ICE Module ICE Module Carrier Board Design Guide Page i
ICE Module Revision Date Version Changes 2008-09 1.
ICE Module Copyright COPYRIGHT NOTICE The information in this document is subject to change without prior notice in order to improve reliability, design and function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.
ICE Module Table of Contents 1 INTRODUCTION.....................................................................................................1 1.1 INTRODUCTION .....................................................................................................2 1.2 ACRONYMS AND ABBREVIATIONS DEFINITION .....................................................2 1.3 REFERENCE DOCUMENTS ......................................................................................4 2 ICE MODULE OVERVIEW ..............
ICE Module 4.2 PCI EXPRESS ......................................................................................................38 4.2.1 Signal Description ......................................................................................39 4.2.2 PCI Express Slot X1....................................................................................40 4.2.3 Express Card Connector.............................................................................40 4.2.4 PCIe Mini Card..........................
ICE Module 4.8.1 Audio Routing Guideline.............................................................................65 4.8.1.1 Analog Power Delivery........................................................................65 4.8.1.2 Digital and Analog Signals Isolation ...................................................66 4.8.1.3 EMI Consideration...............................................................................66 4.9 IDE...........................................................................
ICE Module 4.14 MISCELLANEOUS ..............................................................................................82 4.14.1 Signal Description ....................................................................................82 4.14.2 Speaker/FAN Control/RTC Reference .......................................................84 4.14.2.1 Speaker Out........................................................................................84 4.14.2.2 FAN Control..........................................
ICE Module B.1 TERMINOLOGY ................................................................................................. 117 B.2 UPDATING BIOS VERSION ............................................................................... 117 B.2.1 Using AFUWIN......................................................................................... 118 6.7.2 Using DOS Command...............................................................................121 A.1 RTC OVERVIEW ......................................
ICE Module List of Figures Figure 2-1: ICE Module Application ..............................................................................................6 Figure 2-2: ICE-9152-R10 ...............................................................................................................8 Figure 2-3: ICE-9102-1GZ-R10 .....................................................................................................10 Figure 2-4: ICE-9102-1G512-R10 ...................................................
ICE Module Figure 4-27: LCD Power Sequence Example(Refer to AUO G150XG01).................................63 Figure 4-28: Audio Analog Power Example ...............................................................................66 Figure 4-29: IDE Reference Design.............................................................................................67 Figure 4-30: CF Connector ..........................................................................................................
ICE Module Figure 6-13: BIOS Main Menu (BIOS Version: MR10) ............................................................ 118 Figure 6-14: AFUWIN – Open BIOS File................................................................................... 118 Figure 6-15: Locate BIOS File................................................................................................... 119 Figure 6-16: Check Program All Block ....................................................................................
ICE Module List of Tables Table 1-1: Conventions and Terminology....................................................................................2 Table 1-2: Reference Documents..................................................................................................4 Table 2-1: IEI ICE Modules.............................................................................................................7 Table 2-2: ICE-9152-R10 Specification ........................................................
ICE Module Table 4-21: LAN Impedance Consideration ...............................................................................73 Table 4-22: LPC Interface Signal Descriptions..........................................................................75 Table 4-23: VGA signals description ..........................................................................................79 Table 4-24: Miscellaneous pin assignment................................................................................
ICE Module Chapter 1 1 Introduction Page 1
ICE Module 1.1 Introduction This design guide describes the design concept of the IEI COM Express module and how to teach customers to develop their own COM Express baseboard. IEI COM Express module is compatible with all baseboards compliant with COM Express specification. 1.2 Acronyms and Abbreviations Definition Table 1-1 defines the acronyms, conventions, and terminology that are used throughout the design guide.
ICE Module I2C Inter-IC (a two wire serial bus created by Philips) LCD Liquid Crystal Display LFP Local Flat Panel LVDS Low Voltage Differential Signaling: A high speed, low power data transmission standard used for display connections to LCD panels. NTSC National Television Standards Committee PAL Phase Alternate Line PCI Peripheral Component Interface RTC Real Time Clock SMBus System Management Bus.
ICE Module 1.3 Reference Documents Table 1-2 lists all the reference documents of this design guide. Table 1-2: Reference Documents Document Location PICMGR COM Express Module™ Base Specification http://www.picmg.org/ I2C Bus Interface http://www.semiconductors.philips.com/ PCI Local Bus Specification, Revision 2.3 http://www.pcisig.com/ Serial ATA Specification, Revision 1.0a http://www.serialata.org/ PC104 http://www.pc104.org/technology/pc104_tech.html SMBus http://www.smbus.
ICE Module Chapter 2 2 ICE Module Overview Page 5
ICE Module 2.1 Chapter Overview ICE modules have various options for users to choose. IEI provides high-end, mid-range and low-end CPU modules. Using the ICE module can overcome the problems that may be caused by designing a compatible and stable module. IEI also provides the service of deigning COM Express baseboard.
ICE Module 2.2 ICE Specifications IEI provides many kinds of ICE modules for customers, including BGA type and socket type. Table 2-1 lists the IEI ICE modules and the specifications. Table 2-1: IEI ICE Modules ICE 910/915 Series Description ICE-9152-R10 COM Express Basic Type 2 Module, Socket 479 Intel® Pentium M CPU, VGA/LVDS, LAN, CF, SATA, USB 2.0 and Audio COM Express Basic Type 2 Module with Intel® ICE-9102-1GZ-R10 Celeron® M 1G zero cache CPU, VGA/LVDS, LAN, CF, SATA, USB 2.
ICE Module 2.2.1 ICE-9152-R10 The ICE-9152 is shown in Figure 2-2 and the specifications are list in Table 2-2. Figure 2-2: ICE-9152-R10 Table 2-2: ICE-9152-R10 Specification Item CPU System Memory System Chipset BIOS WatchDog Timer Expansion Interface MIO USB Page 8 Description Socket 479 Intel® Pentium® M, Celeron® M processor with a 533/400MHz FSB One 200-pin 533/400MHz DDR2 SDRAM SO-DIMM supported (system max.
ICE Module Audio Ethernet CRT Display mode LCD Display mode Dimensions (L x W) Power Supply Voltage Operating Temperature Operating Humidity AC’97 Audio Signal to Base Board (Audio Codec on Base Board) One Intel® 82541PI GbE Chipset (co-layout Intel® 82551ER 10/100Mbps Ethernet chipset) Signal to Base Board VGA Integrated in Intel 915GME Signal (Signal to Base Board) 18/24-bit Dual channel LVDS Signal (to Base Board) 125 mm x 95 mm ATX / AT supported 0 ~ 60˚ C (32 ~ 140˚ F) 0% ~ 90% relative humidity, non-
ICE Module 2.2.2 ICE-9102-1GZ-R10 The ICE-9102-1GZ is shown in Figure 2-3 and the specifications are listed in Table 2-3. Figure 2-3: ICE-9102-1GZ-R10 Table 2-3: ICE-9102-1GZ-R10 Specification Item CPU System Memory System Chipset BIOS WatchDog Timer Expansion Interface MIO USB Audio Ethernet Page 10 Description On board Intel® Celeron® M 1GHz zero cache processor One 200-pin 400MHz DDR2 SDRAM SO-DIMM supported (system max.
ICE Module CRT Display mode LCD Display mode Dimensions (L x W) Power Supply Voltage Operating Temperature Operating Humidity Singal to Base Board VGA Integrated in Intel 910GMLE Signal (Signal to Base Board) 18/24-bit Dual channel LVDS Signal (Signal to Base Board) 125 mm x 95 mm ATX / AT supported 0 ~ 60˚ C (32 ~ 140˚ F) 0% ~ 90% relative humidity, non-condensing Page 11
ICE Module 2.2.3 ICE-9102-1G512-R10 The ICE-9152-1G512 is shown in Figure 2-4 and the specifications are listed in Table 2-4. Figure 2-4: ICE-9102-1G512-R10 Table 2-4: ICE-9102-1G512-R10 Specification Item CPU System Memory System Chipset BIOS WatchDog Timer Expansion Interface MIO USB Audio Page 12 Description On board Intel® Celeron® M 1GHz 512KB cache processor One 200-pin 400MHz DDR2 SDRAM SO-DIMM supported (system max.
