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IBM High IOPS Modular Adapters 1

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IBM High IOPS Modular Adapters

IBM Redbooks Product Guide

The new family of IBM® High IOPS Modular Adapters is the ultimate performance solution for embedded

direct-attached storage for IBM System x®, IBM BladeCenter®, and IBM Flex System™. The offerings

include 300 GB, 600 GB, and 800 GB Multi Level Cell (MLC) adapters and a 300 GB Single Level Cell

(SLC) adapter. Designed to offer high performance with low latency and a low CPU burden, these

adapters can improve the performance of applications regardless of the mix of reads and writes.

The IBM High IOPS Modular Adapters are built on the latest enterprise-level solid-state technologies and

include sophisticated advanced features to help deliver consistently high levels of performance,

endurance, and reliability under some of the most demanding conditions. The robust technology in these

adapters helps optimize the number of program cycles to the flash storage, efficiently extending the rated

endurance of flash storage.

The following figure shows an IBM High IOPS Modular Adapter.

Figure 1. IBM High IOPS Modular Adapter with the low profile bracket

Did you know

The IBM High IOPS Modular Adapters can be fully re-written up to 20 times per day (eMLC) or up to 140

times per day (SLC) throughout their entire five-year life time expectancy.

Providing additional peace of mind, these adapters are covered under IBM warranty. They carry a 1-year

limited warranty, or when installed in a supported IBM server, these adapters assume your system's base

warranty.

Summary of content (10 pages)

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򔻐򗗠򙳰 ® IBM High IOPS Modular Adapters IBM Redbooks Product Guide The new family of IBM® High IOPS Modular Adapters is the ultimate performance solution for embedded direct-attached storage for IBM System x®, IBM BladeCenter®, and IBM Flex System™. The offerings include 300 GB, 600 GB, and 800 GB Multi Level Cell (MLC) adapters and a 300 GB Single Level Cell (SLC) adapter.
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Part number information Table 1 lists the information for ordering part numbers and feature codes. Table 1.
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Features The IBM High IOPS Modular Adapters use NAND flash memory as the basic building block of solid-state storage and contain no moving parts, thus are less sensitive to issues associated with vibration, noise, and mechanical failure. These adapters are built as block devices on a PCIe bus with advanced wear-leveling, ECC, and chip-level redundancy providing unparalleled reliability and efficiency.
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Technical specifications The following table presents the technical specifications for the IBM High IOPS Modular Adapters. Table 2. IBM High IOPS Modular Adapter technical specifications Specification 300 GB eMLC 600 GB eMLC 800 GB eMLC 300 GB SLC Part number 90Y4361 90Y4365 90Y4369 90Y4373 Interface PCIe 2.0 x8 (x8-wired) PCIe 2.0 x8 (x8-wired) PCIe 2.0 x8 (x8-wired) PCIe 2.
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Supported servers The IBM High IOPS Modular Adapters can be installed in the System x and IBM iDataPlex® servers identified in Table 3 and the BladeCenter and Flex System servers identified in Table 4. Table 3.
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Table 4.
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Physical specifications The IBM High IOPS Modular Adapters have the following physical specifications: Dimensions and weight (approximate):     Height: 16 mm (0.6 in.) Width: 68 mm (2.7 in.) Depth: 168 mm (6.6 in.) Weight: 227 g (0.5 lb) Shipping dimensions and weight (approximate):     Height: 114 mm (4.5 in.) Width: 241 mm (9.5 in.) Depth: 318 mm (12.5 in.) Weight: 648 g (1.
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Related publications For more information, see the following documents:  IBM US Announcement Letter for the IBM High IOPS Modular Adapters: http://ibm.com/common/ssi/cgi-bin/ssialias?infotype=dd&subtype=ca&&htmlfid=897/ENUS112-213  IBM System x Configuration and Options Guide: http://www.ibm.com/support/docview.wss?uid=psg1SCOD-3ZVQ5W  IBM ServerProven: http://ibm.
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Notices This information was developed for products and services offered in the U.S.A. IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used.
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This document was created or updated on November 20, 2012. Send us your comments in one of the following ways: Use the online Contact us review form found at: ibm.com/redbooks  Send your comments in an e-mail to: redbook@us.ibm.com  Mail your comments to: IBM Corporation, International Technical Support Organization Dept. HYTD Mail Station P099 2455 South Road Poughkeepsie, NY 12601-5400 U.S.A.  This document is available online at http://www.ibm.com/redbooks/abstracts/tips0937.html .