Datasheet
BK644
BK644
mATX Chassis
CASE SIZE
PROCESSOR
EXTERNAL DRIVE BAY
INTERNAL DRIVE BAY
FRONT PORTS
DIMENSIONS (HxWxD)
w/o Front Panel
M/B
I/O EXPANSION SLOTS
POWER SUPPLY
THERMAL SOLUTION
SAFETY
SECURITY
OPTIONAL
S.F.F. Tiny Tower Chassis
Support Dual Core and Quad Core Processor
5.25" x 1, 3.5" x1
3.5" x 1
USB 2.0 x 4, HD Audio
12.7" x 5.5" x 10.8"
323 x 140 x 276 mm (12.5L)
Micro-ATX
Full Height Slot x 4
SFX 12V Form Factor, 300W
Intel Mt. Jade Ref. Design
New Partition Plate Cooling Technology (New PPCT)
No 2
nd
Fan (Rear Fan) Needed
Meets RoHS, CE and FCC Class B Requirements
Padlock Loop / Kensington Slot
IEEE 1394 / IR / Removable Air Filter
Chassis Intrusion Switch
Tool-Free ODD/FDD/HDD Bay Clips
Tool-Free Side Panel Clips
Design Philosophy
To design a small 12.5L S.F.F. chassis with better thermal & acoustic
performance than other bigger size chassis.
Tool Free
Optional tool-free designs - ODD/FDD/HDD bays and side panel.
3rd Generation of Partition Plate Cooling Technology (PPCT)
PPCT is the world's first advanced thermal and acoustic cooling
technology, which provides S.F.F. chassis with excellent thermal solutions
while creating a quieter computing experience. PPCT does not require
second fan; yet still provides an excellent thermal solution. The 3rd
generation of PPCT includes an adjustable air duct for various CPU fans
and efficiently eliminates overheat while enhances airflow of entire system.
The new PPCT also supports the LGA1156 socket.
Easy Integration
Compatible with all standard desktop components.
Easy system integration.
Flexible Compatibility
Small but flexible enough to accommodate four full height PCI cards.
Using Partition Plate Cooling Tech
*
BK Series uses Intel Mt. Jade as Ref. Design
*Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the
United States and other countries.
*The actual product is subject to change without prior notice. In Win Development Inc.
reserves the right to make nal modications.
BK644 BK644
*Special Edition