ICE Module Ethernet CRT Display mode LCD Display mode Dimensions (L x W) Power Supply Voltage Operating Temperature Operating Humidity Base Board) One Intel® 82541PI GbE Chipset (co-layout Intel® 82551ER 10/100Mbps Ethernet chipset) Signal to Base Board VGA Integrated in Intel 910GMLE Signal (Signal to Base Board) 18/24-bit Dual channel LVDS Signal (Signal to Base Board) 125 mm x 95 mm ATX / AT supported 0 ~ 60˚ C (32 ~ 140˚ F) 0% ~ 90% relative humidity, non-condensing Page 13
ICE Module 2.2.4 ICE-ATOM-R10 The ICE-ATOM is shown in Figure 2-5 and the specifications are listed in Table 2-5. Figure 2-5: ICE-ATOM-R10 Table 2-5: ICE-ATOM-R10 Specification Item CPU System Memory System Chipset BIOS WatchDog Timer Audio MIO USB Ethernet Display Page 14 Description Intel Diamondville-SC support at FSB 533Mhz 1x DDR2 SO-DIMM 400/533MHz support up to 2GB Intel 945GSE + ICH7M AMI BIOS Sofware Programmable support 1~255 sec.
ICE Module Dimensions (L x W) Power Supply Voltage Operating Temperature Operating Humidity to Base Board) 18-bits Dual Channel LVDS Signal (Signal to Base Board) HDTV-out (Signal to Base Board) 1 x SDVO Interface (Only SDVO Port_B) 125 mm x 95 mm AT/ATX support 0 ~ 60° C (32 ~ 140° F) 0% ~ 90% relative humidity, non-condensing system Page 15
ICE Module 2.2.5 ICE-GM45A-R10 The ICE-GM45A is shown in Error! Reference source not found. and the specifications are listed in Table 2-6. Table 2-6: ICE-GM45A-R10 Specification Item CPU System Memory System Chipset BIOS WatchDog Timer Audio MIO Description Socket P Intel® mobile Core™ 2 Duo(Penryn), Intel® Celeron® M 2 x 200-pins 1066/800MHz DDR2 SDRAM SO-DIMM Supported Intel® GM45 + Intel® ICH9M AMI BIOS Software programmable supports 1 ~255 sec.
ICE Module 2.2.6 ICE-DB-9S-R10 The ICE-DB-9S is a full function carrier board for customers to apply or test the COM Express module. The carrier board can be used for any combination, including software and hardware. Using the carrier board to develop and test the ICE module also can achieve a quicker time to market. The ICE-DB-9S is shown in Figure 2-6 and the specifications are listed in Table 2-7.
ICE Module Ethernet Display Dimensions (L x W) Power Supply Voltage Operating Temperature Operating Humidity Page 18 1 x ISA 1 x IDE 2/4 x SATA/SATA II 1 x CF type II Slot 6 x USB 2.0 1 x LPT 1 x FDD 5 x RS-232 1 x RS-232/422/485 2 x USB 2.0 to PCIe Mini card Slot & Express Card Slot 1 x RJ-45 GbE connector VGA DB15 connector 1 x 18/24 bit dual channel LVDS Connector 1 x Inverter connector 1 x TV-out interface 304.8 mm x 190.5 mm ( 12" x 7.
ICE Module 2.
ICE Module Chapter 3 3 Pin Assignments Page 20
ICE Module 3.1 Chapter Overview This chapter describes pin assignments and I/O characteristics for COM Express modules. The carrier board uses two 220-pin 0.5 mm fine pitch board-to-board connectors. There are five different pin-out types currently defined by the COM Express Specification. The preferred choice of the embedded computer industry is the Type 2 pin-out and therefore the leading manufacturers have chosen to produce COM Express Type 2 modules.
ICE Module 3.2 Type 1, Type 2, Type 3, Type 4 and Type 5 The differences among the Module Types are summarized in Table 3-1. Module Type 1 supports a single connector with two rows of pins (220 pins total). Module Types 2-5 support two connectors with four rows of pins (440 pins total). Connector placement and most mounting holes have transparency between Form Factors.
ICE Module 3.3 Signal Table Terminology The following section describes the signals found on COM Express Type 2 connectors. Most of the signals listed in the following sections also apply to other COM Express module types. The pinout for connector rows A and B remains the same regardless of the module type but the pinout for connector rows D and C are dependent on the module type. Refer to the COM Express specification for information about the different pin-outs of the module types other than Type 2.
ICE Module 3.
ICE Module A51 A52 A53 A54 A55 A56 A57 A58 A59 A60 A61 A62 A63 A64 A65 A66 A67 A68 A69 A70 A71 A72 A73 A74 A75 A76 A77 A78 A79 A80 A81 A82 A83 A84 A85 A86 A87 A88 A89 A90 A91 A92 A93 A94 A95 A96 A97 A98 A99 A100 A101 A102 A103 A104 A105 A106 GND PCIE_TX5+ PCIE_TX5GPI0 PCIE_TX4+ PCIE_TX4GND PCIE_TX3+ PCIE_TX3GND PCIE_TX2+ PCIE_TX2GPI1 PCIE_TX1+ PCIE_TX1GND GPI2 PCIE_TX0+ PCIE_TX0GND LVDS_A0+ LVDS_A0LVDS_A1+ LVDS_A1LVDS_A2+ LVDS_A2LVDS_VDD_EN LVDS_A3+ LVDS_A3GND LVDS_A_CK+ LVDS_A_CKLVDS_I2C_CK LVDS_I2C_DAT G
ICE Module A107 A108 A109 A110 +V12 +V12 +V12 GND PWR PWR PWR GND - B107 B108 B109 B110 +V12 +V12 +V12 GND PWR PWR PWR GND - Signal GND IDE_D5 IDE_D10 IDE_D11 IDE_D12 IDE_D4 IDE_D0 IDE_REQ IDE_IOW# IDE_ACK# GND IDE_IRQ IDE_A0 IDE_A1 IDE_A2 IDE_CS1# IDE_CS3# IDE_RESET# PCI_GNT3# PCI_REQ3# GND PCI_AD1 PCI_AD3 PCI_AD5 PCI_AD7 PCI_C/BE0# PCI_AD9 PCI_AD11 PCI_AD13 PCI_AD15 GND PCI_PAR PCI_SERR# PCI_STOP# PCI_TRDY# PCI_FRAME# PCI_AD16 PCI_AD18 PCI_AD20 PCI_AD22 GND PCI_AD24 PCI_AD26 PCI_AD28 PCI_AD30 I/F
ICE Module C46 C47 C48 C49 C50 C51 C52 C53 C54 C55 C56 C57 C58 C59 C60 C61 C62 C63 C64 C65 C66 C67 C68 C69 C70 C71 C72 C73 C74 C75 C76 C77 C78 C79 C80 C81 C82 C83 C84 C85 C86 C87 C88 C89 C90 C91 C92 C93 C94 C95 C96 C97 C98 C99 C100 C101 PCI_AD27 PCI_AD29 PCI_AD31 PCI_IRQA# PCI_IRQB# GND PEG_RX0+ PEG_RX0TYPE0# PEG_RX1+ PEG_RX1TYPE1# PEG_RX2+ PEG_RX2GND PEG_RX3+ PEG_RX3RSVD RSVD PEG_RX4+ PEG_RX4FAN_PWMOUT PEG_RX5+ PEG_RX5GND PEG_RX6+ PEG_RX6SDVO_DATA PEG_RX7+ PEG_RX7GND FAN_TACHOIN PEG_RX8+ PEG_RX8GND PEG_RX
ICE Module C102 C103 C104 C105 C106 C107 C108 C109 C110 PEG_RX15GND +V12 +V12 +V12 +V12 +V12 +V12 GND Page 28 PEG GND PWR PWR PWR PWR PWR PWR GND I - D102 D103 D104 D105 D106 D107 D108 D109 D110 PEG_TX15GND +V12 +V12 +V12 +V12 +V12 +V12 GND PEG GND PWR PWR PWR PWR PWR PWR GND O -
ICE Module Chapter 4 4 Signal Description and Routing Guideline Page 29
ICE Module 4.1 PEG (PCI Express Graphic) The PEG Port can utilize COM Express PCIe lanes 16-32 and is suitable to drive a x16 link for an external high-performance PCI Express Graphics card, if implemented on the COM Express module. It supports a theoretical bandwidth of up to 4 GB/s – twice the peak bandwidth achievable with AGP 8x.
ICE Module D75 C78 C79 D78 D79 C81 C82 D81 D82 C85 C86 D85 D86 C88 C89 D88 D89 C91 C92 D91 D92 C94 C95 D94 D95 C98 C99 D98 D99 C101 C102 D101 D102 A88 A98 D73 C73 PEG_TX7PEG_RX8+ PEG_RX8PEG_TX8+ PEG_TX8PEG_RX9+ PEG_RX9PEG_TX9+ PEG_TX9PEG_RX10+ PEG_RX10PEG_TX10+ PEG_TX10PEG_RX11+ PEG_RX11PEG_TX11+ PEG_TX11PEG_RX12+ PEG_RX12PEG_TX12+ PEG_TX12PEG_RX13+ PEG_RX13PEG_TX13+ PEG_TX13PEG_RX14+ PEG_RX14PEG_TX14+ PEG_TX14PEG_RX15+ PEG_RX15PEG_TX15+ PEG_TX15PCIE_CLK_REF + PCIE_CLK_REFSDVO_I2C_CLK D54 SDVO_I2C_DAT A
ICE Module 4.1.2 PEG Connector Figure 4-1 illustrates the pinout definition for the standard PCI Express x16 connectors. +V3.3 +V12 +V12 +V3.
