Cover Page O P E R A T I N G M A N XTC/3 Thin Film Deposition Controller PN 074-446-P1J U A L
Title Page O P E R A T I N G M A N U XTC/3 Thin Film Deposition Controller PN 074-446-P1J ® www.inficon.com ©2014 INFICON re achus@inficon.
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DECLARATION OF CONFORMITY This is to certify that this equipment, designed and manufactured by: INFICON Inc. Two Technology Place East Syracuse, NY 13057 USA meets the essential safety requirements of the European Union and is placed on the market accordingly.
Warranty WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products manufactured by it, or by an affiliated company and sold by it, and described on the reverse hereof, to be, for the period of warranty coverage specified below, free from defects of materials or workmanship under normal proper use and service.
XTC/3 Operating Manual Table Of Contents Cover Page Title Page Trademarks Disclaimer Copyright Declaration Of Conformity Warranty Chapter 1 PN 074-446-P1J Introduction and Specifications 1.1 1.1.1 1.2 1.2.1 1.2.2 1.2.3 1.2.4 1.3 1.3.1 1.4 1.4.1 1.4.2 1.4.3 1.4.3.1 1.4.4 1.4.5 1.4.6 1.4.7 1.4.8 1.4.9 1.4.10 1.4.11 1.4.12 1.4.13 1.4.14 1.4.15 1.4.16 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Related Manuals. . . . . . . . . . . . .
XTC/3 Operating Manual 1.5 1.6 1.6.1 1.6.2 1.6.3 1.6.4 1.7 Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12 Parts and Options Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12 Base Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PN 074-446-P1J XTC/3 Operating Manual 3.3.2 3.3.2.1 3.3.2.2 3.3.2.3 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.4 3.5 3.5.1 3.5.1.1 3.5.1.2 3.5.1.3 3.6 3.6.1 3.6.2 3.6.3 3.6.4 3.6.5 3.6.6 3.6.7 3.6.7.1 3.6.7.2 3.6.8 3.6.8.1 3.6.8.2 3.6.8.3 3.6.8.4 3.6.8.5 3.6.8.6 3.6.9 3.6.10 3.6.11 3.6.12 3.6.13 3.6.14 3.6.15 Operate Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Crystal Life and Starting Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XTC/3 Operating Manual Chapter 4 4.1 4.2 4.2.1 4.2.2 4.2.3 4.2.3.1 4.2.3.2 4.2.3.3 4.2.3.3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Film Set Up Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Film Set Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Film Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PN 074-446-P1J XTC/3 Operating Manual 5.1.4 5.1.4.1 5.1.4.2 5.2 5.2.1 5.2.1.1 5.2.1.2 5.2.2 5.2.2.1 5.2.2.2 5.2.2.3 5.2.2.3.1 TCP/IP Ethernet Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Network Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 How to Set Up the Network Protocol on the PC . . . . . . . . . . . . . . . . . . . . . . 5-3 Standard Protocol Message Format. . . . . . . . . . . . . . . . . . . .
XTC/3 Operating Manual 5.3.5.4 5.3.5.5 5.3.5.6 5.3.5.7 5.3.5.7.1 XTC/2 UPDATE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-41 XTC/2 STATUS Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-42 XTC/2 REMOTE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-46 XTC/2 Sample Host Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48 XTC/2 Program Without Checksum . . . . . . . . . . .
XTC/3 Operating Manual Chapter 7 Calibration Procedures 7.1 7.2 7.3 7.4 7.5 Importance of Density, Tooling and Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2 Laboratory Determination of Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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XTC/3 Operating Manual Chapter 1 Introduction and Specifications 1.1 Introduction XTC/3 is produced in two versions: XTC/3M Multi-Layer Deposition Controller XTC/3S Single Layer Deposition Controller This manual covers both instruments, using the designation XTC/3 when the subject matter applies to both instruments and XTC/3M or XTC/3S when the subject matter applies to a specific instrument. This Operating Manual provides user information for installing, programming, and operating the XTC/3.
XTC/3 Operating Manual 1.1.1 Related Manuals Sensors are covered in separate manuals. PDF files of these manuals are contained in the PN 074-5000-G1 Thin Flim Manuals CD, included in Ship Kit. PN 074-154 - Bakeable PN 074-155 - CrystalSix PN 074-156 - Single/Dual PN 074-157 - Sputtering PN 074-398 - Crystal12 1.2 XTC/3 Safety 1.2.1 Definition of Notes, Cautions and Warnings When using this manual, please pay attention to the NOTES, CAUTIONS and WARNINGS found throughout.
XTC/3 Operating Manual 1.2.2 General Safety Information WARNING - Risk Of Electric Shock Do not open the XTC/3 case! There are no user-serviceable components within the XTC/3 case. Dangerous voltages may be present whenever the power cord or external input/relay connectors are present. Refer all maintenance to technically qualified personnel. CAUTION XTC/3 contains delicate circuitry which is susceptible to transient power line voltages. Disconnect the line cord whenever making any interface connections.
XTC/3 Operating Manual 1.2.3 Earth Ground XTC/3 is connected to earth ground through a sealed three-core (three-conductor) power cable, which must be plugged into a socket outlet with a protective earth terminal. Extension cables must always have three conductors including a protective earth terminal. WARNING - Risk Of Electric Shock Never interrupt the protective earth circuit.
XTC/3 Operating Manual 1.3 How to Contact INFICON Worldwide customer support information is available under Support >> Support Worldwide at www.inficon.com: Sales and Customer Service Technical Support Repair Service When communicating with INFICON about a XTC/3, please have the following information readily available: The Sales Order or Purchase Order number of the XTC/3 purchase.
XTC/3 Operating Manual 1.4 XTC/3 Specifications 1.4.1 Measurement Measurement Frequency Range . . . 6.0 to 5.0 MHz (fixed) Frequency Resolution . . . . . . . . . . . ± 0.028 Hz @ 6 MHz Thickness and Rate Resolution/Measurement . . . . . . . . . ± 0.034 Å @ tooling/density = 100/1 Fundamental frequency = 6 MHz Measurement Interval . . . . . . . . . . . 0.25 s Thickness Accuracy . . . . . . . . . . . . . 0.
XTC/3 Operating Manual 1.4.3 Process Recipe Storage XTC/3M XTC/3S Process Programs 99 1 Film Programs 32 9 Process Layers 999 1 per process 1.4.3.1 Film Parameters Pre/Post Deposit Power Ramps . . . . . . . . . . . . . . . . . . 2 per film Power Level . . . . . . . . . . . . . . . . 0.0 to 100% Rise Time . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s Soak Time. . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s Idle Ramps . . . . . . . . . . . . . . . . . . . .
XTC/3 Operating Manual Crystal Stability, Total . . . . . . . . . . . . 0, 25 to 9999 Hz (1 to 24 are excluded) Crystal Quality Percent. . . . . . . . . . . 0 to 99% Crystal Quality Counts . . . . . . . . . . . 0 to 99 Source Source #. . . . . . . . . . . . . . . . . . . . . . 1 or 2 Crucible Selection . . . . . . . . . . . . . . 0 to 8, each source (0=disabled) Control Gain . . . . . . . . . . . . . . . . . . . 0.01 to 100 Å/s/%Power Control Time Constant . . . . . . . . . . . 0.1 to 100.
XTC/3 Operating Manual Power Display Range . . . . . . . . . . . . 0.0 to 99.9% Graphic Display Functions . . . . . . . . Rate Deviation at ± 5, 10, 20, or 40 Å/s or Power at 0.0 to 100% Display Data Update Rate . . . . . . . . 1 Hz 1.4.5 Source / Recorder Outputs Quantity . . . . . . . . . . . . . . . . . . . . . . 3 BNC, Female Configuration . . . . . . . . . . . . . . . . . . Source 1, Source 2, Recorder Function Ranges Source Control . . . . . . . . . . . . . .
XTC/3 Operating Manual # of TTL Compatible Outputs . . . . . . 8 standard. Internally pulled up to 5 V (dc). May be pulled up externally to 24 V (dc) through 2.4k resistor. minimum high level 0.5 mA load @3.75 V maximum low level 10 mA load @1.1 V Inputs (TTL Compatible). . . . . . . . . . 9 standard Input Levels maximum high . . . . . . . . . . . . . . 24 V minimum high . . . . . . . . . . . . . . . 2.5 V maximum low . . . . . . . . . . . . . . . 1.1 V Scan/Update Rate . . . . . . . . . . . . . . 4 Hz 1.
XTC/3 Operating Manual 1.4.10 Operating Environment Usage . . . . . . . . . . . . . . . . . . . . . . . . Indoor only Temperature . . . . . . . . . . . . . . . . . . . 0 to 50°C (32-122°F) Humidity . . . . . . . . . . . . . . . . . . . . . . Up to 80% RH. @ 31°C, non-condensing Altitude . . . . . . . . . . . . . . . . . . . . . . . Up to 2000 m Installation (Overvoltage) . . . . . . . . . Category II Measurement Category . . . . . . . . . . II Pollution Degree. . . . . . . . . . . . . . . . 2 1.4.
XTC/3 Operating Manual 1.5 Unpacking and Inspection 1 If XTC/3 control module has not been removed from its shipping container, do so now. 2 Carefully examine the control module for damage that may have occurred during shipping. This is especially important if you notice obvious rough handling on the outside of the container. Immediately report any damage to the carrier and to INFICON.
XTC/3 Operating Manual 1.6.2 Accessories Each sensor requires an oscillator kit to interface to the controller: XTC/3 4.6 m (15 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . . .PN 781-611-G15 XTC/3 9.2 m (30 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . . .PN 781-611-G30 XTC/3 15.3 m (50 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . .PN 781-611-G50 XTC/3 30.5 m (100 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . .
XTC/3 Operating Manual All shuttered sensors and all multi-position sensors require a feedthrough with an air line and a solenoid valve. Solenoid Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 750-420-G1 1.6.3 Replacement Cables & Oscillators Oscillator to vacuum feedthrough BNC cable, 15.2 cm (6 in.) . . . . . . . . . . . . . . . . . . . . . . . . . . PN 755-257-G6 Oscillator to vacuum feedthrough BNC cable, 50.8 cm (20 in.) . . . . . . . . . . . . . . . . . . . . . . . .
XTC/3 Operating Manual For more information about Inficon’s full line of QCM sensors, please contact your local Inficon representative or visit www.inficon.com. Table 1-1 Crystal12 sensor Crystal12 Sensor Package XL12-xxxxX XL12- Base Unit None 0 Crystal 12 Sensor 1 In-Vacuum Cable Assembly Length None 0 78 cm (30.75 in.) 1 15.2 cm (6 in.) 2 30.5 cm (12 in.) 3 61 cm (24 in.) 4 91.4 cm (36 in.) 5 121.9 cm (48 in.) 6 152.4 cm (60 in.) 7 182.9 cm (72 in.
XTC/3 Operating Manual 1.7 Initial Power On Verification A preliminary functional check of XTC/3 can be made before formal installation. It is not necessary to have sensors, source controls, inputs or relays connected to do this. For more complete installation information, refer to Chapter 2, Installation and Interfaces. WARNING - Risk Of Electric Shock There are no user-serviceable components within the XTC/3 case.
