User's Manual

19
Reference design 60 GHz radar FF module
User manual and integration instructions
SMT/baking information
8 SMT/baking information
8.1 Baking recommendations
Baking conditions:
 Follow MSL Level 4 to carry out the baking process.
 After the bag is opened, devices that will be subjected to reflow solder or other high-temperature
processes must be:
o mounted within 72 hours of factory conditions at less than 30°C/60 percent RH
o stored at less than 10 percent RH.
 Devices require baking before mounting if the humidity indicator card reads more than 10 percent.
 If baking is required, devices may be baked for 8 hours at 125°C.
8.2 SMT recommendations
Recommended reflow profile:
Figure 11 Reflow profile of module