ICE Module 4.1.3 SDVO The Serial Digital Video Out (SDVO) display ports are multiplexed over a subset of the External Graphics Interface using PCI Express. Users can choose a manufacturer approved by Intel® to convert the SDVO port to TV, LVDS, DVI or CRT connection. IEI also provides cables and SDVO card for customer to use.
ICE Module CH7021A Chrontel SDTV / HDTV Transmitter http://www.chrontel.com CH7308A Chrontel LVDS Transmitter http://www.chrontel.com CH7307C Chrontel DVI Transmitter http://www.chrontel.com CH7312 Chrontel DVI Transmitter http://www.chrontel.com CX25905 Conexant DVI-D / TV / CRT Transmitter http://www.conexant.com SiL1362/1364 Silicon Image DVI Transmitter http://www.siliconimage.com SiL 1390 Silicon Image HDMI Transmitter http://www.siliconimage.com 4.1.
ICE Module be as small as possible, preferably 0402. To enable the test mode, a 50 Ω ±1% resistor stuffing option is needed to break the path. This will force the transmitter port to enter the compliance mode and begin transmitting the compliance packet. Otherwise, use a 0-Ω resistor to continue the trace route to the Rx port. This will allow normal operation of the device. Figure 4-2: Intel Recommend Test Structure for PCI Express Data Eye Measurement 4.1.6 PCI Express Routing Guideline 4.1.6.
ICE Module high-speed periodic signals Spacing between differential pairs and low-speed non periodic signals Length matching between differential pairs (intra-pair) Length matching between RX and TX pairs (inter-pair) Length matching between reference clock differential pairs REFCLK+ and REFCLK(intra-pair) Length matching between reference clock pairs (inter-pair) Reference plain Spacing from edge of plane Via Usage AC coupling capacitors Min. 20mils Max. 5mils No strict electrical requirements.
ICE Module PEG SLOT or SDVO Device TX+ TX- ICE Module AC Coupling Cap RX+ RX- Figure 4-3: PEG Lane Connection Topology Example 4.1.6.3 Routing Notices Each signal and its complement in a differential pair should be length matched whenever possible on a segment-by-segment basis at the point of discontinuity. Examples of segments might include breakout areas, routes to connect vias, routes to connect an AC coupling capacitor, routes to connect a connector, and so forth.
ICE Module Preferred Routing Alternative Routing Bad Routing Preferred Routing Preferred Routing Figure 4-4: PEG Layout Trace Example 4.2 PCI Express PCI Express provides a scalable, high-speed, serial I/O point-to-point bus connection. A PCI Express lane consists of dual simplex channels, each implemented as a low-voltage differentially driven transmit pair and receive pair. They are used for simultaneous transmission in each direction.
ICE Module The PCI Express interface of the COM Express Type 2 module consists of up to 6 lanes, each with a receive and transmit differential signal pair designated from PCIE_RX0 (+ and -) to PCIE_RX5 (+ and -) and correspondingly from PCIE_TX0 (+ and -) to PCIE_TX5 (+ and -). According to the PCI Express specification, these six lanes can be configured as several PCI Express x1 links or to a combined x4 link plus two x1 links.
ICE Module 4.2.2 PCI Express Slot X1 Table 4-5 illustrates the pinout definition for the standard x1, x4, x8 and x16 PCI Express connectors. The dashed lines in the diagram depict where each different connector type ends. An example of an x1 PCIe slot is shown in Figure 4-5 below. +V3.3 +V12 +V12 +V3.
ICE Module R350 +V3.3 C26 3,6,10,11,14,20 CB_RESET# +V3.3 +V3.3 10K_4 1 10K_4 1 +V3.3_ExpressCard +V3.3_ExpressCard +V3.3 +V3.3_DUAL +V1.5 10U_8_X_6V3 1 2 3 4 5 6 7 8 9 10 2 R73 2 R74 PERST# U3 TPS2231 SY SRST# SHDN# STBY # 3.3VIN1 3.3VIN2 3.3VOUT1 3.3VOUT2 PERST# NC GND OC# RCLKEN AUXIN AUXOUT 1.5VIN2 1.5VIN1 1.5VOUT2 1.5VOUT1 CPPE# CPUSB# 470_6 R360 1 1 TP41 TP42 C LEDRED_8_2 C27 0.1U_4_Y _16V +V3.3SB_ExpressCard +V1.5_ExpressCard +V1.5_ExpressCard CPPE# CPUSB# TPS2231 +V1.
ICE Module 23 24 25 26 GND PETn0 PETp0 GND P I/O PCIe I/O PCIe P Ground PCI Express Transmitter differential pair negative signal PCI Express Transmitter differential pair positive signal Ground The PCMCIA Consortium defines two form factors for Express Cards: Express Card/34 and Express Card/54 use a socket-style interconnect. There are two mechanical Form Factors with Express Card/34, which are useable in either socket. Each has the same electrical interface.
ICE Module Figure 4-8: Express Card 54 & 34 Plug Way (Refer to www.expresscard.org) 4.2.4 PCIe Mini Card The PCI Express Mini Card add-in card is a small size unique form factor optimized for mobile computing platforms equipped with communication applications such as Wireless LAN. A small footprint connector can be implemented on the carrier board providing the ability to insert different removable PCI Express Mini Cards.
ICE Module CN1 3 3 1 1 TP96 3 TP97 3 PCIE_RX3+ PCIE_RX3- 4 CLK33M_MINICARD 3,6,10,11,14,20 CB_RESET# 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 PCIE_TX3+ PCIE_TX30_4 2 0_4 2 1 R122 1 R123 0_4 2 0_4 2 1 R70 1 R72 4 CLK100M_PCIEx1_SLOT4+ 4 CLK100M_PCIEx1_SLOT4TP40 3,6,10,16 PCIE_WAKE_UP# 1 PCIE_WAKE_UP# 15 13 11 9 7 5 3 1 +V3.
ICE Module 5 3 1 Reserved**** Reserved**** WAKE# 6 4 2 1.5V GND 3.3V * Reserved for future second PCI Express Lane (if needed) ** Reserved for future Subscriber Identity Module (SIM) interface (if needed) *** Reserved for future wireless disable signal (if needed) **** Reserved for future wireless coexistence control interface (if needed) Figure 4-10: Mini Card Bottom Side Dimensions (Refer to www.pcisig.com) Figure 4-11: Mini Card Top Side Dimensions (Refer to www.pcisig.
ICE Module Figure 4-12: Mini Card Connector (Refer to www.pcisig.com) 4.2.5 PCI Express Clock Buffer COM Express only provides a set of 100 MHz Clock for PCI Express Device. When there are more than one PCI Express modules used on the baseboard, the Clock Buffer must be used. Please refer to the schematic diagram (Figure 4-13) suggested by IEI. +V3.3_CLK_A +V3.3_CLK +V3.
ICE Module 4.3 PCI The COM Express provides a PCI Bus interface that is compliant with the PCI Local Bus Specification, Revision 2.2. The implementation is optimized for high-performance data streaming when the COM Express is acting as either the target or the initiator on the PCI bus. For more information on the PCI Bus interface, refer to the PCI Local Bus Specification, Revision 2.2. 4.3.
ICE Module 4.3.2 PCI Connector The PCI slot connection is shown in Figure 4-14. 3,8,9 PCI_AD[0..31] +V3.3 +V5 +V5 -V12 R77 2 1 5.6K_4 3,8 PCI_INT#B 3 PCI_INT#D C51 0.1U_4_Y _16V C50 0.
ICE Module as a pair. It is not permitted to combine REQ and GNT lines with a different index. A PCI REQ/GNT pair can only be used once for a single PCI bus-master device.
ICE Module 4.3.4 PCI Clock Buffer The COM Express Specification only supports a single PCI clock signal called 'PCI_CLK' to be used on the carrier board. If there are multiple devices or slots implemented on the carrier board, a zero delay clock buffer is required to expand the number of PCI clocks so that each device or each bus slot will be provided with a separate clock signal. PCI Clock Buffer @33_41 3 CLK33M_PCI 8 CLK33M_MINIPCI 7 CLK33M_SLOT3 9 CLK33M_80PORT 20 CLK33M_BIOS2 11 CLK33M_TPM +V3.