XTC/3 Operating Manual 3 The LCD will display a screen similar to the one shown in Figure 1-1 or Figure 1-2.
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XTC/3 Operating Manual Chapter 2 Installation and Interfaces 2.1 Location Guidelines Before permanently installing XTC/3, read this entire chapter on Installation and Interfaces and follow its recommendations as closely as possible. Failure to adhere to these practices may adversely affect the performance and longevity of XTC/3. 2.1.1 Sensor Types The choice of sensor type is dictated by the process, the deposition material and the physical characteristics of the process chamber.
XTC/3 Operating Manual 2.1.2 Sensor Installation Figure 2-1 shows a typical installation of an INFICON water cooled crystal sensor in the vacuum process chamber. Use the illustration and the following guidelines to install sensors for optimum performance and convenience. Figure 2-1 Typical installation Mounting Brackett Coax Cable (Routed with water tubes) Braze/Weld Joint or Compression Fittings Sensor Shutter Source to Sensor (10 in.
XTC/3 Operating Manual Install the sensor as far as possible from the evaporation source (a minimum of 10 in. [254 mm] is recommended) while still being in a position to accumulate thickness at a rate proportional to accumulation on the substrate. Figure 2-2 shows proper and improper methods of installing sensors.
XTC/3 Operating Manual 2.1.3 XTC/3 Installation XTC/3 is designed to be rack mounted with the optional rack mount kit (PN 780-702-G1). It may be also used on a table. A two-unit rack mount option kit (PN 780-702-G2) is available for mounting two XTC/3 side by side. Centrally locate the controller, minimizing the length of external cabling. 2.2 Avoiding Electrical Interference Careful consideration of simple electrical guidelines during installation will avoid many problems caused by electrical noise.
XTC/3 Operating Manual 2.2.2 Connections to Earth Ground There are two earth connections, both must be present: The ground connection on the controller is a threaded stud with a hex nut. One suggestion is to connect a ring terminal to the ground strap, thus allowing a good connection to a solid copper bar ground bus, and easy removal and installation. Use at least 0.5 in. copper braid strap or 16 AWG copper wire not exceeding 12 in. in length to achieve best immunity against electrical noise.
XTC/3 Operating Manual In many cases, a braided ground strap is sufficient. However, there are cases when a solid copper strap (0.030 in. thick x 1 in. wide) is required because of its lower RF impedance. Figure 2-3 System grounding diagram Back Panel Transducer Feedthrough Ground Stud Earth Ground Vacuum System 2.2.3 Minimizing Noise Pickup From External Cabling Use shielded coax cable or twisted pairs for all connections. Minimize cable lengths.
XTC/3 Operating Manual 2.3 Connecting the Controller The operation of the XTC/3 depends on the proper connection of power and signal interfaces to owner equipment and sources. 2.3.1 Verifying the Correct Input Voltage WARNING - Risk Of Electric Shock XTC/3 has line voltage present on the primary circuits whenever it is plugged into a main power source. Never remove the covers from XTC/3 during normal operation. There are no operator serviceable items within XTC/3.
XTC/3 Operating Manual 2.3.3.2 Input and Output Connections CAUTION The relay, relay circuit, and associated pins in the I/O connector(s) have a maximum voltage rating of 30 V (dc) or 30 V (ac) RMS or 42 V (peak). The maximum current rating per connector pin or relay contact is 2.5 Amps. NOTE: I/O functions are fixed in XTC/3S and are identical to the default assignments in XTC/2. PN 074-446-P1J NOTE: In XTC/3M, the I/O functions are user selectable.
XTC/3 Operating Manual 2.3.3.2.
XTC/3 Operating Manual 2.3.3.2.
XTC/3 Operating Manual 2.3.4 RS-232C Communications RS-232C serial communications is standard in XTC/3. RS-232C is used to remotely control or monitor XTC/3. Optional Windows® compatible software, INFICON PN 780-032-G1, provides for parameter entry, recipe storage, data logging and monitoring as well as Start, Stop and Reset control. An industry standard 9-pin D-Sub connector is required for the host computer side connection. The permissible length of the cable is governed by published standards.
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XTC/3 Operating Manual Chapter 3 Operation 3.1 Front Panel Controls Figure 3-1 XTC/3M front panel 1 3 2 4 8 1 7 6 5 System Switches START, STOP and RESET for process control. 2 LCD Screen Provides graphical displays, set-up menus, status and error messages. 3 Data Entry Keys PN 074-446-P1J A keypad array with numerics 0 through 9 with telephone-style assigned letters (XTC/3M only) for parameter entry and keys for HELP, CLEAR▲(up cursor), MENU and ENTER▼(down cursor).
XTC/3 Operating Manual 5 Power This switch controls secondary power to XTC/3 between ON and STANDBY. Power is provided when the button is in its depressed position. 6 Pilot Light A green LED, adjacent to the power switch, is illuminated when power is on. 7 Remote Control Jack Receptacle for the optional wired handheld remote controller PN 755-262-G1. 8 Optional Rack Mount Kit (Not Shown) PN 780-702-G1 for one XTC/3. PN 780-702-G2 for two XTC/3 mounted side by side. 3.
XTC/3 Operating Manual 5 RS-232C Remote Communication Connector Provides a 9-pin RS-232C communications port. 6 Ground Stud See section 2.2.2, Connections to Earth Ground, on page 2-5. 7 Recorder DAC Output Provides 0 to 10 V output selectable to correspond to Rate, Rate Deviation, and Thickness at various ranges and Power (BNC connector). 8 Aux I/O Connector Provides pin connection for 6 Relays rated for 30 V (dc) or 30 V (ac) RMS or 42 V (peak) maximum, eight logic outputs, and one logic input.
XTC/3 Operating Manual 3.3 Displays Seven XTC/3 display screens are used for monitoring and programming processes: Operate Film Parameter Process List (XTC/3M only) General Parameter I/O Map Diagnostics Sensor To maximize the life of the display, it can be set to dim after a period of 1 to 99 minutes without a key press (see section 4.4.2, Hardware Parameters, on page 4-21, parameter LCD DIMMER TIME).
XTC/3 Operating Manual 3.3.1 Menu Display Pressing MENU while on any other screen will display to the Menu screen. The Menu screen allows navigation between all other screens. 1 Using▲or▼, a list of screens can be scrolled through to select the desired screen. 2 Press MENU to move the display to the selected screen.
XTC/3 Operating Manual A graphical representation of rate deviation or the power over time will also be displayed. The graph display can be modified by placing the cursor on the Y-axis graph label and pressing TOGL to toggle between rate deviation and power. The rate deviation scale can also be toggled between 5,10, 20 and 40 Å/s when the cursor is placed on the graph Y-axis value. System messages and errors are displayed on all screens except I/O Map.
XTC/3 Operating Manual Operate Display Description (refer to Figure 3-4) 1. Layer Currently In Process (Film in XTC/3S) 2. Layer Time 3. Process Time (XTC/3M only) 4. % Power 5. Rate 6. Graphical Display of Rate Deviation or Power 7. Layer Thickness 8. Lock Status Area 9. Test Mode Indicator 10. State of Layer 11. State Time 12. Source Number In Use 13. Sensor Number In Use, Crystal in Use (if multi-position sensor) 14. % Crystal Life 15. S and Q Counters (if set to non-zero values) 16.
XTC/3 Operating Manual 3.3.2.1 Crystal Life and Starting Frequency On the Operate display, crystal life is shown as a percentage of the nominal 1 MHz frequency shift, relative to the 5.0 MHz ending frequency allowed by XTC/3. This quantity is useful as an indicator of when to change the monitor crystal to safeguard against crystal failures during deposition. It is normal to change a crystal after a specific amount of crystal life (% change) is consumed.
XTC/3 Operating Manual 3.3.3 Film Name Display Figure 3-6 Film Name display The Film Name display shows the film parameters and their values. Thirty-two films may be programmed in XTC/3M; nine in XTC/3S. Pre/Post Deposit, Deposit, Sensor, Source and Option screens are accessed from the Film Name screen. If the parameters are locked, the L Lock or R Lock message will be displayed in the upper right corner. With the parameters locked, the film number may still be changed to allow viewing of other films.
XTC/3 Operating Manual 3.3.4 Process List Display (XTC/3M only) The Process screen is present only in XTC/3M. XTC/3S is a single process, single layer controller. Figure 3-7 XTC/3M Process display A process consists of one or more layers, to be run in order. See section 4.3 on page 4-16 for programming details. 99 Processes may be programmed, each with up to 999 Layers. If the parameters are locked, the L Lock or R Lock message will be displayed in the upper right corner.
XTC/3 Operating Manual 3.3.5 General Parameter Display Figure 3-8 XTC/3M General Parameter display NOTE: XTC/3S replaces Process to Run with Film To Run. XTC/3S does not support AutoStart Next Layer. The General parameter screen is subdivided into Process, Hardware and Communication Info screens. The L Lock lock code is initially set in the Process screen. If the parameters are locked here, the L Lock message will be displayed in the upper right corner.
XTC/3 Operating Manual 3.3.6 I/O Map Display Figure 3-9 XTC/3M I/O Map display The I/O Map screen displays the currently selected programmable I/O functions on XTC/3M or the fixed I/O in XTC/3S. See section 4.5 on page 4-26 for XTC/3M programming details. 3.3.7 Diagnostics Display PN 074-446-P1J Figure 3-10 Diagnostics display The Diagnostics display is described under section 6.2, XTC/3 Diagnostics, on page 6-6.
XTC/3 Operating Manual 3.3.8 Sensor Information Display Figure 3-11 Typical Sensor Information display Inactive choices will be gray. If non-zero values have been programmed for the S and/or Q parameters, the accumulated counts can be cleared on this screen. If a multi-position sensor is in use, it can be switched to the next or rotated through all its positions by positioning the cursor on Switch Crystal or Rotate Head and pressing TOGL.
XTC/3 Operating Manual 3.4 Executing a Process Once a process has been defined as described in Chapter 4, it is ready to execute. START, pressed once, will start or continue the process from the point at which it was stopped. STOP freezes a process, the status information on the display is maintained and the control voltage output is set to zero. RESET, if pressed when XTC/3 is in Stop, takes a process back to the first layer.
STOP STOP ) TURRET DELAY TIME OUT PROCESS VALUES tMEMORY CHECKS tREAD CONFIGURATION tRESTORE CURRENT ON YES CRUCIBLE IN POSITION ? NO )ON/STBY YES STBY/Power FAIL SHUTTER DELAY YES SHUTTER DELAY ? NO SOAK HOLD 2 INPUT ? SOAK TIME 2 RISE TIME 2 SOAK TIME 1 RISE TIME 1 SOURCE SWITCH SAVE CURRENT PROCESS DATA NO PN 074-446-P1J YES SHUTTER DELAY ? YES NO CONTROL DELAY NO IDLE POWER ZERO ? YES MPWR ) tLOAD FILM PARAMETERS SET LAYER TO START “TO FAILURE ACTION STATE” ) NO
XTC/3 Operating Manual 1 Make sure XTC/3 is in READY or IDLE. 2 Press START. The next layer to be run will enter pre-deposition, and continue on through deposition and post-deposition. 3 When the layer is complete, XTC/3 will go to IDLE. If AutoStart Next Layer (XTC/3M only) has been set to Yes in the Process sub-screen of the General Parameter display, the next layer, if there is one, will be started automatically. If not, press START again to begin the next layer. Repeat until the process is complete.
