Datasheet

Data Sheet 9 Rev. 2.4, 2007-08-08
TLE6288R
General Product Characteristics
Attention: Integrated protection functions are designed to prevent IC destruction under fault conditions
described in the data sheet. Fault conditions are considered as “outside” normal operating
range. Protection functions are not designed for continuous repetitive operation.
Figure 3 Test Condition
3.2 Thermal Resistance
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
3.2.1 –
3.2.2 Junction to Case
1)
1) Not subject to production test, specified by design.
R
thjC
1K/W
2)
2) Channel 1-6 continously turned on, 0.8W power dissipation per channel
3.2.3 Junction to ambient
1)
R
thjA
15.5 K/W
2) 3)
3) Specified R
thjA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board ; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
Further informations can be found in Chapter 7.2
12V
40V
10 times
(once/ 30sec)
160ms
350ms