ICE Module signal traces. Refer to section 8.1 'PCI Trace Routing Guidelines' and the 'PCI Local Bus Specification Revision 2.3' to get more information about this subject. Table 4-10: PCI Impedance Consideration Parameters Routing Transfer Rate @ 33MHz Signal length used on COM Express module (including the COM Express" carrier board connector) " Maximum data and control signal length allowance for the COM Express carrier board. " Maximum clock signal length allowance for the COM Express carrier board.
ICE Module Table 4-11: Serial ATA Signal Descriptions Pin Signal I/O Description A19 A20 A16 A17 B19 B20 B16 B17 A25 A26 A22 A23 B25 B26 B22 B23 A28 SATA0_RX+ SATA0_RXSATA0_TX+ SATA0_TXSATA1_RX+ SATA1_RXSATA1_TX+ SATA1_TXSATA2_RX+ SATA2_RXSATA2_TX+ SATA2_TXSATA3_RX+ SATA3_RXSATA3_TX+ SATA3_TXSATA_ACT# I SATA Serial ATA channel 0 Receive input differential pair. O SATA Serial ATA channel 0 Transmit output differential pair. I SATA Serial ATA channel 1 Receive input differential pair.
ICE Module 4.4.3 SATA LED# The SATA LED can be used with the HDD LED. Please refer to the following schematic diagram. +V3.3 R322 4.7K R323 4.7K D17 HDD_LED# 11,21 HDD_LED# 3,21 ATA_ACT# K1 K2 1 LED1 3 C 2 C A R324 470_6_5% +V5 LEDRED_8_2 BAW56LT1_SOT23 Figure 4-18: SATA LED Connection Example 4.4.
ICE Module 4.5 Universal Serial Bus (USB) The Universal Serial Bus (USB) provides a bi-directional, isochronous, hot-attachable Plug and Play serial interface for adding external peripheral devices such as game controllers, communication devices and input devices on a single bus. A COM Express Module must provide a minimum of four USB ports and can support up to eight USB ports. USB stands for Universal Serial Bus, an industry-standard specification for attaching peripherals to a computer.
ICE Module B37 B36 USB7+ USB7- I/O USB Differential Data Port 7. B44 USB_0_1_OC# I 3.3V CMOS A44 USB_2_3_OC# I 3.3V CMOS B38 USB_4_5_OC# I 3.3V CMOS USB over-current sense, USB ports 0 and 1. A pull-up for this line shall be present on the module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board. USB over-current sense, USB ports 2 and3. A pull-up for this line shall be present on the module.
ICE Module The following list explains how the plugs and receptacles can be mated: Series “A” receptacle mates with a Series “A” plug. Electrically, Series “A” receptacles function as outputs from host systems and/or hubs. Series “A” plug mates with a Series “A” receptacle. The Series “A” plug always is oriented towards the host system. Series “B” receptacle mates with a Series “B” plug (male). Electrically, Series “B” receptacles function as inputs to hubs or devices.
ICE Module 4.5.3 ESD/EMI To improve the EMI behavior of the USB interface, a design should include common mode chokes, which have to be placed as close as possible to the USB connector signal pins. Common mode chokes can provide required noise attenuation but they also distort the signal quality of full-speed and high-speed signaling.
ICE Module 4.5.4 Over Current Protection Over-current protection for USB ports can be implemented by using power distribution switches on the carrier board that monitor the USB port power lines. Power distribution switches usually have a soft-start circuitry that minimizes inrush current in applications where highly capacitive loads are employed. Transient faults are internally filtered. Additionally, they offer a fault status output that is asserted during over-current and thermal shutdown conditions.
ICE Module USB0+/- through USB4+/- from the COM Express Module are routed through a common mode choke to reduce radiated cable emissions. The part shown is a AXIS POWER BCCUB-T4P-2012-900T; this device has a common mode impedance of approximately 90 Ω at 100MHz. The common-mode choke should be placed close to the USB connector. ESD protection diodes D10、D11 and D12 provide over-voltage protection caused by ESD and electrical fast transients.
ICE Module 4.5.6 USB Routing Guideline 4.5.6.1 Impedance Parameters Routing Transfer rate / Port 480 Mbit/s Maximum signal line length (coupled traces) Max. 17.0 inches Signal length used on COM Express module (including the COM Express" connector) " Signal length allowance for the COM Express carrier board " 3.0 inches 14.0 inches Differential Impedance 90 Ohms +/-15% Single-ended Impedance 45 Ohms +/-10% Spacing between pairs-to-pairs (inter-pair) (s) Min.
ICE Module Separate signal traces into similar categories, and route similar signal traces together (such as routing differential pairs together). Keep USB 2.0 signals clear of the core logic set. High current transients are produced during internal state transitions and can be very difficult to filter out. 4.6 LVDS 4.6.1 Signal Description Table 4-15 shows COM Express LVDS and LCD signals, including pin number, signals, I/O and descriptions.
ICE Module 4.6.2 LVDS Cable Consideration Balanced cables (twisted pair) are usually better than unbalanced cables (ribbon cable) for noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also tend to pick up electromagnetic radiation as common-mode noise, which is rejected by the receiver. Twisted pair cables provide a low-cost solution with good balance and flexibility.
ICE Module +V12_LCD_BKL 1 C114 C115 10UF_1210_16V 0.1U_4_Y _16V 2 +V12_LCD_BKL +V12 1 1 3 FB4 FB11_12_600MA 4 R148 47K_4 R146 1K_4 +V12_LCD_BKL R147 39_4_1% LVDS_BKLT_CRTL LVDS_BRIGHTNESS LVDS_ENABKL 6 5 Q2B 2 FDS6975_SOP8 LVDS_BKLT_EN +V5 R150 R152 100K_4 1K_4 B 2 C R149 1K_4 B Q5 2N3904_SOT23 E C Q4 2N3904_SOT23 C116 1 1 2 3 4 5 INVERTER1 LCD_Adj GND1 12V GND2 BL_EN WAFER_1X5_2 10U_1210_Y _25V 2 E LVDS_BRIGHTNESS R153 R154 @4.7K_4 +V5 @4.
ICE Module 4.6.4 LVDS Routing Guideline 4.6.4.1 Impedance Table 4-16: LVDS Impedance Consideration Parameters Transfer Rate Maximum signal line length to the LVDS connector (coupled traces) Signal length used on COM Express module (including the COM Express" carrier board connector) " Signal length to the LVDS connector available for the COM Express carrier board " Routing 5.38 Gbits/sec 8.75 inches 2.0 inches 6.
ICE Module 4.7 Audio Codec Interface(AC’97/HDA) All COM Express module types support Audio Codec '97 (AC'97) and/or High Definition Audio (HDA) Digital Interface (AC-link) specifically designed for implementing audio and modem I/O functionality. The corresponding signals can be found on the COM Express module connector rows A and B. 4.7.
ICE Module Q9 1 +V5_AUDIO VOUT VIN GND FB9 2 3 2 GS78L05N_TO92_3 TO92_123 C188 0.1U_4_Y _16V FB_80_6_600MA 1 +V12 EC12 100U_SMD6_3_EC_25V Figure 4-28: Audio Analog Power Example 4.8.1.2 Digital and Analog Signals Isolation Analog audio signals and other digital signals should be routed as far as possible from each other. All audio circuits require careful PCB layout and grounding to avoid picking up digital noise on audio-signal lines. 4.8.1.
ICE Module D10 D16 D17 C13 IDE_ACK# IDE_CS1# IDE_CS3# IDE_IORDY O 3.3V O 3.3V O 3.3V I 3.3V D18 D12 D77 IDE_RESET# IDE_IRQ IDE_CBLID# O 3.3V I 3.3V I 3.3V IDE device DMA acknowledge. IDE device chip select for 1F0h to 1FFh range. IDE device chip select for 3F0h to 3FFh range. IDE device I/O ready input. Pulled low by the IDE device to extend the cycle. Reset output to IDE device, active low. Interrupt request from IDE device. Input from off-module hardware indicating the type of IDE cable being used.
ICE Module Notes: When using a 44- pin IDE connector, pins 41 and 42 must be connected to VCC and pins 43 and 44 must be connected to ground. All other pins are equivalent to a 40-pin IDE connector. Additionally, decoupling capacitors should be connected to the VCC pins. 4.9.3 CF Connector CompactFlash (CF) cards with DMA capability require that the two signals 'IDE_REQ' and 'IDE_ACK#' are routed to the CF card socket on the COM Express carrier board.
ICE Module 4.10 TV-Out The TV-Out display interface of the COM Express Module consists of three individual digital-to-analog converter (DAC) channels, which can be used in different combinations to support S-Video (Y/C), Composite Video or Component Video (YPbPr). The corresponding signals can be found on the COM Express module connector row B. 4.10.
