Datasheet

2009-09-28
19
BAS16...
Package TSLP-2-1
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
1
2
0.45
0.275
0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
BAS16-02L
Type code
Cathode marking
Laser marking
0.76
4
1.16
8
0.5
Cathode
marking
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
0.4
0.05 MAX.
+0.1
Cathode
marking
1) Dimension applies to plated terminal
Top view Bottom view
1
2
±0.05
0.65
±0.035
0.25
1)
1
±0.05
1)
±0.035
0.5
±0.05
0.6