Datasheet

TLE 6208-3 G
Data Sheet 3 2007-09-12
1.3 Pin Definitions and Functions
Pin No. Symbol Function
1GNDGround; Reference potential; internal connection to pin 7, 8 and 14;
cooling tab; to reduce thermal resistance place cooling areas on PCB
close to these pins.
2OUT3Halfbridge-Output 3;
Internally contected to Highside-Switch 3 and Lowside-Switch 3. The
HS-Switch is a Power-MOS open drain with internal reverse diode;
The LS-Switch is a Power-MOS open source with internal reverse
diode; no internal clamp diode or active zenering;
short circuit protected and open load controlled.
3
V
S
Power Supply;
needs a blocking capacitor as close as possible to GND Value: 22 µF
electrolytic in parallel to 220 nF ceramic.
5DISerial Data Input; receives serial data from the control device; serial
data transmitted to DI is an 16bit control word with the Least
Significant Bit (LSB) being transferred first: the input has an active
pull down and requires CMOS logic level inputs;
DI will accept data on the falling edge of CLK-signal;
see Table Input Data Protocol.
4CSNChip-Select-Not Input; CSN is an active low input; serial
communication is enabled by pulling the CSN terminal low; CSN
input should only be transitioned when CLK is low; CSN has an
internal active pull up and requires CMOS logic level inputs.
6CLKSerial Clock Input; clocks the shiftregister; CLK has an internal
active pull down and requires CMOS logic level inputs.
7, 8, 14 GND Ground; see pin 1.
9DOSerial-Data-Output; this 3-state output transfers diagnosis data to
the control device; the output will remain 3-stated unless the device
is selected by a low on Chip-Select-Not (CSN);
see Table Diagnosis Data Protocol.
10 INH Inhibit Input; has an internal pull down;
device is switched in standby condition by pulling the INH terminal
low.
11
V
CC
Logic Supply Voltage;
needs a blocking capacitor as close as possible to GND;
Value: 10 µF electrolytic in parallel to 220 nF ceramic.
12 OUT2 Halfbridge-Output 2; see pin 2.
13 OUT1 Halfbridge-Output 1; see pin 2.