HUAWEI MG323 GSM M2M Module Hardware Guide Issue 06 Date 2013-06-13
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HUAWEI MG323 GSM M2M Module Hardware Guide About This Document About This Document History Version Date Chapter 01 02 03 04 Issue 06 (2013-06-13) Descriptions Creation 2010-10-25 2011-07-18 2011-08-22 1 Deleted “1.2 Related Documents” 3.1 Deleted “Charging Interface (TBD)” 3.6.1 Revised “Table 3-5 UART1 interface signals” 3.8 Deleted “Charging Interface (TBD)” Added “Audio Interface” 7 Revised “Figure 7-1 Circuits of typical interfaces in the MG323 module” 2.
HUAWEI MG323 GSM M2M Module Hardware Guide About This Document Version Date Chapter Descriptions 05 2013-03-22 2.2 Updated Table 2-1 Feature 2.3 Updated Figure 2-1 Application block diagram of the MG323 module 2.4 Updated Figure 2-2 Circuit block diagram of the MG323 module 3.2 Updated Table 3-1 Definitions of pins on the BEB connector 3.3.2 Updated VBAT interface 3.3.3 Updated Figure 3-3 VCOIN interface circuit 3.4.3 Updated Figure 3-5 Power-off time sequence 3.5.
HUAWEI MG323 GSM M2M Module Hardware Guide Version Issue 06 (2013-06-13) Date About This Document Chapter Descriptions 3.8 Updated Chapter 3.8 Audio Interface 4.6 Updated Table 4-3 Recommended specifications of the antenna interface 7 Updated Figure 7-1 Circuits of typical interfaces in the MG323 module Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MG323 GSM M2M Module Hardware Guide Contents Contents 1 Introduction.................................................................................................................................... 8 1.1 Overview .......................................................................................................................................... 8 2 Overall Description ...................................................................................................................... 9 2.
HUAWEI MG323 GSM M2M Module Hardware Guide Contents 4.1 About This Chapter ......................................................................................................................... 29 4.2 Antenna Installation ........................................................................................................................ 29 4.3 Coaxial Cable and RF Connector .................................................................................................. 30 4.
HUAWEI MG323 GSM M2M Module Hardware Guide Introduction 1 Introduction 1.1 Overview This document describes the hardware application interfaces and air interfaces that are provided when the Huawei MG323 GSM M2M module (hereinafter referred to as the MG323 module) is used. This document helps you to understand the interface specifications, electrical features, and related product information of the MG323 module.
HUAWEI MG323 GSM M2M Module Hardware Guide Overall Description 2 Overall Description 2.1 About This Chapter This chapter gives a general description of the MG323 module and provides: Function Overview Application Block Diagram Circuit Block Diagram 2.
HUAWEI MG323 GSM M2M Module Hardware Guide Overall Description Feature Description Power consumption (current) Power-off current: 50 µA Average standby current DRX=2 < 3.0 mA DRX=5 < 2.5 mA DRX=9 < 2.0 mA GPRS Class 10 (maximum): 455 mA Protocols GSM/GPRS Phase2/2+ AT commands See the HUAWEI MG323 Series Wireless Module AT Command Interface Specification.
HUAWEI MG323 GSM M2M Module Hardware Guide Overall Description Feature Description Certification information Restriction of the use of certain Hazardous Substances (RoHS), European Conformity (CE), Federal Communications Commission (FCC), CMIIT, China Compulsory Certification (CCC), GCF (GSM Certification Forum) . [1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate from 3GPP TS 45.005 specifications. 2.