XTC/3 Operating Manual 3.5 State Descriptions Table 3-1 State descriptions STATE CONDITION RELAY CONTACT STATUS Source Shutter Sensor Shutter PN 074-446-P1J NOTE: The following are Pre-Deposit states. Associated parameters are shown in the CONDITION column surrounded by the [ ] left and right square brackets. READY XTC/3 will accept a START command. Rate is displayed and Thickness is accumulated. Inactive Inactive CRUCIBLE SWITCH XTC/3 advances to next state when the Cruc Valid input is low.
XTC/3 Operating Manual Table 3-1 State descriptions (continued) STATE CONDITION RELAY CONTACT STATUS Source Shutter Sensor Shutter NOTE: The following are Deposit states. CONTROL DELAY (Deposit state) Constant Power at Soak Power 2. Begins rate control when the control delay time elapses. [Delay Option, Control Delay, Control Delay Time] Active Active DEPOSIT Thickness zeroed upon entry or reset to stored value on Stop/Start without Reset. Rate control.
XTC/3 Operating Manual Table 3-2 Output states Output Active Inactive Source Shut 1 In any deposit state When leaving control states In shutter delay or any deposit state. In RateWatcher Sample Closes when leaving control states. In RateWatcher Hold Source Shut 2 1 1 Sensor Shut 1 Sensor Shut 2 PN 074-446-P1J Note 1: In XTC/3S, Sensor Shut 1 and Sensor Shut 2 outputs are used to perform the crystal switch function if a multi-position sensor has been selected.
XTC/3 Operating Manual Table 3-2 Output states (continued) Output Active Inactive When each State starts, the old and new state output are set or cleared as necessary When each State starts, the old and new state output are set or cleared as necessary Max Power (M only) When power reaches max power When power is not at max power Rate Dev Fail (M only) When the rate deviation is greater than 5% or 0.
XTC/3 Operating Manual Table 3-2 Output states (continued) Output Active Inactive Shutter Delay Fail (M only) Shutter delay is enabled and the rate deviation is greater than 5% or 0.5 Å of the desired rate for 60 seconds When Start or Reset is done If Stop on alarms is set to No, the unit will give the error but will not do anything else. It stays in Shutter Delay and controls power to acquire correct rate. If rate comes into specified range, then the output is cleared.
XTC/3 Operating Manual 3 - 22 Input Function Description Cruc 2 Valid (M only) Application of a ground reference voltage from the crucible rotation mechanism is used to signal that the proper crucible for Source 2 has indexed into position and state sequencing may proceed Reset (M, S if Film Select option used) Detection of a falling edge effects a RESET if in Stop.
XTC/3 Operating Manual 3.5.1 Alarms and Stops There are a number of unusual XTC/3 situations that may require operator attention. These situations are detected and then treated as ALARMS or STOPS. Both ALARMs and STOPs can be indicated by a separate relay closure (by default or selected assignment in XTC/3M, by fixed assignment in XTC/3S). An ALARM condition is not fatal, XTC/3 will continue the layer or process to normal termination. A STOP is fatal, immediately halting the process.
XTC/3 Operating Manual A CRYSTAL FAIL detected during the DEPOSIT state if the Time Power parameter (Option sub-screen of the Film Parameter display ) is set to No (when crystal switching is not available). Following the POST-DEPOSIT states of a layer when the DEPOSIT state completes in TIME POWER. Any of the ALARM conditions listed in section 3.5.1.1 above if the Stop on Alarms or Stop on Max Power configuration is activated (Process sub-screen of General Parameter display). 3.5.1.
XTC/3 Operating Manual 3.6.2 Ion Assisted Deposition This feature will activate the designated output if the film currently running is in Deposit and the Ion Assist Deposit parameter in the Option sub-screen of the Film Parameter display is set to Yes. 3.6.3 Control Delay When the source shutter opens at the start of deposition, there often is a significant rate spike due to the sudden heat load arriving at the crystal.
XTC/3 Operating Manual accessible. If rate control is not achieved (see page 4-14) the Delay Failure Alarm message appears. If Stop on Alarms is in the default setting of No, the power continues to increment until Max Power is reached. 3.6.7 Crucible Switching Crucible position output lines can be used to control evaporation sources with up to eight crucible positions.
XTC/3 Operating Manual A crystal (sensor in the case of Dual Head) switch will automatically occur when: XTC/3 is configured for a CrystalTwo or Dual Head sensor type, a film is STARTed or running and there is another good crystal available when the active crystal fails. XTC/3 is configured for a CrystalSix or Crystal12, a film is STARTed or running, and there is at least one good crystal left in the carousel when the active crystal fails.
XTC/3 Operating Manual The Crystal Fail state can be cleared by pressing TOGL in the Sensors screen with the cursor on Clear Failed Crystals or by powering down and up again. In both cases, XTC/3 will run the next layer using the last crystal position it switched to.
XTC/3 Operating Manual During deposition, XTC/3 will automatically switch to the next position with a good crystal when there is a crystal failure. When the last good crystal fails, XTC/3 will go directly to Time Power or STOP, as appropriate. When configured for a Crystal12 sensor, the relay contacts are only pulsed closed for one second then opened again once for each position. There is no intermediate position. 3.6.8.
XTC/3 Operating Manual 3.6.8.6 XTC/3S Sensor Shutter / CrystalSwitch Output Due to limitations imposed by the fixed I/O functions in XTC/3S, the function of the Sensor Shutter outputs depends on the Sensor Type setting in the Hardware sub-screen of the General Parameter display. If a single head sensor type is chosen, the Sensor Shutter relay contacts are set to be inactive.
XTC/3 Operating Manual 3.6.10 RateWatcher It is easy to automatically sample the deposition rate periodically and then maintain the proper source power level necessary to keep the rate at the set point for extended periods of time. With inherently stable deposition sources such as the planar magnetron, an occasional check of the rate (with the associated automatic recomputation of the necessary power level) is all that is needed.
XTC/3 Operating Manual When XTC/3 is placed in the Manual Power mode by pressing the MPWR key, power is affected by moving the POWER/STOP switch laterally. A STOP is produced by pressing POWER/STOP. A crystal switch is activated by pressing the red button on the body of the XTC/3. This action alternates the active crystal of a dual head configuration or advances the multi-position sensor to the next available crystal. NOTE: Upon leaving the MANUAL POWER state, XTC/3 enters the DEPOSIT state.
XTC/3 Operating Manual 6 Average Power = xx.x % 7 S Value = 0 to 9999 8 Q Value = 0 to 99 9 Begin Frequency = xxxxxxxx.x Hz 10 End Frequency = xxxxxxxx.x Hz 11 Xtal Life = xx % (0 - 99) 12 Normal Completion or 13 End On Time Power or PN 074-446-P1J 14 End In Stop from (Stop Reason).
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XTC/3 Operating Manual Chapter 4 XTC/3 Programming 4.1 Overview The following basic procedure is used to program XTC/3. If a lock code has been programmed, it must be entered after cursoring to the Lock Code on the Menu screen. (All steps do not necessarily have to be followed in the given order.) 1 Make sure XTC/3 is in READY. Some configuration and process parameters can be changed only while XTC/3 is in READY.
XTC/3 Operating Manual 4 Configure General Parameters From the General Parameter display, three sub-screens can be accessed: Process; Hardware; and Comm Info. The Process screen provides for a number of selections including which process (XTC/3M) or film (XTC/3S) to run. The Hardware screen allows selecting the sensor type, source control voltage range and polarity, chart recorder mode, audio feedback and LCD dimmer time.
XTC/3 Operating Manual 4.2 Film Set Up Overview 4.2.1 Film Set Up The film screen appears after pressing the MENU key, then cursoring down to Film Parameter and pressing Menu. Figure 4-1 Main Menu screen XTC/3M PN 074-446-P1J Figure 4-2 Pre/Post Film Programming Screen From the Film Parameter display, Pre/Post, Deposit, Sensor, Source and Option screens can be entered by cursoring to the respective label. The ◄► keys move between the selection (left) panel and the parameter (right) panel.
XTC/3 Operating Manual 4.2.2 Film Definition A film is defined by the parameters needed to run it, including sensor and source numbers, source heat-up and cool down parameters, deposition rate and final thickness, material parameters, control loop parameters, etc. XTC/3M can define 32 films which can be named. All films will start with defaulted values for the parameters. These can be modified in any order. A film becomes a layer in a process when its film number is selected in the process.
XTC/3 Operating Manual 4.2.3 Film Definition Parameters The Film parameters are entered in the Pre/Post, Deposit, Sensor, Source and Option screens. 4.2.3.1 Pre/Post Deposition Parameters RISE TIME 1 . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s This parameter provides the time period over which the source power is ramped from 0 to SOAK POWER 1. The default value is 00:00. SOAK POWER 1 . . . . . . . . . . . . . . . 0.
XTC/3 Operating Manual Idle Ramp The next two parameters define an idle ramp provided to maintain the control voltage power level after the Deposit state. Control voltage is ramped from the power level at the end of the Deposit state to the Idle Power level. The control voltage is maintained at the Idle Power level until XTC/3 enters STOP or until the next layer, using the specified source, is started, or the turret source is rotated.
XTC/3 Operating Manual 4.2.3.2 Deposit Figure 4-3 Deposit Film Programming screen FILM NUMBER . . . . . . . . . . . . . . . . 1 to 32 (XTC/3M) 1 to 9 (XTC/3S) RATE . . . . . . . . . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/s This specifies the rate at which the deposition is to be controlled during the DEPOSIT and Shutter Delay states. A value of 0.0 Å/sec allows skipping of the deposit state. The default value is 0.0 Å/sec. FINAL THICKNESS . . . . . . . . . . . . . 0.000 to 999.
XTC/3 Operating Manual RW ACCURACY . . . . . . . . . . . . . . . 1 to 99% During the rate sampling period, the deposition rate is measured by the crystal and source power control is active. When the measured rate is within the desired accuracy continuously for five seconds, the shutter is closed and the deposition state returns to HOLD. The minimum accuracy is 1% or 0.5 Å/s, whichever is greater. The default value is 5%. RW HOLD . . . . . . . . . . . . . . . . . . . .
XTC/3 Operating Manual Tooling is a correction factor used for correlating the rate and thickness accumulation on the crystal with the thickness accumulation on the substrate. This thickness difference is due to the geometric distribution of material flux from the source. The tooling factor is calculated using the equation: Tm Tooling = TF i ------- Tx [1] where TFi = Initial Tooling Factor, Tm = Actual Thickness at the Substrate, and Tx = Thickness on the Crystal.