ICE Module 4.10.2.3 ESD Protection ESD clamp diodes are required for each TV-DAC channel. These low capacitance clamp diodes should be placed as near as possible to the TV-Out connector on the COM Express carrier board between +5V supply voltage and ground. 4.10.2.4 Reference Schematic At least 30 mils of spacing should be used for the routing between each TV-DAC channel to prevent crosstalk between the TV-DAC signals.
ICE Module 4.11 LAN (Local Area Network) All COM Express modules provide at least one LAN port with the minimum capability of 10/100BaseTx Ethernet and optional 10/100/1000BaseT Gigabit Ethernet compliant to the IEEE 802.3ab specification. The LAN interface of the COM Express module consists of 4 pairs of low voltage differential pair signals designated from 'GBE0_MDI0' (+ and -) to 'GBE0_MDI3' (+ and -) plus additional control signals for link activity indicators.
ICE Module 4.11.2 Giga LAN Connector IEI uses the RJ-45 connector including the transformer. +V3.3_DUAL 8 6 4 2 RN28 330_8P4R04 7 5 3 1 LAN_USB1A P2 P3 3 GBE0_MDI0+ 3 GBE0_MDI0- P4 P5 3 GBE0_MDI1+ 3 GBE0_MDI1- P6 P7 3 GBE0_MDI2+ 3 GBE0_MDI2- P8 P9 3 GBE0_MDI3+ 3 GBE0_MDI3R233 +V1.
ICE Module 4.11.4 LAN Routing Guideline 4.11.4.
ICE Module 4.11.4.2 LAN Ground Plane Separation Isolated separation between the analog ground plane and digital ground plane is recommended. If this is not implemented properly then bad ground plane partitioning could cause serious EMI emissions and degrade analog performance due to bouncing noise. The plane area underneath the magnetic module should be left void. The void area is to keep transformer induced noise away from the power and system ground planes.
ICE Module Table 4-22: LPC Interface Signal Descriptions Pin Signal I/O Description A50 LPC_SERIRQ LPC serialized IRQ. B3 LPC_FRAME# B4 B5 B6 B7 B8 B9 B10 LPC_AD0 LPC_AD1 LPC_AD2 LPC_AD3 LPC_DRQ0# LPC_DRQ1# LPC_CLK I/O 3.3V CMOS O 3.3V CMOS I/O 3.3V CMOS I 3.3V CMOS O 3.3V CMOS LPC encoded DMA/Bus master request. LPC frame indicates start of a new cycle or termination of a broken cycle. LPC multiplexed command, address and data. LPC clock output 33MHz. 4.12.
ICE Module 4.12.3 LPC SuperIO for Legacy IO Support Some COM Express modules utilize BIOS that contains built-in support for an external Winbond W83627HG LPC Super I/O controller that can be implemented on the carrier board (http://www.winbond-usa.com). The base address for this Super I/O should be 0x2E to be sure that the legacy devices can be initialized by the BIOS.
ICE Module up by the +5V standby voltage to support keyboard and mouse wake up functionality from low power system states (S1 and S3). F1 2 +V5_DUAL FB5 +V5_KB_R 1 FB19_6_500MA FUSE_12_1.
ICE Module +V5 LPT A U18 13 13 13 13 8 10 12 15 LPT_SLCT LPT_PE LPT_BUSY LPT_ACK# LPT_PD7 LPT_PD6 LPT_PD5 LPT_PD4 LPT_PD3 LPT_PD2 LPT_PD1 LPT_PD0 13 LPT_STB# 13 13 13 LPT_SLIN# LPT_INIT# LPT_AFD# 13 LPT_ERR# 14 13 11 9 7 6 5 4 3 2 1 28 27 VCC Select PError BUSY ACK PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 PSTROBE 2 C 20 1 PD_7 PD_6 PD_5 PD_4 PD_3 PD_2 PD_1 PD_0 STROBE LPT_PDD7 LPT_PDD6 LPT_PDD5 LPT_PDD4 LPT_PDD3 LPT_PDD2 LPT_PDD1 LPT_PDD0 LPT_STB#_R 16 17 18 19 21 23 24 25 26 LPT_STB#_R LPT_AFD#
ICE Module IR CONNECTOR +V5 UART_RX2 UART_TX2 IR1 IR_5X1_2.54 1 2 3 4 5 C260 0.1U_4_Y _16V Figure 4-40: IR Reference Schematic 4.13 VGA COM Express provides analog display signals. There are three signals -- red, green, and blue -- that send color information to a VGA monitor. These three signals each drive an electron gun that emits electrons which paint one primary color at a point on the monitor screen. Analog levels between 0 (completely dark) and 0.
ICE Module 5-8,10 9 GND DDC_POWER 4,11 NC line. Analog and Digital GND 5V DDC supply voltage for monitor EEPROM Not Connected 4.13.2 VGA Connector Figure 4-41: VGA Connector D-SUB15 4.13.3 VGA DAC Filter A video filter is required for each CRT DAC output. This video filter is to be placed in close proximity to the VGA connector. The separation between each of the three video filters for the RGB channels should be maximized if possible to minimize crosstalk. 4.13.4 Routing Guide Line 4.13.4.
ICE Module ICE Module implement the LVDS EDID ROM on board. If Customer want to fix the resolution or EDID information, please contact IEI for ODM Service. 4.13.5 VGA Reference Design This reference design shows a circuitry implementing a VGA port. +V3.3 K L3 FB47_6_300MA VGA_RED R155 150_4_1% C117 10P_4_N_50V CRT_R_Y IO_GND A D1 L4 FB47_6_300MA +V3.3 BAV99LT1G_SOT23 2 R156 C119 10P_4_N_50V +V3.
ICE Module 4.14 Miscellaneous This section describes some signals which are not described above, including PI[3:0], GPO[3:0], Watch Dog Timer, Speaker Out, System Reset, Carrier Board Reset, Suspend Control, Power Good, Smart Fan Control,I2C Data, Alert#. 4.14.
ICE Module A34 BIOS_DISABLE# I CMOS B27 WDT O CMOS A86 KBD_RST# I CMOS A87 KBD_A20GATE I CMOS GPO[0:3] OI CMOS GPI[0:3] I CMOS TYPE[0:2]# TBD systems Module BIOS disable input. Pull low to disable module BIOS. Used to allow off-module BIOS implementations. Output indicating that a watchdog time-out event has occurred. Input to module from (optional) external keyboard controller that can force a reset. Pulled high on the module. This is a legacy artifact of the PC-AT.
ICE Module 4.14.2 Speaker/FAN Control/RTC Reference 4.14.2.1 Speaker Out +V5 R321 Buzzer +V5S_BUZZER 33_4 1 2 C246 0.1U_4_Y _16V SP1 SATG1205NP45_DIP12X10_6.5 C 3,18,21 1 R325 SPKR 2 2.7K_4 B Q14 2N3904_SOT23 E Figure 4-43: Speaker Out Reference Schematic 4.14.2.2 FAN Control +V12 CPU FAN W/FAN Control C240 +V12 0.1U_4_Y _16V C268 1 +V5 10UF_1210_16V 2 FAN1 R313 4.7K 1 2 3 4 GND +12V SENSE CONTROL 1N4148 D33 1K_4 CPUFAN_4_2.
ICE Module 4.14.2.3 RTC Q10,C234 and R304 are for the no battery solution. Using super CAP to instead of Battery. Q10 CLEAR CMOS/Super CAP A1 C +V3.3_DUAL A2 1K_4 1 BAT54C 2 SOT23_AAC R304 JP9(1-2) JUMP_1X2_2.54mm C235 Q11 0.22F Super Cap A1 JP9 C R305 1K_4 3 BT2 2 CON3_HDR BAT54C SOT23_AAC BAT1 CR2032-HOLDER A2 1 R307 1K_4 +VBAT C237 10U_8_X_6V3 C239 0.
ICE Module Chapter 5 5 PCB Stack and Power Deliver Design Page 86
ICE Module 5.1 Chapter Overview A brief description of the Printed Circuit Board (PCB) for COM Express based board is provided in this section. From a cost- effectiveness point of view, a four-layer board is the target platform for the motherboard design. For better quality, a six-layer or 8-layer board is preferred. This chapter also provides the ATX/AT power supply design recommendation for customer’s reference. IEI ICE module carrier board use 4-layer PCB stack. 5.
ICE Module 5.3.1 Four-Layer Stack-up Figure 5-1 below is an example of a four layer stack-up. Layers L1 and L4 are used for signal routing. Layers L2 and L3 are used for solid ground and power planes respectively. Microstrips on Layers 1 and 4 reference ground and power planes on Layers 2 and 3 respectively. In some cases, it may be advantageous to swap the GND and PWR planes. This allows Layer 4 to be GND referenced. Layer 4 is clear of parts and may be the preferred primary routing layer.