HUAWEI MG323 GSM M2M Module Hardware Guide Power management Multi-chip package (MCP) memory Radio frequency (RF) transceiver 26 MHz clock 32 kHz clock RF front-end modules Receive filter Overall Description Figure 2-2 Circuit block diagram of the MG323 module Issue 06 (2013-06-13) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MG323 GSM M2M Module Hardware Guide 3 Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MG323 module, including: B2B Connector Interface Power Interface Power-On and Power-Off Time Sequence Signal Control Interface UART Interface SIM Card Interface Audio Interface 3.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Table 3-1 Definitions of pins on the B2B connector Pin No. Pin Name Normal MUX 1 SIM_CLK - O 2 INTEAR_N - AO I/O Description DC Characteristics (V) Min. Tpy. Max Clock signal of the SIM card - 1.80/2.90 - Negative pole of the output of handset - - - speaker 3 VSIM - P Power supply of the SIM card - 1.80/2.
HUAWEI MG323 GSM M2M Module Hardware Guide Pin No. Pin Name Normal MUX 17 NC - - 18 GND - 19 NC 20 I/O Description Description of the Application Interfaces DC Characteristics (V) Min. Tpy. Max Not connected, please keep this pin open - - - - Ground - - - - - Not connected, please keep this pin open - - - TERM_ON - I Power on/power off control - internal pulled up - 21 NC - - Not connected, please keep this pin open - - - 22 RESET - I Hardware reset –0.
HUAWEI MG323 GSM M2M Module Hardware Guide Pin No. Pin Name Normal MUX 39 NC - - 40 VIO - 41 GND 42 I/O Description Description of the Application Interfaces DC Characteristics (V) Min. Tpy. Max Not connected, please keep this pin open - - - P External power output 2.70 2.80 2.95 - - Ground - - - VBAT - P Power supply input 3.30 3.80 4.80 43 GND - - Ground - - - 44 VBAT - P Power supply input 3.30 3.80 4.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Table 3-2 Definitions of the pins on the power supply interface Pin No. Signal Name I/O Description 42, 44, 46, 48, 50 VBAT P Pins for Power supply input 41, 43, 45, 47, 49 GND - GND 35 VCOIN P Pin for standby power input of the RTC 40 VIO P Pin for external power output 3.3.2 VBAT Interface When the MG323 module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces 3.3.3 VCOIN Interface VCOIN is an interface for standby power input of the RTC in the MG323 module. If the VBAT interface is ready for power supply, it on priority supplies the RTC with power. If the VBAT interface is not ready, the VCOIN interface provides standby power input for the RTC. In this case, the MG323 module needs 5 µA to maintain the RTC function.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Table 3-3 Definitions of pins of the power-on/power-off and reset interfaces Pin No. Signal Name I/O Description 20 TERM_ON I Pin for controlling power-on and power-off 22 RESET I Pin for resetting the hardware 3.4.2 Power-On Time Sequence Make sure that the MG323 module is powered on at the voltage and operating temperature in the recommended range.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Fetch Ext Code in the figure is a file system in the MG323 module. Before powering on the MG323, make sure that TERM_ON is in High-Z condition. 3.4.3 Power-Off Time Sequence The MG323 module supports power-off through the TERM_ON interface or the AT^SMSO command. Figure 3-5 shows the power-off time sequence.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Network status LED (LED_STATUS) pin Table 3-4 lists the pins on the signal control interface. Table 3-4 Pins on the signal control interface Pin No. Signal Name I/O Description 20 TERM_ON I Pin for controlling power-on and power-off 22 RESET I Pin for resetting the hardware 25 LED_STATUS O Pin for network status LED 3.5.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-6 Connections of the TERM_ON and RESET pins RESET c HUAWEI Module (Modem) b 2.2 kΩ e 10 nF Application Device (Host） TERM_ON c 10 nF b 2.2 kΩ e 3.5.3 Output Signal Control Pin The MG323 module provides a network status LED pin LED_STATUS. The pulse signal output through this pin controls the status LED on the user interface board to display the network status.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-7 Driving circuit 3.6 UART Interface 3.6.1 Overview The MG323 module provides the UART1 (8-wire UART) interface for one asynchronous communication channel. As the UART1 interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART1 interface.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Pin No. Signal Name Description Feature Direction 33 UART1_TD DCE receive data The DTE transmits serial data. DTE to DCE 38 UART1_RING DCE ring indicator The DCE notifies the DTE of a remote call. DCE to DTE 32 UART1_DTR DCE data terminal ready The DTE is ready. DTE to DCE 34 UART1_RTS DCE request to send The DTE requests the DCE to send data.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-9 The signal through the RING after the MG323 receives an SM When an MG323 Module receives a voice call, a periodical low level signal for 1s and a high level signal for 4s are output by RING, as shown in Figure 3-10 .