XTC/3 Operating Manual and/or the shutter closes, the crystal frequency will decrease due to cooling. Because small increases in frequency may normally and unavoidably occur, values of 1 to 24 are not allowed for the Single and Total Stability parameters to prevent false triggering of crystal fails. NOTE: Stability is disabled in Etch mode. SINGLE . . . . . . . . . . . . .
XTC/3 Operating Manual 4.2.3.4 Source Parameters Figure 4-5 Source Film Programming screen SOURCE . . . . . . . . . . . . 1, 2 This parameter determines which source output is to be used for source control voltage for the material being defined. The default is 1. This parameter cannot be changed while the film is running. CRUCIBLE . . . . . . . . . . . 0 to 8 PN 074-446-P1J This parameter can be used to automatically index the turret position when using a multiple pocket turret source.
XTC/3 Operating Manual CONTROL GAIN . . . . . . 0.01 to 100.0 Å/sec/% Pwr This parameter determines the change in % Power for a given rate deviation (dRate/dPower). The larger the process gain value, the smaller the change in power for a given rate error. The default is 10 Å/s/% Pwr. Figure 4-6 Control Gain Å/s % P R A W delta Rate = 10 T E O 20 10 20 E R delta Power = 1 19 0 TIME CONTROL GAIN = dRate / dPower = 10/1 = 10 TIME CONSTANT . . . . . 0.1 to 100.
XTC/3 Operating Manual DEAD TIME . . . . . . . . . . 0.1 to 100.0 sec This value is defined as the time difference between a change in % power and the start of an actual change in rate. The default value is 1. Figure 4-8 Dead Time Control DT P Rate R A O W Power T E E R RATE INCREASE POWER INCREASE TIME MAXIMUM POWER . . . . 0.0 to 100.0% This parameter is used to set the maximum permissible % power level. The control voltage output will not exceed this limit. The default value is 100.0%.
XTC/3 Operating Manual 4.2.3.5 Option Figure 4-9 XTC/3M Option Film Programming screen TIME POWER . . . . . . . . Yes / No using TOGL key. Default is No. Once in the Time-Power state, the source power will remain at the four seconds average power value of the source control output computed two seconds prior to the failure. (These times are appropriately modified for PID control.) Thickness is accumulated at the programmed deposition RATE value.
XTC/3 Operating Manual to a well controlled rate of evaporant flux. If the required rate control accuracy cannot be achieved within sixty seconds, the Delay Failure alarm message will appear. If Stop on Alarms has been set to Yes, the layer will STOP at the same time. Control. . . . . . . . Control Delay state. The Deposit state is entered and the Control Delay suspends control loop action on the source control power for the time interval programmed in Control Delay Time.
XTC/3 Operating Manual 4.3 Process Set-Up Overview (XTC/3M only) Figure 4-10 Main Menu screen In XTC/3M, the Process display appears after pressing the MENU key, then cursoring down to Process List and pressing Menu. XTC/3S does not have the Process List menu option. To delete a film, cursor to the film to be deleted in the process list. Press the 0 key followed by the ENTER key. The only restriction on deletion is that the Process to Run found on the General Screen Process page can not be empty.
XTC/3 Operating Manual 4.3.1 Process Definition Figure 4-11 Process screen 4.3.1.1 Process Number PROCESS . . . . . . . . . . . 1 to 99 Upon entering the Process screen, the process displayed will be the one displayed when this screen was last left. A different process can be displayed by moving to the process number parameter and entering the new process number. 4.3.1.2 Process Name PN 074-446-P1J NAME . . . . . . . . . . . . . . . Accepts up to 15 alphanumeric characters.
XTC/3 Operating Manual Entering a film number between 1 and 32 next to a layer number, followed by the ENTER key, will place the desired film in that layer. If a film number was previously entered, it will be replaced. Entering a 0 will delete the specified film and shift all following films up. It is possible to insert a film into an existing film sequence by cursoring to the desired layer and selecting the right arrow key. This action will shift the layer list down to accommodate the added layer.
XTC/3 Operating Manual 4.4.1 Process Parameters Figure 4-13 XTC/3M Process screen PN 074-446-P1J Figure 4-14 XTC/3S Process screen PROCESS TO RUN . . . . . . . 1 to 99 (XTC/3M only) Selects the process to be run. Only processes with layers may be entered. The default is 1. This function is not available in XTC/3S. FILM TO RUN . . . . . . . . . . . 1 to 9 (XTC/3S only) Selects the film to be run. The default is 1. This function is not available in XTC/3M.
XTC/3 Operating Manual AUTOSTART NEXT LAYER Yes / No (XTC/3M only) Press the TOGL key to move through the choices. Default is No. Yes enables automatically starting the next layer in the process when the previous layer reaches the Idle state, unless that layer is the last layer in the process. This function is not available in XTC/3S. START WITHOUT BACKUP Yes / No Press the TOGL key to move through the choices. This option is pertinent only when a multi-position sensor is in use.
XTC/3 Operating Manual LOCK CODE . . . . . . . . . 1 to 9999 The L Lock lock code is set by moving to the Lock Code XXXX and entering the desired code of up to 4 digits. If no lock code is desired, no entry needs to be made. Entering a 0 will clear a previously set lock code and allow open access to all parameters. (Note, if there was previously a lock code programmed, the code must first be entered on the Menu screen, with the cursor positioned on Lock Code.
XTC/3 Operating Manual RECORDER MODE . . . . Rate, Thickness, Power, Rate Deviation. Press the TOGL key to move through the choices. Default is Rate. RANGE . . . . . . . 100, 1000 Press the TOGL key to move through the choices. Default is 1000. Rate clips at range value. Thickness is done modulo the range, meaning each time the full scale value is exceeded, the recorder output returns to 0 and starts to ramp up again to produce a sawtooth output. The Recorder output voltage is 0 to +10 V.
XTC/3 Operating Manual 4.4.2.1 XTC/3S Film Select Option Figure 4-16 XTC/3S Film Select INPUT OPTION . . . . . . . . . . . . . . . . Standard, Film Select (XTC/3S only) Press the TOGL key to move through the choices. Default is Standard. Selecting the Film Select option allows selecting one of the 9 films based on the state of the Film Select inputs 5, 6, 7 and 8 as shown in the table below. In addition, input # 4 is reassigned to perform the RESET function.
XTC/3 Operating Manual 4.4.3 Comm Info Figure 4-17 Comm Info Screen with TCP/IP Option installed PN 074-446-P1J NOTE: IP address and net mask are initialized 1 minute after power-up. IP address and net mask text are grayed if no TCP/IP option is installed or if communication cannot be established. See section 6.3.3 on page 6-17.
XTC/3 Operating Manual 4.4.3.1 Remote Communication Parameters RS-232 BAUD RATE. . . . . . . . . . . . . . . . . . . 9600, 19200, 38400, 57600, 115200 Press the TOGL key to move through the choices. Default is 115200 PROTOCOL RS232 . . . . . . . . . . . . . Standard, Datalog, XTC/2 Ck Sum, XTC/2 No Ck Sum, XTC/C Ck Sum, XTC/C No Ck Sum Press the TOGL key to move through the choices. Default is Standard. See section 5.2 on page 5-6. Datalog returns response described under section 5.2.2.
XTC/3 Operating Manual 4.5 I/O Overview Figure 4-18 XTC3/M Main Menu screen The I/O Map display appears after pressing the MENU key, then cursoring down to I/O Map and pressing MENU. PN 074-446-P1J Figure 4-19 XTC/3M All I/O screen The All I/O screen displays the complete digital I/O map. The functions of inputs 1 to 9 are shown in the upper portion of the screen and the status of the outputs is shown on the lower portion of the screen. Active outputs are highlighted.
XTC/3 Operating Manual 4.5.1 XTC/3S Inputs and Outputs In XTC/3S, the fixed I/O will be displayed on the I/O Map screen. The assignment of the 9 fixed inputs corresponds to the default assignments in XTC/2. Also, refer to section 4.4.2.1, XTC/3S Film Select Option, on page 4-23 for inputs. All relay (1 to 12) and TTL Open Collector outputs (13 to 20) are fixed to perform the functions shown on the screen. These function assignments are identical to the default configuration provided in XTC/2 per section 2.
XTC/3 Operating Manual 4.5.2 XTC/3M Inputs Figure 4-22 Inputs screen 1 (XTC/3M only) In XTC/3M, this screen allows modification of the 9 inputs. On the right side of the parameter panel will be a column of the inputs as they are currently programmed. There will be blanks if the input is not defined. For the complete list of input functions available for XTC/3M, see Table 3-3 on page 3-21. The scrollable list of allowed input functions will be displayed on the left side of the parameter panel.
XTC/3 Operating Manual 4.5.3 XTC/3M Outputs The Relay Outputs and TTL Outputs screens allow modification of the 12 relays or the 8 TTL outputs, respectively. All relays (1 to 12) and TTL Open Collector outputs (13 to 20) are selectable to perform the functions shown on the screen. Any number of outputs may be assigned to the same function. The default assignments are identical to the default configuration provided in XTC/2 and referenced above.
XTC/3 Operating Manual Figure 4-25 Relay Outputs 2 Figure 4-26 Relay Outputs 3 PN 074-446-P1J Figure 4-27 Relay Outputs 4 4 - 30
XTC/3 Operating Manual Figure 4-28 TTL Outputs NOTE: Three additional selection screens, identical to those for the Relay outputs, are available for selecting additional TTL Outputs. NOTE: Three consecutive relay or TTL outputs must be available when selecting the BCD output function, Cruc Src 1 BCD or Cruc Src 2 BCD. All three outputs will be inactive for position 1, all three outputs will be active for position 8. The first output in the sequence is the LSB.
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XTC/3 Operating Manual Chapter 5 Remote Communications 5.1 Remote Communications Overview XTC/3 may be remotely controlled, programmed or interrogated. This is accomplished through remote communications and the use of a remote command set. XTC/3 will respond to messages that contain these commands. It will accept and operate on messages one at a time. It will respond to each command by carrying out valid operations and/or returning a message to the sender.
XTC/3 Operating Manual 5.1.2 Physical Connections Two types of data communications hardware ports are available. Standard equipment includes a bit serial RS-232C port. Optionally, a TCP/IP port may be added. Generally speaking, both the host and server must have the same form of communications equipment and complementary set-up. For serial communications, baud rates must match and so must the data word format.
XTC/3 Operating Manual 5.1.4.2 How to Set Up the Network Protocol on the PC Most personal computers are configured to obtain the IP address, an address which defines the computer on the Internet, automatically from a server. To communicate directly with XTC/3, the Internet protocol (IP) on the PC must be configured manually and an ethernet crossover cable (PN 600-1211-P5) must be connected between the PC and XTC/3. Some PC’s will autoconfigure and work with either straight or crossover cable.
XTC/3 Operating Manual Figure 5-2 Local Area Connection Properties On the General tab, select Internet Protocol (TCP/IP) and press the Properties button, as shown in Figure 5-3.
XTC/3 Operating Manual Select the button for Use the following IP address, enter the IP address: and Subnet mask: shown in Figure 5-4, and press OK. With this selection, the PC is assigned an IP address to use when communicating with XTC/3. XTC/3 is shipped from INFICON with a pre-assigned address of 10.211.70.203. To communicate directly with XTC/3 from a PC, the PC must also be assigned an address that starts with 10.211.70 but cannot be set to 10.211.70.203.
