HT2 MOA3 S20 TM HITAG 2 Chip Module Preliminary Specification Revision 1.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Table of Contents 1 Definitions .............................................................................................................................. 3 1.1 Objective of the Specifications ..................................................................................................................... 3 1.2 Definition of the Chip Module .......................................................................................................
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 1 Definitions 1.1 Objective of the Specifications This specification lists the parameters to be fulfilled by the HITAG 2 chip module HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs). 1.2 Definition of the Chip Module A chip module is an electronically packaged chip covered with a globe top cap. The HT2 MOA3 S20 is above all used as card module, i.e.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 2 Specifications 2.1 Mechanical Properties Width 7.55 mm (Proposed Punching Outline) Length 11.75 mm (Proposed Punching Outline) Overall Thickness 0.45 mm ± 0.03 mm Film Thickness 0.16 mm ± 0.005 mm Bondpad Size for Transponder Coil / Module Interconnection 1.9 x 3.5 mm see also drawing in chapter 3 Suitable for Welding/Soldering/ Conductive Gluing 2.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 2.4 Storage Conditions Temperature 15 - 30 °C Relative Humidity 40 - 70 % Duration 1 year 2.5 Delivery Conditions Delivery Identification Date of ready for shipment, reel numbers, total quantity of good modules with the detail of good modules per reel, order number, product type, no supplier identification on reels, bags and boxes. Types of Delivery Chip modules on reel approx. 15.000 to 20.000 pcs.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 2.6 Electrical Specifications Symbol min Junction Temperature TJ -55°C Input Peak Current IINpeak typ max Comment / Conditions Absolute Maximum Ratings 140°C 30 mA Latch up Current 100 mA MIL-STD 883D, Method 3023 ESD 2 kV MIL-STD 883D, Method 3015.
Specifications of the HT2 MOA3 S20 Rev. 1.1 3 Drawing of the Chip Module HT2 MOA3 S20 3.1 Drawing of the Reel Ht2moa3.
Specifications of the HT2 MOA3 S20 Rev. 1.1 3.2 Module outline suggestion Ht2moa3.
Specifications of the HT2 MOA3 S20 Rev. 1.1 3.3 Splicing Specification Ht2moa3.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 4 Coil Specifications The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described in the following. Equivalent circuit of the transponder Xpc Rpc Cp Cchip Uc Rchip Uc ... voltage at the connection pads fres ... resonant frequency of the transponder Xpc ... parallel reactance of the coil (f = 125 kHz) Rpc ... parallel resistance of the coil (f = 125 kHz) Cp ...
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used. It is assumed that the winding is done in circular form. N = N L U d u L 1 ,8 5 2 U ln ( u ) d ... number of windings ... inductance [nH] ... average coil circumference [cm] ... copper diameter [mm] ... average coil circumference [mm] For fine tuning a measurement of the inductance and an according adjustment of the number of windings is necessary.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5 Functional Description of HITAG 2 5.1 Memory Organization The memory of the transponder consists of 256 bits EEPROM memory and is organized in 8 pages with 32 bits each. Depending on the operation mode the EEPROM is organized as described in the following.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.2 Operation Modes and Configuration With the Configuration Byte the operation mode and the access rights to the memory can be selected. During Power-Up of the transponder the Configuration Byte is read from the transponder’s EEPROM.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.2.2 Status Flow After entering the RF-field the transponder waits for a command to start the authentication. After issuing this command the mutual authentication takes place, followed by read- and write commands. In password mode the data transfer occurs plain, in crypto mode data are encrypted. The halt mode can be entered for muting a transponder.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.2.3 Configuration The Configuration Byte is represented by the first 8 bits of Page 3 of the transponder memory.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Standard values for the Configuration Byte: Password Mode: Crypto Mode: Public Mode A: Public Mode B: Public Mode C: 0x06 0x0E 0x02 0x00 0x04 5.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 5.4 Definition of Passwords and Keys Keys are cryptographic codes, which determine data encryption during data transfer between read/write device and transponder. They are used to select a HITAG 2 transponder in Crypto Mode. The 16 bit KEY HIGH and 32 bit KEY LOW form one 48 bit key which has to be identical on both the transponder and the read/write device. Passwords are needed to select a HITAG 2 transponder in Password Mode.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 6 Quality Inspection Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with AQL1.0.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 7 Characterisation and Test of the Final Transponder 7.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 8 Ordering Information Type Name Description Ordering Number HT2 MOA3 S20/E/3 HITAG 2 S20 Chip Module, reel 9352 600 62118 HT2 MOA3 S20/E/1 HITAG 2 S20 Chip Module, bulk 9352 602 19122 Ht2moa3.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Definitions Data sheet status Objective specification This data sheet conta ins ta rget o r goal spec ifications for product deve lopment. Preliminary specification This data sheet conta ins p reliminary data; supp lementary data may be pub lished later. Product spec ification This data sheet conta ins final product spec ifications. Limiting values Limiting va lues g iven are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).
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