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Pin No. Signal Name I/O Description 11 GND - Ground signal of the SIM card 3.7.2 Circuit Recommended for the SIM Card Interface As the MG323 module is not equipped with a SIM card socket, you need to place a SIM card socket on the user interface board. The SIM card signals are transmitted outwards through the 50-pin B2B connector interface. Figure 3-11 shows the circuit of the SIM card interface.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the SIM card socket should be placed near the B2B connector interface (it is recommended that the PCB circuit connecting the B2B connector interface and the SIM card socket not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality.
HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces 33 pF capacitors are added for filtering radio frequency interference. Figure 3-13 External circuit for the microphone interface 33 pF capacitors are added for filtering radio frequency interference. It is recommended that ESD components be added to the external circuit of the audio interface to protect the module. Issue 06 (2013-06-13) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface 4 Antenna Interface 4.1 About This Chapter An RF connector or an antenna pad can be used as the connection method of an antenna interface. When the MG323 module works properly, only one of the preceding connection methods is used. In addition, the antenna interface must be used with coaxial cables with 50 Ω characteristic impedance. 4.
HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface The properties of major materials of the MG323 module are as follows: PCB: FR4 Antenna pad: cheminal nickel-gold pad 4.3 Coaxial Cable and RF Connector The U.FL-R-SMT-1(80) RF connector manufactured by Hirose is used as the antenna interface in the MG323 module. Figure 4-1 shows the RF connector dimensions. Figure 4-1 RF connector dimensions Table 4-1 lists the major specifications of the RF connector.
HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface You can visit http://www.hirose.com for more information about the specifications of the U.FL-R-SMT-1(80) RF connector. It is recommended that you use the Hirose coaxial cable with the RF connector. Figure 4-2 shows the specifications of the coaxial cable working with the RF connector. Figure 4-2 Specifications of the coaxial cable working with the RF connector You can visit http://www.hirose.
HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface 4.4 ESD Protection for the Antenna Interface In practical application, pay attention to the ESD protection for the antenna interface of the MG323 module. Incorrect operation may result in permanent damage to the RF components. Figure 4-4 shows the ESD protection circuit recommended for the antenna interface.
HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface Minimum Value Specification Typical Value Maximum Value Unit GSM 1900 1850 1910 MHz Downlink frequency range GSM 850 869 894 MHz (Base transceiver station to mobile station) E-GSM 900 925 960 MHz GSM 1800 1805 1880 MHz GSM 1900 1930 1990 MHz GSM 850 31 33 35 dBm E-GSM 900 31 33 35 dBm GSM 1800 28 30 32 dBm GSM 1900 28 30 32 dBm Transmission power range Number of carrier frequencies Duplex spacing
HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface 4.6 Specifications of the Antenna Interface Table 4-3 lists the recommended specifications of the antenna interface. Table 4-3 Recommended specifications of the antenna interface Working bands 824 MHz–960 MHz and 1710 MHz–1990 MHz Port impedance 50 Ω Voltage standing wave ratio (VSWR) < 3:1 Maximum gain > 2.
HUAWEI MG323 GSM M2M Module Hardware Guide 5 Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MG323 module, including: Extreme Working Conditions Operating and Storage Temperatures and Humidity Electrical Criteria of Application Interfaces Power Supply Features Reliability Features ESD Features 5.
HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features VI is 2.85 V or 2.8 V, which is the voltage of the digital I/O pin. For the details about VI, please see Table 3-1 . 5.3 Operating and Storage Temperatures and Humidity Table 5-2 lists the operating and storage temperatures and humidity for the MG323 module.
HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Pin No. Signal Name Pin No.
HUAWEI MG323 GSM M2M Module Hardware Guide Function Electrical and Reliability Features Signal Name I/O Waveform and Level Remarks GND Pins 41, 43, 45, 47, and 49 are power GND pins. External VIO power voltage interface P Vomin =2.70 V Votype=2.80 V Vomax=2.95 V Iomax =10.00 mA Pin 40 is a pin for supplying external devices with power from the MG323 module. Ensure that the external peaks and burst do not damage the VIO interface.
HUAWEI MG323 GSM M2M Module Hardware Guide Function Electrical and Reliability Features Signal Name I/O Waveform and Level Remarks SIM_CLK Clock signal of the SIM card O VoHmin=2.03 V VoLmax=0.58 V VSIM P VoHmax=3.00 V Power voltage of the SIM card Votype=2.90 V VoHmin=2.75 V SIM card interface (Class C) GND - SIM_RST O GND of the SIM card VoHmin=1.44 V Reset signal of the SIM card VoLmax=0.36 V SIM_DATA I/O VoHmin=1.26 V Data signal of the SIM card VoLmax=0.3 V VILmax=0.
HUAWEI MG323 GSM M2M Module Hardware Guide Function NC pin Electrical and Reliability Features Signal Name I/O Waveform and Level Remarks INTMIC_N AI Negative end of differential handset MIC input through channel 1 EXTEAR_N AO Negative end of differential speaker output through channel 2 EXTEAR_P AO Positive end of differential speaker output through channel 2 INTEAR_P AO Positive end of differential speaker audio output through channel 1 INTEAR_N AO Negative end of differential speaker
HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Table 5-6 Working current of the MG323 module Working Mode Typical value Unit Remark Power-off mode 50.00 µA VBAT is powered on, yet the module is in power-off state. Sleep mode 1.50 mA MFRMS=2 0.89 mA MFRMS=5 0.85 mA MFRMS=9 50.00 mA MFRMS=5 Idle mode Current in the sleep mode indicates that module enters in the sleep mode (AT+CFUN=0), and the serial port cannot be used.
HUAWEI MG323 GSM M2M Module Hardware Guide Band Electrical and Reliability Features Typical value Unit PCL Configuration 81 mA 10 1 Up/1 Down 123 2 Up/1 Down The typical values are the average of some test samples. 5.6 Reliability Features Table 5-8 lists the test conditions and results of the mechanical reliability of the MG323 module.
HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Condensation test Temperature: –40º ±2°C IEC60068 Time for keeping condensed: 2 h Recovery temperature: 25ºC±2°C Recovery time: 5 min Repetition times: 6 Dust density: 2 kg/m3 Dust test IEC60068 Dust type: dry talcum powder Size requirement: < 75 µm Duration: 8 h Salty fog test Temperature: 35°C IEC60068 Density of the NaCl solution: 5±1% Spraying interval: 8 h Duration of exposing the m
HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Drop test First case: 0.3 m in height. Drop the MG323 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. IEC60068 Second case: 0.8 m in height. Drop the MG323 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. 5.7 ESD Features Pay great attention to ESD protection when using the MG323 module.
HUAWEI MG323 GSM M2M Module Hardware Guide 6 Mechanical Specifications Mechanical Specifications 6.1 Overview This chapter describes the dimensions of the MG323 module, including: Dimensions Dimensions of the B2B Connector MG323 Module Installation Description Specification Selection for Fasteners 6.2 Dimensions Dimensions (L x W x H): 35 mm x 32.5 mm x 3.05 mm Figure 6-1 shows the dimensions. Weight: 5.