XTC/3 Operating Manual 5.2 Standard Protocol Message Format This message format is in effect if Standard has been selected under the RS-232 Protocol parameter and is always in effect for the TCP/IP port. All messages are comprised of serial byte information. The byte values represent command or response characters, control characters, or numeric values. Mnemonics will be used to describe portions of each message format.
XTC/3 Operating Manual Command Sub-group = 1 ASCII byte, used with some command groups to further specify commands. For command Q and U: F – Film G - General I - Input N - Film Name O - Output P - Process T - Output Type No sub-groups are allowed for H, E, S or R. Command ID = 1 binary byte. Defines specific command within some command groups and sub-groups.
XTC/3 Operating Manual 5.2.1.2 Standard Response Packet (XTC/3 to Host Message) Length . . . . . . . . . . . . . . . . . . . . . . . 2 bytes Low / High (not including checksum or length bytes). Numeric value from 0 to 57,800 (two bytes) representing the number of characters in the Response Packet including CCB, Timer, and Response Message. Length bytes and Checksum are not included in Length Count. Two byte values, high and low order, represent this number.
XTC/3 Operating Manual Response Error Code = 1 byte ASCII A= Illegal Command B = Illegal parameter value C = Illegal ID D = Illegal format E = Data not available F = Cannot do now (some commands require XTC/3 to be in Ready/Stop). L = Length Error, must be greater than 0 and equal to or less than 57,800. O = Not enough room for response size. P = Prior command failed (if one command of a multiple command packet fails, none of the following commands will be done, and this error code will be returned).
XTC/3 Operating Manual 5.2.2 Standard Communication Commands NOTE: The following only include the “command” portion of the command packet and the “response” portion of the response packet. The headers/trailers are assumed. (See Protocol documentation above for their definition.) General definitions = 4 byte, single precision ANSII standard floating point, low end first = 4 byte, signed integer, low end first = variable length, null terminated ASCII characters 5.2.2.
XTC/3 Operating Manual 5.2.2.3 Standard QUERY Commands 5.2.2.3.1 Query Block Command: QB Command ID = See listing below Response: Depends on Command ID. See listing that follows Command ID = 1 ”All Parameters” The command will return all parameters in the following order. Formats are listed in the individual commands. Maximum bytes allowed in the response are 57,800. A Command Length error code L is returned if there is too much data.
XTC/3 Operating Manual Response: …
XTC/3 Operating Manual 5.2.2.3.2 Standard Query Film Name (XTC3/M only) Command: QN Film Number = 1-32 Response: (maximum 15 characters, plus terminating null character) String = Null terminated series of ASCII characters 5.2.2.3.3 Standard Query Film Parameters Command: QF Command ID = See “UF Command ID” column in Table 5-2 on page 5-22.
XTC/3 Operating Manual 5.2.2.3.
XTC/3 Operating Manual 22 (Select Process 1-64, 6 bits, bit 5) 23 (Select Process 1-64, 6 bits, bit 6) 24 Select Process 1-99, 7 bits* 25 (Select Process 1-99, 7 bits, bit 2) 26 (Select Process 1-99, 7 bits, bit 3) 27 (Select Process 1-99, 7 bits, bit 4) 28 (Select Process 1-99, 7 bits, bit 5) 29 (Select Process 1-99, 7 bits, bit 6) 30 (Select Process 1-99, 7 bits, bit 7) 31 Switch Crystal 32 Non-Deposit Hold 33 Zero Film Time 34 Start Inhibit 35 Soak 1 Hold * Querying an input that corresponds to a second
XTC/3 Operating Manual 2 Source Shutter 2 3 Sensor Shutter 1 4 Sensor Shutter 2 5 Stop 6 End of Process 7 Thickness Setpoint 8 Crystal Fail 9 Alarms 10 Source in use (Open=1; closed=2) 11 Final Thickness 12 End of Film 13 In Layer 14 Ion Assisted Deposition 15 Crystal Switcher 1 16 Crystal Switcher 2 17 Ready 18 Crucible Switching 19 Rise 1 20 Soak 1 21 Rise 2 23 Shutter Delay 24 Deposit 25 Rate Ramp 26 Manual 27 Time Power 28 Idle Ramp 29 Idle 30 Max Power 31 Rate Deviation Error 32 Crystal Switcher Fail
XTC/3 Operating Manual 33 Crystal Switching 34 Crucible Switcher Fail 35 Shutter Delay Error 36 Computer Control 37 Crucible Select Source 1 Binary (8 outputs required, one/position)* 38 (Crucible Select Source 1 Binary, bit 2) 39 (Crucible Select Source 1 Binary, bit 3) 40 (Crucible Select Source 1 Binary, bit 4) 41 (Crucible Select Source 1 Binary, bit 5) 42 (Crucible Select Source 1 Binary, bit 6) 43 (Crucible Select Source 1 Binary, bit 7) 44 (Crucible Select Source 1 Binary, bit 8) 45 Crucible Select
XTC/3 Operating Manual 5.2.2.3.7 Standard Query Output Type Definition (XTC/3M Only) Command: QT
XTC/3 Operating Manual Command ID = 3 "Specific Layer" = <2 Bytes>Desired Layer Response: 1-32, film number of given layer 5.2.2.4 Standard UPDATE Commands 5.2.2.4.
XTC/3 Operating Manual All General parameters (4 bytes per parameter) All parameters for each film (4 bytes per parameter) (9 or 32 films based on XTC/3S or XTC/3M) All input definitions (9) (1 byte per input) (XTC/3M only) All output definitions (20) (1 byte per output) (XTC/3M only) All output types (20) (1 byte per output) (XTC/3M only) All Film Names (null terminated) (32 films based on XTC/3M only) List of parameters for Command ID 3 = (XTC/3M only) …
XTC/3 Operating Manual 5.2.2.4.3 Standard Update Film Parameters Command: UF Command ID = . See “UF Command ID” column of Table 5-2. Film Number = 1-9 (XTC/3S ) or 1-32 (XTC/3M) Parameter Value = | Integer = 4 byte, low to high Float = 4 byte, ANSII standard, single precision, low to high Description: Type of parameter value depends on command ID, see “DataType / Format” column of Table 5-2.
XTC/3 Operating Manual 5 - 22 UF (0x5546) Command ID Name Units / Allowed Values / Notes Data Type / Format Low Limit High Limit 0 (0x00) Rise Time 1 MM:SS (Seconds) Int 0 99:59 (5999) 1 (0x01) Soak Power 1 % Float xxx.x 0.0 100.0 2 (0x02) Soak Time 1 MM:SS (Seconds) Int 0 99:59 (5999) 3 (0x03) Rise Time 2 MM:SS (Seconds) Int 0 99:59 (5999) 4 (0x04) Soak Power 2 % Float xxx.x 0.0 100.
XTC/3 Operating Manual PN 074-446-P1J Table 5-2 Standard film parameters (continued) UF (0x5546) Command ID Name Units / Allowed Values / Notes Data Type / Format Low Limit High Limit 14 (0x0e) RW Hold Time MM:SS (Seconds) Int 0 99:59 (5999) 15 (0x0f) Sensor Cannot change if film is running Int 1 2 16 (0x10) Tool Factor 1 % Float xxx.x 10.0 500.0 17 (0x11) Tool Factor 2 % (only active if sensor type = CrystalTwo Float xxx.x 10.0 500.
XTC/3 Operating Manual UF (0x5546) Command ID Name 29 (0x1d) Z-Ratio 30 (0x1e) Time Power 31 (0x1f) Delay option Data Type / Format Low Limit High Limit Float x.xxx xx.xx xxx.x 0.100 9.999 1=Yes, 0 = No Int 0 1 0 = None 1 = Shutter 2 = Control 3 = Both Int 0 3 Units / Allowed Values / Notes 32 (0x20) 1Transfer Sensor 1=Yes, 0 = No Cannot change if film is running Int 0 1 33 (0x21) 1Transfer Tooling % Float xxx.x 10.0 500.
XTC/3 Operating Manual 5.2.2.4.4 Standard Update General Parameters Command: UG Command ID = See “UG Command ID” column of Table 5-3. Parameter Value = | Integer = 4 byte, low to high Float = 4 byte, ANSII standard, single precision, low to high Description: Type of parameter value depends on command ID, see “DataType” column of Table 5-3.
XTC/3 Operating Manual Name Units / Allowed Values / Notes Data Type / Format Low Limit High Limit Sensor 1 Type 0 = Single 1 = CrystalTwo 2 = CrystalSix 3 = Crystal12 4 = Rotary 5 = Dual Head Int 0 5 0 = Single 1 = CrystalTwo 2 = CrystalSix 3 = Crystal12 4 = Rotary (On Query only: 5 = Dual Head) Int 0 4 (5 for Query command) 0 = 0 to +10 1 = 0 to -10 2 = 0 to +5 3 = 0 to -5 4 = 0 to +2.5 5 = 0 to -2.
XTC/3 Operating Manual Table 5-3 Standard general parameters (continued) UG (0x5547) Command ID Name Units / Allowed Values / Notes Data Type / Format Low Limit High Limit 15 (0x0f) RS232 Communications Protocol 0 = Standard RS232 1 = Datalog 2 = XTC/2 w/checksum 3 = XTC/2 no checksum Int 0 3 Auto Start Next Layer (XTC/3M only) 1 = Yes, 0 = No Int 0 1 Input Option (XTC/3S only) 0 = Standard 1 = Film Select 16 (0x10) 1All 255 (0xff) 1 Cannot Parameters (Must be in Ready) change when a fi
XTC/3 Operating Manual 5.2.2.4.7 Standard Update Output Type Definition (XTC/3M Only) Command: UT
XTC/3 Operating Manual 5.2.2.5 Standard STATUS Commands Command: S () - see special case S0 below. Command ID = See “S Command ID” column in Table 5-4. Action Value = , only required for S0. S0 command: The S0 command requires a timer tick to be sent. Timer ticks increment internally from 0 to 256 (0x00 to 0xFF) at a rate of 4x per second.