ICE Module Figure 5-2: Six Layers Stack NOTE: All high-speed signals should reference solid ground planes through the length of their routing and should not cross plane splits. To guarantee this, both planes surrounding strip-lines should be GND. IEI recommends that high-speed signal routing be done on internal, strip-line layers.
ICE Module High-speed routing on external layers should be minimized in order to avoid EMI. Routing on external layers also introduces different delays compared to internal layers. This makes it extremely difficult to do length matching if routing is done on both internal and external layers. 5.4 ATX Power Delivery Guidelines The COM Express module uses a single main power rail with a nominal value of +12V.
ICE Module 5.4.1 ATX Power Status (S0,S3,S4,S5,G3) ATX power source will provide 12V , -12V , 5V , -5V , 3.3V , 5VSBY power , if other voltage is required (3.3VSBY , LAN1.8V…. ) on carried board. The additional switching regulator or LDO will be necessary. Power states are described by the following terms: Table 5-1: Signal Tables Terminology Descriptions State Description Comment G3 Mechanical Off AC power to system is removed, by a mechanical switch.
ICE Module 5.4.2 ATX Power Diagram Battery(3.3V) +12V COM-Express Module +5VSB ATX Power Source LD O +3.3VSB +5V +3.3V -12V -5V Figure 5-3: ATX Power Delivery Block Diagram 6.3.3 ATX Power On Timing +VBAT(3.3V) +V5SB PWR_BTN# SUS_S3# PS_ON# +V12 +V5,+V3.
ICE Module Table 5-3: ATX Power On Sequence Timing Parameters T0 T1 T2 T3 T4 T5 T6 T7 T8 min Max Description 5.5 AT Power Delivery Guideline AT power source will provide 12V, 5V power. The additional switching regulator or LDO will be required to simulate the ATX power (3.3V…). There will be no standby voltage once AT power source be used. 5.5.1 AT Power Diagram 12V COMExpress Module AT Power Source 5V 3.
ICE Module 5.5.2 AT Power On Timing +VBAT(3.3V) +V12 +V5,+V3.3 SUS_S3# ICE Power Rail CB_RESET# PCI_RESET# BIOS Starts T0 T1 T2 T3 T4 T5 T6 Notes: Do not need 5VSB. Figure 5-6: AT Power On Sequence Table 5-4: AT Power On Sequence Timing Parameters T0 T1 T2 T3 T4 T5 T6 min Max Description NOTE: Please follow the power requirement provided in Chapter 2 to design the baseboard requested by the customer.
ICE Module Chapter 6 6 Mechanical Design Guidelines Page 95
ICE Module 6.1 Chapter Overview The interconnection between COM Express modules and the carrier board uses two 220 pin 0.5mm fine pitch board-to-board connectors. Each single 220-pin connector is split into two connector rows. This results in a total of 440 pins and 4 connector rows. These connectors should be capable of driving up to 6.25GHz Low Voltage Differential Signals to match the requirements for PCI Express signaling. 6.2 COM Module and Carrier Board Connector 6.2.
ICE Module Figure 6-1: Module Connector Picture 6.2.2 Carrier Board Connector The single 220-pin 0.5mm pitch carrier board connectors are 5H/8H plug in connectors with a board-to-board stack height of 5.0mm/8.0mm. A potential source for this plug-in board-to-board connector is: 3-1827253-6 AMP/Tyco HARD TRAY ASSY FH 0.5 BTB CONNECTOR 220POS PLUG 5H WITH GROUND PLATE (5.0mm stack height) 8-1318491-6 AMP/Tyco HARD TRAY ASSY FH 0.5 BTB CONNECTOR 220POS PLUG 8H WITH GROUND PLATE (8.
ICE Module 6.3 Connector Footprint For carrier board designs it is essential that the distance and the alignment of the dual connector shape on the PCB comply to the dimensions defined by the COM Express Specification. The alignment between the two single connectors is guaranteed by the connectors peg holes shown in following drawings. It is very important that the PCB drill tolerances of these peg holes are within the recommended ranges mentioned below.
ICE Module The COM Express PnP Initiative strongly recommends to use the following location peg hole tolerances instead of those indicated in the footprint drawings from the COM Express Specification as shown above: • 0.8mm +0.075/-0.025mm • 1.5mm +0.075/-0.025mm 6.
ICE Module Figure 6-5: Compact, Basic and Extended Form Factor 6.5 Heat Spread An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the Module. Usually It is a 3mm thick aluminum plate. The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some Modules it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers.
ICE Module One version has threaded standoffs and the other has non-threaded standoffs (bore hole). The following sections describe these two common mounting possibilities and the additional components (standoffs, screws, etc...) that are necessary to implement the respective solution. Modules should be equipped with a heat-spreader.
ICE Module Figure 6-7: Basic Module Heat-Spreader Figure 6-8: Basic Module Heat-Spreader Footprint Page 102
ICE Module All dimensions are in mm. X-Y tolerances shall be ± 0.3mm [±0.012"]. The interior holes at coordinates (40, 40) and (80, 40) are tapped through holes with a M2.5 thread. The interior holes do not receive standoffs. These holes may be sealed on the module side by an adhesive backed foil, or they may be blind tapped holes with a minimum thread depth of 2.5 mm. They are intended to allow additional attachment points to the heat-spreader from outside the module.
ICE Module Carrier Board topside components within the module envelope shall be limited to a height of 4 mm (dimension ‘C’ in Figure 6-11), with the exception of the mating connectors. Using Carrier Board topside components up to 4mm allows a gap of 0.2 mm between Carrier Board topside components and module bottom side components. This may not be sufficient in some situations.
ICE Module 6.6.2 Air Follow Issue The air flow of the IEI COM Express fan module must be considered when installing a COM Express system. Please refer to Figure 6-11 for air flow consideration. 6.6.3 Grounding Issue The mounting holes on all ICE COM modules are connected to digital circuit ground (GND) for improved EMC performance. Using conductive screws and distance keepers will also connect the heat spreader and attached heat sink to GND.
ICE Module Figure 6-12: IEI Heat Sink Module Picture Page 106
ICE Module Appendix A A ICE Module Design Schematic Check List Page 107
ICE Module COM Module PU/PD Series - Pin C52 C53 Signal PEG_RX0+ PEG_RX0- D52 D53 C55 C56 PEG_TX0+ PEG_TX0PEG_RX1+ PEG_RX1- - D55 D56 C58 C59 PEG_TX1+ PEG_TX1PEG_RX2+ PEG_RX2- - D58 D59 C61 C62 PEG_TX2+ PEG_TX2PEG_RX3+ PEG_RX3- - D61 D62 C65 C66 PEG_TX3+ PEG_TX3PEG_RX4+ PEG_RX4- - D65 D66 C68 C69 PEG_TX4+ PEG_TX4PEG_RX5+ PEG_RX5- - D68 D69 C71 C72 PEG_TX5+ PEG_TX5PEG_RX6+ PEG_RX6- - D71 D72 C74 C75 PEG_TX6+ PEG_TX6PEG_RX7+ PEG_RX7- - Page 108 - - - - - - - 0.1U Cap 0.
ICE Module D74 D75 C78 C79 PEG_TX7+ PEG_TX7PEG_RX8+ PEG_RX8- - D78 D79 C81 C82 PEG_TX8+ PEG_TX8PEG_RX9+ PEG_RX9- - D81 D82 C85 C86 PEG_TX9+ PEG_TX9PEG_RX10+ PEG_RX10- - D85 D86 C88 C89 PEG_TX10+ PEG_TX10PEG_RX11+ PEG_RX11- - D88 D89 C91 C92 PEG_TX11+ PEG_TX11PEG_RX12+ PEG_RX12- - D91 D92 C94 C95 PEG_TX12+ PEG_TX12PEG_RX13+ PEG_RX13- - D94 D95 C98 C99 PEG_TX13+ PEG_TX13PEG_RX14+ PEG_RX14- - D98 D99 C101 C102 PEG_TX14+ PEG_TX14PEG_RX15+ PEG_RX15- - - - - - - - - - 0.1U Cap 0.
ICE Module D101 D102 A88 A98 D73 PEG_TX15+ PEG_TX15PCIE_CLK_REF+ PCIE_CLK_REFSDVO_I2C_CLK - 0.1U Cap 0.1U Cap 33 ohm - - C73 SDVO_I2C_DATA - - B66 WAKE0# PU If unused, these signals can be left as NC. Pin B68 B69 Signal PCIE_RX0+ PCIE_RX0- PU/PD - Series - A68 A69 B64 B65 PCIE_TX0+ PCIE_TX0PCIE_RX1+ PCIE_RX1- - 0.1U Cap 0.
