordingly.
HUAWEI MC509 CDMA LGA Module Hardware Guide Certifications Terminal manufacturers who apply for the PTCRB certification of the terminals to be integrated with Huawei modules must accomplish the following tasks: 1. Register as a guest of the PTCRB. Different from the GCF, the PTCRB comprises of only operators. Terminal manufacturers can join the PTCRB only as guests.
HUAWEI MC509 CDMA LGA Module Hardware Guide Safety Information 8 Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices. 8.
HUAWEI MC509 CDMA LGA Module Hardware Guide Safety Information Area indicated with the "Explosives" sign Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving. RF signals may affect electronic systems of motor vehicles.
HUAWEI MC509 CDMA LGA Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device. Use your wireless device and accessories with care and in clean environment.
HUAWEI MC509 CDMA LGA Module Hardware Guide Safety Information 8.14 Regulatory Information The following approvals and notices apply in specific regions as noted. 8.14.1 CE Approval (European Union) The wireless device is approved to be used in the member states of the EU. The wireless device is in compliance with the essential requirements and other relevant provisions of the Radio and Telecommunications Terminal Equipment Directive 1999/5/EC (R&TTE Directive).
HUAWEI MC509 CDMA LGA Module Hardware Guide 9 Appendix A Circuit of Typical Interfaces Appendix A Circuit of Typical Interfaces Issue 01 (2011-04-08) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MC509 CDMA LGA Module Hardware Guide Issue 01 (2011-04-08) Appendix A Circuit of Typical Interfaces Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MC509 CDMA LGA Module Hardware Guide 10 Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion BB Baseband CE European Conformity CS Coding Scheme CSD Circuit Switched Data DC direct current DCE data circuit-terminating equipment DMA direct memory access DTE data terminal equipment EIA Electronic Industries Association EMC electromagnetic compatibility ESD electrostatic discharge FCC Federal Commnications Commission
HUAWEI MC509 CDMA LGA Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion PDU protocol data unit RF radio frequency RoHS Restriction of the use of certain Hazardous Substances RTC real-time clock UIM User interface module TTL transistor-transistor logic TVS transient voltage suppressor VSWR voltage standing wave ratio ACLR Adjacent channel leakage power radio AMPS Advanced mobile phone system CDMA Code-division multiple access DCCH Dedicat
