Datasheet

IBM High IOPS Modular Adapters 7
Physical specifications
The IBM High IOPS Modular Adapters have the following physical specifications:
Dimensions and weight (approximate):
Height: 16 mm (0.6 in.)
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Width: 68 mm (2.7 in.)
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Depth: 168 mm (6.6 in.)
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Weight: 227 g (0.5 lb)
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Shipping dimensions and weight (approximate):
Height: 114 mm (4.5 in.)
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Width: 241 mm (9.5 in.)
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Depth: 318 mm (12.5 in.)
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Weight: 648 g (1.4 lb)
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Operating environment
The IBM High IOPS Modular Adapters are supported in the following environment:
Temperature (operational): 5 - 40 °C (41 - 104 °F) at 0 - 3,048 m (0 - 10,000 ft)
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Temperature (non-operational): -40 - 60 °C (-40 - 140 °F) at 0 - 10,700 m (0 - 35,105 ft)
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Relative humidity: 8 - 85% (non-condensing)
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Maximum altitude (operational): 3,048 m (10,000 ft)
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Agency approvals
The IBM High IOPS Modular Adapters have the following agency approvals:
UL
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cUL
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IEC60950
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EMC
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FCC
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TUV
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VDE
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CE
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VCCI
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BSMI
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C-tick
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MIC
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KCC
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