User's Manual

20
Reference design 60 GHz radar FF module
User manual and integration instructions
SMT/baking information
Table 4 Description of parameters in reflow profile
1
Pre-heat
D1: 140 ~ D2: 200
T1: 80~120
2
Soldering
D2: 220
T2: 60 +/-10
3
Peak temperature
D3: 250°C max.
Note: Reflow soldering is recommended a maximum of twice.
Note: Add nitrogen during the reflow process to improve SMT solderability.
 Stencil thickness: 0.1~0.13 mm (recommended)
 Soldering paste (without Pb): SENJU N705-GRN3360-K2-V for best soldering effects.