User Guide Module ： S P E C I F I C A T I O N V 1.3 IEEE 802.11b/g/n/a/ac Wireless+ Bluetooth 2.1/3.0/5.0 With USB2.
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The module provides a complete solution for a high-performance integrated wireless and Bluetooth device. It support 2-stream 802.11ac solutions with Multi-user MIMO (Multiple-Input, Multiple-Output) with Wireless LAN(WLAN) USB2.0 network interface controller. It provides USB2.0 multi-function interface for Wi-Fi and Bluetooth. The module complies with IEEE 802.11 a/b/g/n/ac 2T2R MIMO standard, and Maximum PHY data rate up to 173.3 Mbps using 20 MHz bandwidth, 400 Mbps using 40 MHz bandwidth, and 866.
CCA on secondary through RTS/CTS handshake Supports TCP/UDP/IP checksum offload Two Transmit and Two Receive paths 20MHz/40MHz/80MHz bandwidth transmission Supports 2.4GHz and 5GHz band channels Short Guard Interval(400ns) Sounding packet Compatible with Bluetooth v2.1 Systems Supports Bluetooth 5.
TOPT-8822CUCG01 ： Customer module model QR code ： Wi-Fi MAC QR code 0： Eardatek version 220217 ： production date ( 2022-02-17 ) 000019 ： Production serial number MAC:5477878B043F ： Wi-Fi MAC
Table 1 EWN-8822CUN3GA Wi-Fi RF Parameters Protocol IEEE 802.11b/g/n/a/ac Interface USB 2.0 2.4GHz band CH1~CH11 5GHz Band CH36~CH48/5150-5250MHz CH149~CH165/5725-5850MHz Frequency 2.4G&5G Band Refer to Channel Plan Domain Code Bandwidth 20/40/80 MHz Maximum PHY data rate up to 173.3 Mbps using 20MHz bandwidth; PHY Rate Maximum PHY data rate up to 400 Mbps using 40MHz bandwidth; Maximum PHY data rate up to 866.7 Mbps using 80MHz bandwidth . 802.11b (2.4G 11M): 2.4G Transmit Power 802.11g (2.
5G Receive Sensitivity @ PER<10% 802.11g (5G 6M): 802.11g (5G 54M): -92dBm, typical; -74dBm, typical; 802.11n (5G HT20 MCS0): -90dBm, typical; 802.11n (5G HT20 MCS7): -72dBm, typical; 802.11n (5G HT40 MCS0): -88dBm, typical; 802.11n (5G HT40 MCS7): -69dBm, typical; 802.11ac (5G VHT20 MCS0): -89dBm, typical; 802.11ac (5G VHT20 MCS8): -67dBm, typical; 802.11ac (5G VHT40 MCS0): -87dBm, typical; 802.11ac (5G VHT40 MCS9): -64dBm, typical; 802.11ac (5G VHT80 MCS0): -85dBm, typical; 802.
Table 3 Other Specifications Ambient Operating Temperature Storage Temperature 0℃~+70℃ Module: -20℃~+125℃ Package: -20℃~+70℃ Operating Humidity RH 95%(Non-Condensing) Storage Humidity RH 95%(Non-Condensing) Humidity level Security Other characteristics: Operation System ESD Level 3 WEP 64/128bit,WPA,WPA2,TKIP,AES,WAPI QoS-WMM, WMM-PS Windows XP/Win7/Linux/Android ±4kV(Contact) @ RF Port Table 4 Power Supply Characteristics Symbol Parameter Min. Typical VDD_3.3V 3.3V Supply Voltage 3.0 3.3 3.
PCB Dimension: FIG 2 EWN-8822CUN3GA PCB Stack Up Module Dimension (unit : mm) ：23.0mm ( ±0.3 ) *21.8mm (±0.3 ) *2.5mm ( ±0.
FIG 4 Mainboard PCB Layout
FIG 5 Pin Definition See table 5 for the module hardware pin definition. Table 5 EWN-8822CUN3GA Pin Description Pin Definition Description Power Supply Power level IPEX1 WL0 Wi-Fi Path 0 ANT Port - - IPEX2 WL1 Wi-Fi Path 1 ANT Port - - IPEX3 BT Bluetooth ANT port - - 1 GND Ground - - 2 GND Ground - - Main Power 3.3V 3 4 Main power voltage source input VDD33 ( DC 3.3V±0.3V) 5 USB_D- USB 2.0 Transceiver pair - - 6 USB_D+ USB 2.
1 Pin Definition Description Power Supply Power level 8 RESET Pull Low to Reset , Active Low Main Power 3.3V 9 WL_WAKE_HOST WLAN to wake-up the host Main Power 3.3V 10 GND Ground - - 11 BT_WAKE_HOST Bluetooth to wake-up the host Main Power 3.3V 12 GND Ground - - 13 GND Ground - - 14 GND Ground - - 0 Module Ph otos Table 6 EWN-8822CUN3GA Key material list T y p e M o d e l F o o t p r i n t QTY.
Carrier dimension: ( Unit : mm ) Out of reel Reel dimension ： D=38cm FIG 9 Reel 8 0 0 PCS Modules Per Reel FIG 1 0 Reel figure
The module power supply voltage is DC+3.3V, and the maximum module current is 1000mA. The power supply design needs to consider the output current and power interference. To avoid the +3.3V power supply from interfering with other circuits on the motherboard, it is recommended to supply to the module using the regulator circuit alone. the recommended DC-DC circuit structure shown in the figure below. A 4.7uF~10uF capacitor is connected in parallel at 3_3VD output to filter out the interference.
If using the SMD package, the RF port impedance must be offset after the module is soldered to the motherboard. In order to achieve the best performance,, it is recommended to add a PI-type matching network to the motherboard, as shown below (C11, R21,C6). The value of the PI type matching network needs to be debugged according to the actual motherboard to match RF port impedance to 50 Ohm. FIG 12 Connect 50 Ohm matching antenna reference circuit The antenna ANT1 in the figure above must be 50 Ohm.
3. The PI-type matching circuit for adjusting the impedance of the module is placed close to the module. The PI type matching circuit for matching the antenna is placed close to the antenna. FIG 14 The PI type matching circuit Layout FIG 15 The RF line Layout Motherboard interference comes from: high- speed data interface ( HDMI), the Operating frequency of main chip, DDR, DC-DC power supply. The method of avoiding interference according to the characteristics of various signals is also different.
2. Adding shields to avoid interference leakage; 3. Reasonable layout to eliminate interference. When HDMI uses the 74.2MHz frequency, its 33x frequency is in the 2.4G band of Wi-Fi, which will seriously interfere with the Wi-Fi signal. If the HDMI frequency is 148.5MHz, although the 16x frequency is not in the Wi-Fi band, the isolation of the frequency is not good, and the Wi-Fi signal will be interfered to some extent.
Because the main chips operate at about 800MHz or DDR2 operate at 667MHz, 3x frequency of 800MHz and 4x frequency of 667MHz are near 2.4GHz band. It must to place Wi-Fi modules and antennas far away from the main chip and DDR. It is strongly recommended that the main chip be isolated from the DDR by a shield. As shown in the figure below.
The number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of the module shall be no less than 1/4. The lead-free reflux curve requirements of Wi-Fi module products are shown in figure18 ： FIG 18 Furnace temperature curve NOTE: 1.The maximum furnace temperature of the module is 260℃, don't exceed this temperature. 2.The gold plating thickness of the module pad is 2u".
Appendix Notices FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