ICE Module A52 PCIE_TX5+ 0.1U Cap A53 PCIE_TX50.1U Cap A88 PCIE_CLK_REF+ 33 ohm A98 PCIE_CLK_REFIf unused, these signals can be left as NC. Pin as per PCI-E Device Directly connect to PCIe Device or Slot. Directly connect to PCIe Device or Buffer IC Signal PCI_AD[0..31] PCI_C/BE[0..
ICE Module 0.01U Cap A25 SATA2_RX+ 0.01U A26 SATA2_RXCap 0.01U Cap A22 SATA2_TX+ 0.01U A23 SATA2_TXCap 0.01U Cap B25 SATA3_RX+ 0.01U B26 SATA3_RXCap 0.01U Cap B22 SATA3_TX+ 0.01U B23 SATA3_TXCap 0.01U Cap A28 SATA_ACT# PU If unused, these signals can be left as NC.
ICE Module If unused, these signals can be left as NC. Pin B89 B91 Signal VGA_RED VGA_GRN PU/PD PD PD Series - Notes Please refer to chapter 4 Please refer to chapter 4 B92 VGA_BLU PD - Please refer to chapter 4 B93 VGA_HSYNC - Buffer Please refer to chapter 4 B94 VGA_VSYNC - Buffer Please refer to chapter 4 B95 VGA_I2C_CK PU - Please refer to chapter 4 B96 VGA_I2C_DAT PU - Please refer to chapter 4 V If unused, these signals can be left as NC.
ICE Module If unused, these signals can be left as NC. Pin D7 Signal IDE_D[0..
ICE Module B8 LPC_DRQ0# B9 LPC_DRQ1# B10 LPC_CLK 33ohm If unused, these signals can be left as NC.
ICE Module Appendix B B Application Notes Page 116
ICE Module NOTE: IEI is able to provide customers with the ICE module design guide and information as well as many other application notes. IEI will keep the ICE module information most updated. Please contact IEI for the latest design guide and related information. B.1 Terminology Some of the following terms may be used throughout this section. Term Description BIOS Basic Input Output System.
ICE Module Figure 6-13: BIOS Main Menu (BIOS Version: MR10) B.2.1 Using AFUWIN To use AFUWIN application to update the BIOS version, follow the steps below. Step 1: Install and launch AFUWIN. Step 2: Click Open button to open the BIOS file (Figure 6-14).
ICE Module Step 3: Locate the BIOS file that needs to be updated (Figure 6-15). Figure 6-15: Locate BIOS File Step 4: Check ”Program All Block” option (Figure 6-16). Figure 6-16: Check Program All Block Step 5: Click Flash button to start updating BIOS (Figure 6-17).
ICE Module Figure 6-17: AFUWIN – Flash Step 6: Restart the system and check the BIOS menu. The BIOS version is changed to MR11 (Figure 6-18).
ICE Module 6.7.2 Using DOS Command To update BIOS in the DOS environment, prepare a USB flash drive that contains boot files and BIOS updating files shown in Figure 6-19 and follow the steps below to update BIOS. Figure 6-19: USB Flash Drive and BIOS Updating Files Step 1: Connect the USB flash drive to the system. Boot-up the system into DOS. Input commands to get into the directory of the BIOS updating files (ex. cd (folder name)). See Figure 6-20.
ICE Module Step 2: Input command GO and press Enter (Figure 6-21). The system starts updating BIOS. Figure 6-21: GO Command Step 3: Figure 6-22 shows the screen when the updating is completed. Figure 6-22: BIOS Updating Complete (DOS) Step 4: Restart the system and check the BIOS menu. The BIOS version has been changed to MR11 (Figure 6-23).
ICE Module Figure 6-23: BIOS Main Menu – Updated BIOS Version (MR11) A.1 RTC Overview A Real-time clock (RTC) is a basic hardware device that keeps track of the current time of the computer. A RTC can be built in a chip or embedded in the system. When the computer is turned off, the battery on the motherboard provides power to the RTC to keep track of the current time. The RTC is usually used in personal computers and embedded systems. A.1.
ICE Module Appendix C B Reference Carrier Board Schematic Page 124
Cover Page PAGE1: Cover Page PAGE2: System Block Diagram PAGE3: COM_EXPRESS CONNECTOR PAGE4: CLOCK BUFF PAGE5: PCIEX1/EXPRESS CARD PAGE6: PCIEX16 PAGE7: PCI SLOT1/2/3 PAGE8: MINI-PCI PAGE9: PCI 80 PORT PAGE10: PCI ExpressX1 Slot3/4 PAGE11: SATA,IDE,CF PAGE12: LVDS/TV/CRT PAGE13: SIO W83627EHG PAGE14: SIO F81216D PAGE15: LPT,FLOPPY,KB/MS/COM1 PAGE16: COM2,3,4,5,6/RS422,485 PAGE17: LAN,USB0,1,2,3,4,5 PAGE18: HDA ALC888 PAGE19: AUDIO 7.
BUZZER ATX/AT Power SYSTEM FAN +5V +3.3V Power Connector +12V +5VSB ATX2.0 SMART FAN CPU FAN Display Selection Analog VGA Audio 7.
IDE_D[15..0] PCI_AD[31..0] +V12 +V12 IDE_D[15..0] 11 PCI_AD[31..0] 7,8,9 +V12 +V12 COMEXPRESS2 17 GBE0_MDI317 GBE0_MDI3+ 17 GBE0_LINK100# 17 GBE0_LINK1000# 17 GBE0_MDI217 GBE0_MDI2+ 17 GBE0_LINK# 17 GBE0_MDI117 GBE0_MDI1+ 17 GBE0_MDI017 GBE0_MDI0+ +V1.
PCIE Clock Buffer +V3.3 +V3.3_CLK FB1 FB30_8_3A C1 10U_8_X_6V3 +V3.3_CLK_A FB2 C2 10U_8_X_6V3 BEAD C7 10U_8_X_6V3 C3 C4 C5 C6 0.1U_4_Y _16V 0.1U_4_Y _16V 0.1U_4_Y_16V 0.1U_4_Y_16V C8 C9 0.1U_4_Y _16V0.1U_4_Y_16V +V3.3_CLK_A +V3.
Mini PCI Express PCIEX1_Slot1 +V3.3 EC11 +V3.3 0.1U_4_Y _16V C19 C20 10U_8_X_6V3 @150U_TNC_SMD_6.3V 3 3 1 1 TP96 TP97 3 3 +V1.5 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 PCIE_TX3+ PCIE_TX3- PCIE_RX3+ PCIE_RX3- 4 CLK33M_MINICARD 3,6,10,11,14,20 CB_RESET# 0_4 2 0_4 2 1 R122 1 R123 0_4 2 0_4 2 1 R70 1 R72 4 CLK100M_PCIEx1_SLOT4+ 4 CLK100M_PCIEx1_SLOT4TP40 1 PCIE_WAKE_UP# 3,6,10,16 PCIE_WAKE_UP# 15 13 11 9 7 5 3 1 +V3.3 4 5 CN1 C21 0.
+V3.3 +V12 +V12 +V3.
+V3.3_DUAL PCI SLOT1: AD20, REQ#1,GNT#1,INT#ABCD 3,8,9 PCI_AD[0..31] +V3.3_DUAL PCI SLOT2: AD21, REQ#2,GNT#2,INT#BCDA C48 0.1U_4_Y _16V C49 +V3.3 0.1U_4_Y _16V PCI SLOT3: AD22, REQ#3,GNT#3,INT#CDAB +V5 +V3.3 +V5 +V5 +V5 +V3.3 -V12 2 R77 5.6K_4 3,8 PCI_INT#B 3 PCI_INT#D C51 0.1U_4_Y _16V C50 0.
MiniPCI: AD23, REQ#0,GNT#0,INT#AB PCI_AD[0..31] 3,7,9 +V3.3 PCI_C/BE#[0..3] 3,7,9 +V5 +V3.
4 CLK33M_80PORT PCI_AD0 PCI_AD1 PCI_AD2 PCI_AD3 PCI_AD4 PCI_AD5 PCI_AD6 PCI_AD7 3,7,8 PCI_AD[31..0] 3,7,8 PCI_C/BE#[0..3] R93 1 2 0_4 7-Segment LED with Common GND PCI_RST# 3,7,8,13 PCI_FRAME# 3,7,8 PCI_IRDY # 3,7,8 TP44 PCI_C/BE#0 PCI_C/BE#1 PCI_C/BE#2 PCI_C/BE#3 80PORT_H_LED_A R94 80PORT_H_LED_B R95 80PORT_H_LED_C R96 80PORT_H_LED_D R97 80PORT_H_LED_E R98 80PORT_H_LED_F R99 80PORT_H_LED_G R100 80PORT_H_LED_DGR101 R102 +V3.3 +V3.
PCIEX1_Slot3 +V3.3 +V12 +V12 +V3.3 +V3.