XTC/3 Operating Manual S (0x53) Command ID Description Response: Description (Data Format) Units -Detail- 0 (0x00) Process Information: (only valid for specific timer tick requested) Returns the following for the timer tick (0x00 to 0xFF) sent Crystal Status (1 byte) Bit 0 - 0 = Good, 1 = Failed Crystal Bit 1 - 0 = Not Switching, 1 = Switching crystal Bit 2 - 0 Good Reading, 1 = Invalid Reading (reading is invalid during resonance recovery time of several seconds following loss of sensor crystal frequ
XTC/3 Operating Manual Table 5-4 Standard Status commands (continued) S (0x53) Command ID PN 074-446-P1J 4 (0x04) Description Response: Description (Data Format) Units -Detail- Current State (Byte) - Decoded as follows: 0 = Ready 1 = Crucible Switch 2 = Rise 1 3 = Soak 1 4 = Rise 2 5 = Soak 2 6 = Shutter Delay 7 = Deposit 8 = Rate Ramp 9 = Manual 10 = Time Power 11 = Idle Ramp 12 = Idle 5 (0x05) Current State Time (Int) - Number of seconds - 6 (0x06) Active Layer (Int) 7 (0x07) Active Film (B
XTC/3 Operating Manual Table 5-4 Standard Status commands (continued) Response: Description (Data Format) Units -Detail- 14 (0x0e) Xtal Fail (Byte) 0 = good crystal / not in Xtal Fail; 1 = failed crystal / in Xtal Fail 15 (0x0f) Max Power (Byte) 0 = false not in max power; 1 = true in max power 16 (0x10) Crystal Switching (Byte) 0 = not switching; 1 = switching 17 (0x11) End of process (Byte) 0 = False; 1 = True 18 (0x12) Stop (Byte) 0 = False; 1 = True Data Log Returns data as follows Laye
XTC/3 Operating Manual Table 5-4 Standard Status commands (continued) S (0x53) Command ID 31 (0x1f) 32 (0x20) PN 074-446-P1J 33 (0x21) 34 (0x22) 35 (0x23) Description Response: Description (Data Format) Units -Detail- Rolling Average (Float) Å/Sec Returns a rolling 6.25-second average of the measurement rate. Updated every 0.25 seconds. Active Crystal (Byte) Crystal of the current sensor that is in use. Status Messages (4 bytes) Each bit indicates which status message is displayed.
XTC/3 Operating Manual 5.2.2.6 Standard REMOTE Commands R () Command ID = . See "R Command ID" column in Table 5-5. Action Value = | Float = 4 byte, ANSII standard, single precision, low to high A few commands have a value with them. See Table 5-5. Response = None (Just header and trailer) Table 5-5 Standard remote commands Description 0 (0x00) Start Starts the next layer of the active process.
XTC/3 Operating Manual Table 5-5 Standard remote commands (continued) PN 074-446-P1J R (0x52) Command ID Function Description 13 (0x0d) Final thickness trigger Causes the active film to react as if the final thickness was reached. 14 (0x0e) Crystal switch If a multi-crystal sensor is attached to the unit, it will switch to the next position. 15 (0x0f) Enter comm. I/O mode XTC/3S only.
XTC/3 Operating Manual Table 5-5 Standard remote commands (continued) R (0x52) Command ID 28 (0x1c) Function Clear S and Q counts Description Clears the accumulated stability and quality counts. 5.3 XTC/2 Protocols One of these protocols is in effect if XTC/2 Ck Sum, XTC/2 No Ck Sum, XTC/C Ck Sum or XTC/C No Ck Sum has been selected under the RS-232 Protocol parameter. TCP/IP always uses the Standard protocol. Unlike XTC/3’s standard protocol, which is binary based, XTC/2 protocols are ASCII based.
XTC/3 Operating Manual 5.3.2 XTC/2 Serial Communication with Checksum This portion of the protocol is in effect in addition to the portion described under section 5.3.1 above if XTC/2 Ck Sum or XTC/C Ck Sum has been selected under the RS-232 Protocol parameter. ACK . . . . . . . Command acknowledged character, ASCII character value d06, Control F from keyboard. NAK . . . . . . . Command not acknowledged character, ASCII character value d21. STX . . . . . . .
XTC/3 Operating Manual 5.3.
XTC/3 Operating Manual 5.3.5 XTC/2 Message Strings 5.3.5.1 XTC/2 ECHO Command Echoes the message, i.e., returns the sent message. The format is: E message string 5.3.5.2 XTC/2 HELLO Command The HELLO command will return the string XTC/y VERSION x.xx where y is 2 or C, depending on the RS232 protocol set, and x.xx is the software revision code. The format is: H 5.3.5.3 XTC/2 QUERY Command The Query command returns information concerning current XTC/3 parameter values.
XTC/3 Operating Manual XTC/2 PP XTC/3 Parameter Range 12 Xtal Switch S 0 - 9 (See XTC/2 manual section 4.6) 13 Xtal Switch Q 0 - 9 (See XTC/2 manual section 4.6) 14 Tool Factor 1 10 - 500.0 15 Tool Factor 2 10 - 500.0 16 Deposition Rate 0 - 999.9 17 Final Thickness 0.0 - 999.9 18 Thickness Spt 0.0 - 999.9 19 Density 0.5 - 99.99 20 Z-Ratio 0.1 - 9.999 21 Sensor 1-2 22 Source 1-2 23 Crucible 0-8 24 Control Gain 0.01- 100.0 25 Control TC 0.
XTC/3 Operating Manual Table 5-8 Q40 command responses Command XTC/3S Response XTC/3M Response Q40 0 "a 0 0 " (a = 1 to 9, 0 = no film in layer) "a b c" (a = 1 to 32, b = 0 to 32, c = 0 to 32) Q40 1 "a" (a = 1 to 9) "a" (a = 1 to 32) Q40 2 "No Data" error "b" if b = 1 to 32 "No Data" error if b = 0 Q40 3 "No Data" error "c" if c = 1 to 32 "No Data" error if c= 0 a = Film # in Layer 1 b = Film # in Layer 2 c = Film # in Layer 3 5.3.5.
XTC/3 Operating Manual NOTE: In XTC/2 one can program a zero film number in layer two and a good film number in layer three. This is not allowed in XTC3. If a zero is programmed in layer two and there is a good film number in layer three the film in layer three is then placed in layer two. Layer three is then empty. U 40 2 v or U 40 3 v is not allowed in XTC3S since only one film is allowed in XTC3S. 5.3.5.5 XTC/2 STATUS Command Sends back information based on specific request made.
XTC/3 Operating Manual S6 . . . . . . Active layer. x S7 . . . . . . Active film x S8 . . . . . . Active sensor. x S9 . . . . . . Crystal life (%). x % to xx % S10 . . . . . Power source number. x (1 or 2) S11 . . . . . Output status - returns a string of 16 ASCII bytes, 1 per output. Each byte has an ASCII value of 0 or 1, corresponding to the output status. Response Format (Non-Checksum): Byte1............Byte16 where byte 1 corresponds to output 1.
XTC/3 Operating Manual S12. . . . . Input status - returns 9 ASCII bytes in order byte 1 to 9, 1 byte per input. Each byte has an ASCII value of 0 or 1, corresponding to the input’s status. 0 = grounded (active), 1 = open or high (inactive). Table 5-10 S12 Command Input status Input # Byte # Function 1 Start 2 Stop 3 End 4 Sample Initiate 5 Sample Inhibit 6 Crystal Fail Inhibit 7 Zero Thickness 8 Soak 2 Hold 9 Crucible Valid S13. . . . . Raw frequency - Frequency of crystal being read.
XTC/3 Operating Manual 1 = Selection active, 0 = default state for selection Also see S22 below. NOTE: In the default configuration, bits 8 and 9 will return values of 1 whereas the defaults for these bits was 0 in XTC/2. If it is desired to make the S20 response equal to XTC/2 default response, change the Recorder Range to 100 and the Audio Feedback to Yes, both per section 4.4.2 on page 4-21.
XTC/3 Operating Manual S21. . . . . Error Flag - If more than one error code exists, the response string will return them all, each separated by a single space. S21 Response Codes: 0 Error 0 2 Power Fail or STBY/ON sequence 9 Error 9 10 No Errors S22. . . . . XTC/3 configuration readout, same as S20. S30. . . . . Returns status of each crystal of a multi-head sensor. S31. . . . . Returns a rolling 6.25 second average (updated every 0.25 seconds) of the measurement rate. 5.3.5.
XTC/3 Operating Manual R12. . . . . Zero thickness. Simulates remote input or front panel ZERO keystroke. R13. . . . . Final thickness-end deposit trigger. Simulates remote input. R14. . . . . CrystalSwitch. Equivalent to front panel XTSW keystroke. R15. . . . . XTC/3S only. Enter communication I/O mode — See R16 (Only applies when in communication I/O mode) R16. . . . . XTC/3S only. Exit communication I/O mode — See R15 (Only applies when in communication I/O mode) R17. . . . .
XTC/3 Operating Manual R38 x . . . Recorder Type x (0 = Rate 0 to 100 Å/s, 1 = Rate 0 to 1000 Å/s, 2 = Thickness 0 to 100 Å, 3 = Thickness 0 to 1000 Å, 4 = Power, 5 = Rate Deviation, 6 = Rate 0 to 100 Å/s smoothed, 7 = Rate 0 to 1000 Å/s smoothed) R39. . . . . Not supported R40. . . . . Not supported R41. . . . . Not supported R42. . . . . Not supported R43. . . . . Not supported 5.3.5.7 XTC/2 Sample Host Programs 5.3.5.7.
XTC/3 Operating Manual 220 IF I$ = NAK$ THEN RETURN :’ CHARACTER IS RECEIVED GOTO PRINT RESPONSE. 230 RESPONSE$ = RESPONSE$ + I$ :’--BUILD RESPONSE STRING 240 GOTO 200 :’ CHARACTER BY CHARACTER.
XTC/3 Operating Manual 280 ’ 290 PRINT #1, STX$ + SIZEM$ + SIZEL$ + CMD$ + CHECKSUM$ 300 ’ 310 ’----RECEIVE RESPONSE MESSAGE FROM XTC/3---320 TOUT = 3: GOSUB 510 :’--SET TIMER AND WAIT FOR 330 IF I$ <> STX$ THEN 290 :’ START OF TRANSMISSION CHARACTER. 340 TOUT = 3: GOSUB 510 :’--RECEIVE HIGH ORDER BYTE 350 SIZE = 256 * ASC(I$) :’ OF TWO BYTE RESPONSE SIZE. 360 TOUT = 3: GOSUB 510 :’--RECEIVE LOW ORDER BYTE 370 SIZE = SIZE + ASC(I$) :’ OF TWO BYTE RESPONSE SIZE.
XTC/3 Operating Manual Chapter 6 Troubleshooting, Status and Error Messages 6.1 Status and Error Messages ALREADY RUNNING This message appears if a START command is given to the layer and the layer is already in progress. ALREADY SWITCHING An attempt is being made to switch a crystal or switch a crucible while a crystal switch or crucible switch is already in progress. CAN’T EMPTY ACTIVE PROCESS Can’t delete all layers in the active process.
XTC/3 Operating Manual DIGITAL INPUT Unit has gone into STOP because the designated Stop Input was activated. EMPTY PROCESS Indicates that the selected process has no layers and therefore cannot be selected to run. END OF PROCESS Indicates that the last layer in the process has reached the Idle state. ETCH MODE Indicates that XTC/3 is in the etch mode. ETHERNET IN USE Ethernet values cannot be changed at this time. ETHERNET VALUES HAVE CHANGED Changes take effect on power up.
XTC/3 Operating Manual NO MANUAL XTAL FAIL Unable to enter Manual operation. NO MANUAL IN STOP Unable to enter Manual operation. NO MANUAL IN IDLE Unable to enter Manual operation. NO OUTPUT FOR SW A rotate or switch crystal head function cannot be performed if no output has been set for the function. NO SWITCH SINGLE A crystal switch function cannot be done on a single sensor.
