Datasheet

Data Sheet 6 Rev. 1.01, 2009-10-19
IFX27001
General Product Characteristics
4.2 Functional Range
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos. Parameter Symbol Limit Values Unit Remarks
Min. Max.
4.2.1 Input voltage
V
I
V
I
+ V
DR
40 V
4.2.2 Junction temperature
T
j
-40 125 °C–
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
PG-TO252-3
4.3.1 Junction to Case
1)
1) Not subject to production test, specified by design.
R
thJC
– 4 – K/W measured to heat
slug
4.3.2 Junction to Ambient
1)
R
thJA
–27–K/W
2)
2) Specified R
thJA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
4.3.3 R
thJA
– 57 – K/W 300 mm² heatsink
area
3)
3) Specified R
thJA
value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm
3
board with 1 copper layer (1 x 70µm Cu).
4.3.4 R
thJA
– 42 – K/W 600 mm² heatsink
area
3)