Datasheet

BSO 304SN
Data Sheet 2 05.99
Thermal Characteristics
Parameter
Symbol UnitValues
typ.min. max.
Characteristics
35 K/W
R
thJS
--Thermal resistance, junction - soldering point
80
R
th(JA)
-Thermal resistance @ 10 sec., min. footprint -
62.5
R
th(JA)
--Thermal resistance @ 10 sec.,
6 cm
2
cooling area
1)
Electrical Characteristics, at T
j
= 25 ˚C, unless otherwise specified
Parameter
ValuesSymbol Unit
typ.min. max.
Static Characteristics
Drain- source breakdown voltage
V
GS
= 0 V, I
D
= 0.25 mA
V
(BR)DSS
30 - - V
Gate threshold voltage, V
GS
= V
DS
I
D
= 30 µA
V
GS(th)
1.2 1.6 2
Zero gate voltage drain current
V
DS
= 30 V, V
GS
= 0 V, T
j
= 25 ˚C
V
DS
= 30 V, V
GS
= 0 V, T
j
= 150 ˚C
I
DSS
-
-
0.1
10
1
100
µA
Gate-source leakage current
V
GS
= 20 V, V
DS
= 0 V
I
GSS
- 10 100 nA
Drain-Source on-state resistance
V
GS
= 4.5 V, I
D
= 5.5 A
V
GS
= 10 V, I
D
= 6.4 A
R
DS(on)
-
-
0.03
0.02
0.042
0.03
Ω
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air.