Specification Sheet

DESCRIPTION
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX424C12PB3/8
8GB 1G x 64-Bit
DDR4-2400 CL12 288-Pin DIMM
Continued >>
FEATURES
HyperX HX424C12PB3/8 is a 1G x 64-bit (8GB) DDR4-2400
CL12 SDRAM (Synchronous DRAM) 1Rx8, memory module,
based on eight 1G x 8-bit FBGA components per module. Each
module supports Intel® Extreme Memory Profiles (Intel®
XMP) 2.0. Each module has been tested to run at DDR4-2400
at a low latency timing of 12-14-14 at 1.35V. The SPDs are
programmed to JEDEC standard latency DDR4-2400
timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold
contact fingers. The JEDEC standard electrical and
mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
17 cycles
45.75ns(min.)
350ns(min.)
32ns(min.)
TBD W*
94 V - 0
0
o
C to +85
o
C
-55
o
C to +100
o
C
XMP TIMING PARAMETERS
•
JEDEC: DDR4-2400 CL17-17-17 @1.2V
•XMP Profile #1: DDR4-2400 CL12-14-14 @1.35V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.25V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.661” (42.20mm)
Document No. 4808000-001.A00 06/09/17 Page 1
hyperxgaming.com
HX424C12PB3/
8
8G
B 1
G
x
6
4-Bi
t
DDR4 2400
CL
12 288 Pin DIMM
Memory Module Specifications