+V5 IDE Connector R128 1 3 IDE_RESET# IDE_D7 IDE_D6 IDE_D5 IDE_D4 IDE_D3 IDE_D2 IDE_D1 IDE_D0 +V3.3 R129 8.2K_4 3 3 3 3 3 3 3 3 3 20,21 IDE_REQ IDE_IOW# IDE_IOR# IDE_IORDY IDE_ACK# IDE_IRQ IDE_A1 IDE_A0 IDE_CS#1 HDD_LED# 2 R130 4.7K_4 1 R134 R137 1 1 CF Connector IDE1 33_4 2 2 33_4 2 33_4 IDE_SDA1 IDE_SDA0 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 IDE_D[15..
LVDS +V3.3 +V3.3_LCD_PANEL +V5 R361 J_VLVDS1(1-2) MINIJUMPER_1X2_2 C109 10U_8_X_6V3 J_VLVDS1 C110 10U_8_X_6V3 C111 10U_8_X_6V3 3.3V(Default) 2-3 5V 2 1 R145 1M_4 2 2 C269 1000P_4_X_50V 1 2 R417 100K_4 R151 470_4 +V12_LCD_BKL C LED-RED(0603) C273 2.2U_6_Y _10V 1 2 1 G S 1 +V3.3 S 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 +V3.3_LCD_PANEL 3 +V5 HEADER_1X3_2 3 3 3 3 3 LVDS_B3+ LVDS_B_CK+ LVDS_B2+ LVDS_B1+ LVDS_B0+ 3 LVDS_A3+ 3 LVDS_A_CK+ 3 LVDS_A2+ 3 LVDS_A1+ 3 LVDS_A0+ 1 C271 0.
16 16 16 16 16 16 16 16 3 IR CONNECTOR +V5 IR1 IR_5X1_2.54 1 2 3 4 5 UART_RX2 UART_TX2 UART_CTS#2 UART_DSR#2 UART_RTS#2 UART_DTR#2 UART_RX2 UART_TX2 UART_DCD#2 UART_RI#2 WAKE_UP# 10M_4 10K_4 SUS_LED HM_VREF VTIN3 D+ VTIN1 20 20 IOAVCC FB32 FB80_6_600MA FAN_IO1 FAN_IO2 20 20 FAN_PWM1 FAN_PWM2 D- C427 0.1U_4_Y _16V R176 R177 4.
Default Address: 2E/2F, Entry Key=0X77 UART_RI#3 UART_DCD#3 UART_TX3 UART_RX3 UART_DTR#3 UART_RTS#3 UART_DSR#3 UART_CTS#3 UART_RI#4 UART_DCD#4 +V3.3 1 C140 1 0.1U_4_Y _16V 2 C141 0.1U_4_Y _16V U14 2 3,5,6,10,11,20 CB_RESET# TP66 3,5,11,13,20 LPC_AD3 3,5,11,13,20 LPC_AD2 3,5,11,13,20 LPC_AD1 3,5,11,13,20 LPC_AD0 4 CLK33M_SIO2 3,5,11,13,20 LPC_FRAME# 3,11,13 SERIRQ 1 LPC_AD3 LPC_AD2 LPC_AD1 LPC_AD0 LPC_FRAME# SERIRQ +V3.
FLOPPY(only Device A) KB/MS F1 2 +V5_DUAL FB5 +V5_KB_R 1 FB19_6_500MA FUSE_12_1.1A_6V 13 1 KB_DAT# U15 DI 2 13 3 KB_CLK# 13 GND 1 MS_DAT# 13 5 DI GND KBCLK MSDAT 6 DO 5 VCC L_KDAT 1 L13 FB19_6_500mA 2 L_KCLK 1 L14 FB19_6_500mA 2 L_MDAT 1 L15 FB19_6_500mA 2 L_MCLK +V5_DUAL MSCLK 4 CLKI CLKO CN6A 1 L12 FB19_6_500mA 2 +V5_DUAL 4 CLKI CLKO 3 MS_CLK# DO VCC KBMF01SC6 U16 2 KBDAT 6 KBMF01SC6 1 C144 1 0.1U_4_Y _16V 2 2 C145 0.
13 UART_DCD#2 13 UART_DSR#2 13 UART_RX2 13 UART_CTS#2 13 UART_RI#2 7 6 20 21 13 UART_TX2 13 UART_RTS#2 13 UART_DTR#2 24 25 +V5 0.1U_4_Y_16V C152 C151 0.1U_4_Y _16V 12 14 13 U20 COM2 U19 8 5 26 22 19 ROUT1 ROUT2 ROUT3 ROUT4 ROUT5 TIN1 TIN2 TIN3 TIN4 RIN1 RIN2 RIN3 RIN4 RIN5 TOUT1 TOUT2 TOUT3 TOUT4 EN SHDN# C2+ C1V+ C2V- 232_DCD#2 232_DSR#2 232_RX2 232_CTS#2 232_RI2 2 3 1 28 232_TX2 232_RTS#2 232_DTR#2 232_DCD#2 232_RX2 232_TX2 232_DTR#2 11 10 +V5 1 3 5 7 15 0.
+V5_DUAL R249 @0_4 U31 4 3 3 USB_0_1_OC# USB Power control 2 1 ENB OUTB FLGB GND FLGA IN ENA OUTA USB Port0~6 FB6 5 1 C286+ 6 GCB1608K-300 8 FB7 USB0- 3 USB0+ U32 4 3 2 ENB OUTB FLGB GND FLGA 1 ENA IN OUTA C288 1 + 150U_TNC_SMD_6V3 7 +V5_USB2 FB33 C289 1 + 150U_TNC_SMD_6V3 MIC2026 3 USB2- 3 USB2+ 4 3 2 1 ENB OUTB FLGB GND FLGA IN ENA OUTA C290 1 + 150U_TNC_SMD_6V3 7 FB37 C291 1 + 150U_TNC_SMD_6V3 MIC2026 R375 0_4 3 4 +V5_USB2 USB2-_R USB2+_R H3 U1
Q9 Digital 1 +V5_AUDIO C190 1 0.1U_4_Y _16V C191 10U_8_X_6V3 C192 0.1U_4_Y _16V C193 1 0.
Audio Rear Jack C28-1 @1U_6_Y _10V 1 2 18 LEF-OUT 18 CEN-OUT C211 100U_TNC_SMD_6V3 1 2 LEF-OUT CEN-OUT 1 R273 75_4 2 1 CLEF-OUT CCEN-OUT 2 2 C212 100U_TNC_SMD_6V3 1 FB19 FB_80_6_600MA 1 C R277 47K_4 D4-2 R281 4.7K_4 1 2 D4-1 R282 4.
Q10 CLEAR CMOS/Super CAP A1 C +V3.3_DUAL A2 1K_4 1 BAT54C 2 SOT23_AAC R304 C235 1 A2 2 BAT54C SOT23_AAC C237 10U_8_X_6V3 R307 1K_4 FPG14 2 R306 FGPI3 1 FGPI2 3 FGPI1 5 FGPI0 7 8.2K_4 1 2 4 6 8 C239 0.1U_4_Y _16V 8.2K_8P4R04 DCBAT_3V R309 2 R310 2 +V3.3 PLCC32 SKT_PLCC32_SMD C240 0.1U_4_Y _16V C268 3,5,11,13,14 LPC_AD0 3,5,11,13,14 LPC_AD1 3,5,11,13,14 LPC_AD2 3,5,11,13,14 LPC_AD3 3,5,11,13,14 LPC_FRAME# 2 R313 4.7K 1 2 3 4 1N4148 D33 1K_4 CPUFAN_4_2.
ATX Power Connector +V5SB +V3.3 -V12 +V5 +V3.3 +V5 +V5SB +V12 Frount Panel +V5 ATX CONNECTOR PWR1 R326 4.7K ATX_PSON# R327 11 12 13 14 15 16 17 18 19 20 0R JP10(1-2) 13 1 3 5 PS_ON# JP10 MINIJUMPER_1X2_2 2 4 6 ATX_PSON# 3V31 -12V GND PS-ON GND GND GND -5V 5V1 5V2 3V32 3V33 GND 5V3 GND 5V4 GND PW-OK 5VSB 12V 1 2 3 4 5 6 7 8 9 10 R328 4.7K PWROK_ATX +V5 3 +V5 +V5_DUAL +V5 +V12 1 +V12 1 10UF_1210_16V +V5 +V3.
Express Card Module COM Module H4 H5 1 SCREW1 H6 1 1 E_Card_CON1_Bracket E_Card_CON1(H1) @D=3.00mm ROUND HEAD MACHINE SCREW D=3.00mm D=3.00mm H8 D=3.00mm H9 1 H10 E_Card_CON1(H2) 1 1 ROUND HEAD MACHINE SCREW D=3.00mm @D=3.00mm D=3.