HUAWEI MG323 GSM M2M Module Hardware Guide Mechanical Specifications Figure 6-1 Dimensions of the MG323 module (unit: mm) 6.3 Dimensions of the B2B Connector The MG323 module uses the 50-pin B2B connector whose model is DF12C(3.0)50DS-0.5V(81) and whose pin spacing is 0.5 mm to work with the connector DF12E (3.0)-50DP-0.5V (81) of the DF12 series (both connectors are manufactured by Hirose). For specific models, access http://www.hirose.com.
HUAWEI MG323 GSM M2M Module Hardware Guide Mechanical Specifications Figure 6-3 DF12E (manufactured by Hirose) recommended to be used with the MG323 module on the user interface board Table 6-1 Ordered connector model and DF12 product series working with the MG323 module Item Model Stacking Height (mm) HRS Number Connector model used with the MG323 module DF12C(3.0)-50DS0.5V(81) 3.0 537-0694-9-81 Connector model recommended to be used on the user interface board DF12E(3.0)-50DP0.5V(81) 3.
HUAWEI MG323 GSM M2M Module Hardware Guide Mechanical Specifications Figure 6-4 Dimensions of the connector used on the MG323 module (unit: mm) 6.4 MG323 Module Installation Description Three structure fixing holes (diameter: 2 mm) are reserved in the MG323 module. The holes are not sprayed with a coated insulation and connected with the main reference GND of the module, as shown in Figure 6-5 .
HUAWEI MG323 GSM M2M Module Hardware Guide Mechanical Specifications board and functions as a brace and connects the MG323 module and user interface board through the reference GND. Below the user interface board, the nuts are used to fasten the screws. Figure 6-6 shows the MG323 module installation. Figure 6-6 MG323 module installation [1]: Pay great attention to ESD protection when using the MG323 module.
HUAWEI MG323 GSM M2M Module Hardware Guide Mechanical Specifications 6.5 Specification Selection for Fasteners To ensure that the MG323 module is firmly fixed on the interface board when using the MG323 module, you are recommended to you use the M1.6 or M1.8 machine screw. You can also customize the screws. The fastener components in the following figures are recommended. The machine screw dimensions are M1.6×7.5×3.0×1.0. It is recommended that you plate gold on the metal fastener.
HUAWEI MG323 GSM M2M Module Hardware Guide Mechanical Specifications Figure 6-8 Nut dimensions Figure 6-9 Metal fastener dimensions Issue 06 (2013-06-13) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
HUAWEI MG323 GSM M2M Module Hardware Guide 7 Appendix A Circuits of Typical Interfaces Appendix A Circuits of Typical Interfaces Figure 7-1 Circuits of typical interfaces in the MG323 module Ferr ite bea d + 330 pF 100nf VGPIO VGPIO 100 nF 1μ F 22 μ F 220 μ F + 220 μ F + + + 220 μ F 220 μ F 220 μ F 0 1uf VIO VCCB VCCA VIO UART1_DTR_MCU UART1_DTR_MCU A1 B1 UART1_DTR UA R T1_DTR UART1_TD_MCU UART1_TD_MCU A2 B2 UART1_TD UA R T1_TD UART1_RD_MCU UART1_RD_MCU A3 B3 UART1_R
HUAWEI MG323 GSM M2M Module Hardware Guide 8 Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion B2B Board-to-Board CE European Conformity CS Coding Scheme CSD Circuit Switched Data DC Direct Current DCE Data Circuit-terminating Equipment DMA Direct Memory Access DTE Data Terminal Equipment EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union FCC Federal Communications Commission FDD-TDMA Frequ
HUAWEI MG323 GSM M2M Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances RTC Real-time Clock SIM Subscriber Identity Module TTL Transistor-transistor Logic TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver-transmitter VSWR Voltage Standing Wave Ratio Issue