XTC/3 Operating Manual R LOCK Indicates XTC/3 is in a Remote Program Lock mode. This prohibits any parameter from being entered from the front panel until the lock is released via remote communications. RATE DEV ERR Indicates XTC/3 entered the Stop mode because rate control was not achieved within 60 seconds. RATEWATCH DELAY The RateWatcher feature is active. The sensor is stabilizing for 5 seconds before SAMPLE. The previous sample period’s Average Rate is being integrated for thickness.
XTC/3 Operating Manual TESTING XIU XIU test in progress. TIME POWER Indicates XTC/3 entered the Time Power mode due to a crystal failure of the last good crystal and Time Power was set to Yes. TRANSFER DELAY Indicates XTC/3 is in the transition from the pre-deposit sensor to the deposit sensor. VALUE TOO LOW Parameter entry is out of range. Allowable values will vary according to your unit configuration or the parameter being defined. Press CLEAR to delete the value and enter again.
XTC/3 Operating Manual 6.2 XTC/3 Diagnostics The initial page shows the revision level of the firmware as well as serial numbers. Figure 6-1 Diagnostics display Pressing Enter permits various test and maintenance functions.
XTC/3 Operating Manual Output Set or Clear To verify operation of outputs, cursor to the desired output and press the TOGL key. The output state and the set/clear display will change accordingly. Only active outputs, like Source 1 Shutter, Source 2 Shutter, Sensor 1 Shutter and Sensor 2 Shutter in the Figure 6-2 example above, can be toggled. The cursor will skip over greyed out, indicating they are inactive, outputs like Advance Crucible 1 and Advance Crucible 2 in the Figure 6-2 example above.
XTC/3 Operating Manual 6.3 Troubleshooting Guide If XTC/3 fails to work, or appears to have diminished performance, the following Symptom/Cause/Remedy chart may be helpful. CAUTION There are no user serviceable components within the XTC/3 case. WARNING - Risk Of Electric Shock Potentially lethal voltages are present when the line cord, Inputs or Outputs are connected. CAUTION Refer all maintenance to technically qualified personnel.
XTC/3 Operating Manual 6.3.1 Troubleshooting XTC/3 Table 6-1 Troubleshooting XTC/3 SYMPTOM 1. power on LED not illuminated 2. XTC/3 "locks" up CAUSE a. blown fuse/circuit breaker tripped a.have qualified personnel replace fuse/reset circuit breaker b. electrical cord unplugged from wall or back of XTC/3 b. reconnect power cord c. incorrect line voltage c. have qualified personnel verify line voltage a. cover or back panels not attached to XTC/3 a.
XTC/3 Operating Manual Table 6-1 Troubleshooting XTC/3 (continued) SYMPTOM 7. LCD display blank 8. poor rate control CAUSE REMEDY a. LCD or CRT/power supply problem a. contact INFICON b. LCD Dimmer Time has elapsed. b. press the cursor key to redraw the screen. a. control loop parameters improperly selected a. refer to the instruction manual section on tuning control loop parameters b. electron beam sweep frequency "beating" with XTC/3 measurement frequency b.
XTC/3 Operating Manual 6.3.2 Troubleshooting Transducers/Sensors Many sensor head problems may be diagnosed with a DVM (Digital Volt Meter). Disconnect the short oscillator cable from the feedthrough and measure the resistance from the feedthrough’s center pin to ground. If the reading is less than 1-2 MΩ, the source of the leakage should be found and corrected.
XTC/3 Operating Manual . Table 6-2 Troubleshooting transducers/sensors SYMPTOM 1. large jumps of thickness reading during deposition CAUSE REMEDY a. mode hopping due to defective crystal a. replace crystal b. stress causes film to peel from crystal surface b. replace crystal c. particulate or "spatter" from c. thermally condition the molten source striking crystal source thoroughly before deposition, use a shutter to protect the crystal during source conditioning d.
XTC/3 Operating Manual Table 6-2 Troubleshooting transducers/sensors (continued) SYMPTOM CAUSE REMEDY 3. crystal does not oscillate or a. intermittent or poor electrical a. use an ohm meter or DVM to oscillates intermittently (both in contact (contacts oxidized) check electrical continuity, vacuum and in air) clean contacts b. leaf springs have lost retentivity (ceramic retainer, center insulator) b. bend leaves to approximately 45° c. RF interference from sputtering power supply c.
XTC/3 Operating Manual Table 6-2 Troubleshooting transducers/sensors (continued) SYMPTOM 5. thermal instability: large changes in thickness reading during source warm-up (usually causes thickness reading to decrease) and after the termination of deposition (usually causes thickness reading to increase) CAUSE REMEDY a. inadequate cooling water/cooling water temperature too high a.
XTC/3 Operating Manual Table 6-2 Troubleshooting transducers/sensors (continued) SYMPTOM 6. poor thickness reproducibility CAUSE REMEDY a. variable source flux distribution a. move sensor to a more central location to reliably sample evaporant, ensure constant relative pool height of melt, avoid tunneling into the melt b. sweep, dither, or position where the electron beam strikes the melt has been changed since the last deposition b.
XTC/3 Operating Manual Table 6-2 Troubleshooting transducers/sensors (continued) SYMPTOM CAUSE 8. CrystalSix and Crystal12: a. loss of pneumatic supply, or crystal switch problem (does pressure is insufficient for not advance or not centered in proper operation aperture) b. operation has been impaired as a result of material accumulation on cover c. improper alignment REMEDY a. ensure air supply is regulated at 80-90 PSIG b.
XTC/3 Operating Manual 6.3.3 Troubleshooting Computer Communications Table 6-3 Troubleshooting computer communications SYMPTOM 1. communications cannot be established between the host computer and XTC/3 CAUSE a. improper cable connection REMEDY a. verify for correct cable wiring as described in the manual b. BAUD rate in host computer b. verify BAUD rate in the not the same as XTC/3 host's applications program, verify BAUD rate in XTC/3 c. incompatible protocols being c.
XTC/3 Operating Manual 6.4 Replacing the Crystal The procedure for replacing the crystal is basically the same with all transducers, except the Cool Drawer, RSH-600, CrystalSix and Crystal12. CAUTION Always use clean nylon lab gloves and plastic tweezers for handling the crystal (to avoid contamination which may lead to poor adhesion of the film to the electrode). Do not rotate the ceramic retainer assembly after it is seated (as this will scratch the crystal electrode and cause poor contact).
XTC/3 Operating Manual Figure 6-3 Front load single sensor (exploded) Standard Crystal Holder (PN 750-172-G1) Crystal (PN 008-010-G10) Fully Coated Face (Gold) Crystal Retainer (PN 007-023) Finger Spring Contact (PN 750-171-P1) Standard Crystal Sensor Body (PN 750-207-G1) In-Vacuum Cable to XIU Water Tubes PN 074-446-P1J 6.4.
XTC/3 Operating Manual 2 Hold the drawer by the handle and turn it upside down to remove the spent crystal. 3 Install a new crystal in the drawer. Observe its orientation. The pattern electrode should face upward as shown in Figure 6-5. 4 Hold the retainer by its sides. Align its orientation notch with the drawer then gently and evenly push the retainer down until it snaps firmly into the drawer. see Figure 6-5. Never push down (or pull up) on the contact spring, doing so may permanently damage it.
XTC/3 Operating Manual 6.4.4 Bakeable Sensor For the Bakeable sensor, the procedure is the same as the Front Load Single sensor except that the cam assembly must be unlocked by flipping it up. Once the crystal has been replaced, place a flat edge of the holder flush with the cam mechanism and lock it in place with the cam. See Figure 6-6.
XTC/3 Operating Manual 6.4.5 Sputtering Sensor Observe the general precautions for replacing crystals and follow the instructions below to replace the crystal in a sputtering sensor. 1 Grip the body assembly with your fingers and pull it straight out to separate it from the water-cooled front part. (You may have to disconnect the sensor cable in order to separate the parts.) See Figure 6-7. 2 Pull the crystal holder straight out from the front of the sensor.
XTC/3 Operating Manual 6.4.6 Crystal Snatcher Use the crystal snatcher, supplied with the sensor (excluding Cool Drawer sensors), as follows: 1 Insert crystal snatcher into ceramic retainer (1) and apply a small amount of pressure. This locks the retainer to the snatcher and allows the retainer to be pulled straight out (2). 2 Reinsert the retainer into the holder after the crystal has been replaced. 3 Release the crystal snatcher with a slight side-to-side motion.
XTC/3 Operating Manual 6.5 Crystal Sensor Emulator PN 760-601-G2 NOTE: 760-601-G2 is fully compatible with all INFICON thin film deposition controllers. The Crystal Sensor Emulator option is used in conjunction with the Thin Film Deposition Controller to rapidly diagnose problems with the Deposition Controller's measurement system. See Figure 6-9.
XTC/3 Operating Manual 6.5.1 Diagnostic Procedures The following diagnostic procedures employ the Crystal Sensor Emulator to analyze a constant Crystal Fail message. The symptom is a Crystal Fail message that is displayed by the Deposition Controller even after the monitor crystal has been replaced with a new “good” monitor crystal. 6.5.1.1 Measurement System Diagnostic Procedure 1 Refer to Figure 6-10 on page 6-24. Remove the 6 in. BNC cable from the Feed-Through at point A.
XTC/3 Operating Manual 6.5.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure 1 Refer to Figure 6-10 on page 6-24. Remove the In-Vacuum cable from the Sensor Head at point B. 2 Connect the Crystal Sensor Emulator to the In-Vacuum cable. If the XTAL Fail message disappears after approximately five seconds, the Feed-Through and In-Vacuum Cable are working properly. Re-install the In-Vacuum cable to the Sensor Head. Go to section 6.5.1.3 on page 6-27.
XTC/3 Operating Manual 11 Connect the 6 in. BNC cable to the Feed-Through and disconnect it from the Crystal Interface Unit (or Oscillator) 12 Verify electrical continuity from the center pin of the Microdot connector on the Feed-Through to the un-terminated end of the 6 in. BNC cable. 13 Verify electrical isolation from the center pin to electrical ground (Feed-Through body). If the Feed-Through/6 in.
XTC/3 Operating Manual 5 Connect the In-Vacuum Cable to the Sensor Head. Verify there is continuity (<0.2 Ω) from the finger spring contact in the Sensor Head to the center pin on the un-terminated end of the In-Vacuum cable. Verify there is isolation (>10 MΩ) between the finger spring contact and the In-Vacuum cable shield.
XTC/3 Operating Manual 6.5.3 Sensor Cover Connection The Crystal Sensor Emulator can be used to verify the measurement system for INFICON Thin Film Deposition Controllers and Monitors. However, the Crystal Sensor Emulator's Sensor Cover Connector is compatible with some sensor heads, and is incompatible with others. This is discussed in the following sections. 6.5.3.1 Compatible Sensor Heads The Sensor Cover Connection will fit the sensor heads shown in Table 6-5.
XTC/3 Operating Manual 6.5.4 Specifications Dimensions 1.58 in. diameter x 1.79 in. (40.13 mm diameter x 45.47 mm) Temperature Range 0 to 50°C Frequency PN 760-601-G2: 5.5 MHz ± 1 ppm at room temperature Materials PN 074-446-P1J 304 Stainless Steel, Nylon, Teflon®, brass. Some internal components contain zinc, tin, and lead.
XTC/3 Operating Manual Chapter 7 Calibration Procedures 7.1 Importance of Density, Tooling and Z-Ratio The quartz crystal microbalance (QCM) is capable of precisely measuring the mass added to the face of the oscillating quartz crystal sensor. XTC/3 knowledge of the density of this added material (specified in the density parameter in the Film/Source parameters set up) allows conversion of the mass information into thickness.
XTC/3 Operating Manual 6 Determine the new density value with the following equation: Tx 3 Density g cm = D 1 ------- T m [1] where: D1 = Initial density setting Tx = Thickness reading on Cygnus Tm = Measured thickness 7 A quick check of the calculated density may be made by programming XTC/3 with the new density value and observing that the displayed thickness is equal to the measured thickness, provided that XTC/3's thickness has not been zeroed between the test deposition and enterin
XTC/3 Operating Manual 7.4 Laboratory Determination of Z-Ratio A list of Z-values for materials commonly used is available in the Material Library. For other materials, Z can be calculated from the following formula: 1 -- d q q 2 Z = ------------ df f [3] 5 Z = 9.378 10 d f f 1 - --2 [4] where: df = density (g/cm3) of deposited film µf = shear modulus (dynes/cm2) of deposited film dq = density of quartz (crystal) (2.649 g/cm3) µq = shear modulus of quartz (crystal) (3.
XTC/3 Operating Manual of thickness is greater than the actual thickness, increase the Z-Ratio value. If the calculated value of thickness is less than the actual thickness, decrease the Z-Ratio value.
XTC/3 Operating Manual Chapter 8 Measurement and Control Theory 8.1 Basics The Quartz Crystal deposition monitor, or QCM, utilizes the piezoelectric sensitivity of a quartz monitor crystal to added mass. The QCM uses this mass sensitivity to control the deposition rate and final thickness of a vacuum deposition. When a voltage is applied across the faces of a properly shaped piezoelectric crystal, the crystal is distorted and changes shape in proportion to the applied voltage.
XTC/3 Operating Manual when 1 angstrom of Aluminum (density of 2.77 g/cm3) is added to its surface. In this manner the thickness of a rigid adlayer is inferred from the precise measurement of the crystal’s frequency shift. The quantitative knowledge of this effect provides a means of determining how much material is being deposited on a substrate in a vacuum system, a measurement that was not convenient or practical prior to this understanding. 8.1.
XTC/3 Operating Manual Contouring dissipates the energy of the traveling acoustic wave before it reaches the edge of the crystal. Energy is not reflected back to the center where it can interfere with other newly launched waves, essentially making a small crystal appear to behave as though it is infinite in extent. With the crystal’s vibrations restricted to the center, it is practical to clamp the outer edges of the crystal to a holder and not produce any undesirable effects.
XTC/3 Operating Manual Figure 8-3 Thickness shear displacement E X2 displacement node X 1 X 3 8.1.2 Period Measurement Technique Although instruments using equation [2] were very useful, it was soon noted they had a very limited range of accuracy, typically holding accuracy for F less than 0.02 Fq.
XTC/3 Operating Manual Since the frequency of the reference is stable and known, the time to accumulate the m counts is known to an accuracy equal to ± 2/Fr where Fr is the reference oscillator’s frequency. The monitor crystal’s period is (n/Fr)/m where n is the number of counts in the second accumulator. The precision of the measurement is determined by the speed of the reference clock and the length of the gate time (which is set by the size of m).
XTC/3 Operating Manual To achieve this new level of accuracy requires only that the user enter an additional material parameter, Z, for the film being deposited. This equation has been tested for a number of materials, and has been found to be valid for frequency shifts equivalent to Ff = 0.4Fq. Keep in mind that equation [2] was valid to only 0.02Fq and equation [3] was valid only to ~0.05Fq. 8.1.
XTC/3 Operating Manual into a greater frequency shift than that which would be produced with a new crystal. In the extreme, the basic phase/frequency shape is not preserved and the crystal is not able to provide a full 90 degrees of phase shift. The impedance, |Z|, is also noted to rise to an extremely high value. When this happens it is often more favorable for the oscillator to resonate at one of the anharmonic frequencies.
XTC/3 Operating Manual uses the phase/frequency properties of the quartz crystal to determine the resonant frequency. It operates by applying a synthesized sine wave of specific frequency to the crystal and measuring the phase difference between the applied signal’s voltage and the current passing through the crystal. At series resonance, this phase difference is exactly 0 degrees; that is, the crystal behaves like a pure resistance.
XTC/3 Operating Manual 8.1.6 Control Loop Theory The instrumental advances in measurement speed, precision and reliability would not be complete without a means of translating this improved information into improved process control. For a deposition process, this means keeping the deposition rate as close as possible to the desired rate.
XTC/3 Operating Manual Three parameters are determined from the process reaction curve. They are the steady state gain, Kp, the dead time, L, and the time constant, T1. Several methods have been proposed to extract the required parameters from the system response as graphed in Figure 8-7. These are: a one point fit at 63.2% of the transition (one time constant); a two point exponential fit; and a weighted least-square-exponential fit.
XTC/3 Operating Manual R(s) represents the rate setpoint. The feedback mechanism is the error generated by the difference between the measured deposition rate, C(s), and the rate set point, R(s). Figure 8-8 PID controller block diagram Setpoint Rs + Error Deposition Rate Es Cs S 1 K c 1 + ------- + T d s Ti s [Controller] K p exp – L s ------------------------------T1 s + 1 [Process] The key to using any control system is to choose the proper values of Kc, Td and Ti.
XTC/3 Operating Manual ITAE is insensitive to the initial and somewhat unavoidable errors, but it will weight heavily any errors occurring late in time. Optimum responses defined by ITAE will consequently show short total response times and larger overshoots than with either of the other criteria. It has been found that this criteria is generally most useful for deposition process control. The most satisfactory performance criterion for deposition controllers is the ITAE.
XTC/3 Operating Manual Chapter A Material Table CAUTION Some of these materials are toxic. Please consult the material safety data sheet and safety instructions before use. An * is used to indicate that a Z-Ratio has not been established for a certain material. A value of 1.000 is defaulted in these situations. PN 074-446-P1J Table A-1 Material table Formula Density Z-Ratio Material Name Ag 10.500 0.529 silver AgBr 6.470 1.180 silver bromide AgCl 5.560 1.320 silver chloride Al 2.700 1.
XTC/3 Operating Manual A-2 Formula Density Z-Ratio Material Name BeF2 1.990 *1.000 beryllium fluoride BeO 3.010 *1.000 beryllium oxide Bi 9.800 0.790 bismuth Bi2O3 8.900 *1.000 bismuth oxide Bi2S3 7.390 *1.000 bismuth trisulfide Bi2Se3 6.820 *1.000 bismuth selenide Bi2Te3 7.700 *1.000 bismuth telluride BiF3 5.320 *1.000 bismuth fluoride C 2.250 3.260 carbon (graphite) C 3.520 0.220 carbon (diamond) C8H8 1.100 *1.000 parlyene (union carbide) Ca 1.550 2.
XTC/3 Operating Manual PN 074-446-P1J Table A-1 Material table (continued) Formula Density Z-Ratio Material Name CsCI 3.988 1.399 cesium chloride CsI 4.516 1.542 cesium iodide Cu 8.930 0.437 copper Cu2O 6.000 *1.000 copper oxide Cu2S 5.600 0.690 copper (I) sulfide (alpha) Cu2S 5.800 0.670 copper (I) sulfide (beta) CuS 4.600 0.820 copper (II) sulfide Dy 8.550 0.600 dysprosium DY2O3 7.810 *1.000 dysprosium oxide Er 9.050 0.740 erbium Er2O3 8.640 *1.
XTC/3 Operating Manual A-4 Formula Density Z-Ratio Material Name Ho 8.800 0.580 holmium Ho2O3 8.410 *1.000 holmium oxide In 7.300 0.841 indium In2O3 7.180 *1.000 indium sesquioxide In2Se3 5.700 *1.000 indium selenide In2Te3 5.800 *1.000 indium telluride InAs 5.700 *1.000 indium arsenide InP 4.800 *1.000 indium phosphide InSb 5.760 0.769 indium antimonide Ir 22.400 0.129 iridium K 0.860 10.189 potassium KBr 2.750 1.893 potassium bromide KCI 1.980 2.
XTC/3 Operating Manual PN 074-446-P1J Table A-1 Material table (continued) Formula Density Z-Ratio Material Name MoS2 4.800 *1.000 molybdenum disulfide Na 0.970 4.800 sodium Na3AIF6 2.900 *1.000 cryolite Na5Al3F14 2.900 *1.000 chiolite NaBr 3.200 *1.000 sodium bromide NaCl 2.170 1.570 sodium chloride NaCIO3 2.164 1.565 sodium chlorate NaF 2.558 0.949 sodium fluoride NaNO3 2.270 1.194 sodium nitrate Nb 8.578 0.492 niobium (columbium) Nb2O3 7.500 *1.
XTC/3 Operating Manual A-6 Formula Density Z-Ratio Material Name Pr 6.780 *1.000 praseodymium Pr2O3 6.880 *1.000 praseodymium oxide Pt 21.400 0.245 platinum PtO2 10.200 *1.000 platinum oxide Ra 5.000 *1.000 radium Rb 1.530 2.540 rubidium RbI 3.550 *1.000 rubidium iodide Re 21.040 0.150 rhenium Rh 12.410 0.210 rhodium Ru 12.362 0.182 ruthenium S8 2.070 2.290 sulfur Sb 6.620 0.768 antimony Sb2O3 5.200 *1.000 antimony trioxide Sb2S3 4.640 *1.
XTC/3 Operating Manual PN 074-446-P1J Table A-1 Material table (continued) Formula Density Z-Ratio Material Name TaN 16.300 *1.000 tantalum nitride Tb 8.270 0.660 terbium Tc 11.500 *1.000 technetium Te 6.250 0.900 tellurium TeO2 5.990 0.862 tellurium oxide Th 11.694 0.484 thorium ThF4 6.320 *1.000 thorium (IV) fluoride ThO2 9.860 0.284 thorium dioxide ThOF2 9.100 *1.000 thorium oxyfluoride Ti 4.500 0.628 titanium Ti203 4.600 *1.
XTC/3 Operating Manual Table A-1 Material table (continued) Density Z-Ratio Material Name Y 4.340 0.835 yttrium Y203 5.010 *1.000 yttrium oxide Yb 6.980 1.130 ytterbium Yb2O3 9.170 *1.000 ytterbium oxide Zn 7.040 0.514 zinc Zn3Sb2 6.300 *1.000 zinc antimonide ZnF2 4.950 *1.000 zinc fluoride ZnO 5.610 0.556 zinc oxide ZnS 4.090 0.775 zinc sulfide ZnSe 5.260 0.722 zinc selenide ZnTe 6.340 0.770 zinc telluride Zr 6.490 0.600 zirconium ZrB2 6.080 *1.
