Datasheet
HEXFET
®
Power MOSFET
04/20/10
IRF5805PbF
Absolute Maximum Ratings
www.irf.com 1
Thermal Resistance
Parameter Max. Units
V
DS
Drain-Source Voltage -30 V
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ -10V -3.8
I
D
@ T
A
= 70°C Continuous Drain Current, V
GS
@ -10V -3.0 A
I
DM
Pulsed Drain Current -15
P
D
@T
A
= 25°C Maximum Power Dissipation 2W
P
D
@T
A
= 70°C Maximum Power Dissipation 1.28 W
Linear Derating Factor 0.02 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
T
J
, T
STG
Junction and Storage Temperature Range -55 to + 150 °C
Description
V
DSS
R
DS(on)
max I
D
-30V 0.098@V
GS
= -10V -3.8A
0.165@V
GS
= -4.5V -3.0A
Parameter Max. Units
R
θJA
Maximum Junction-to-Ambient 62.5 °C/W
Top View
1
2
D
G
A
D
D
D
S
3
4
5
6
These P-channel MOSFETs from International Rectifier
utilize advanced processing techniques to achieve the
extremely low on-resistance per silicon area. This
benefit provides the designer with an extremely efficient
device for use in battery and load management
applications.
The TSOP-6 package with its customized leadframe
produces a HEXFET
®
power MOSFET with R
DS(on)
60% less than a similar size SOT-23. This package is
ideal for applications where printed circuit board space
is at a premium. It's unique thermal design and R
DS(on)
reduction enables a current-handling increase of nearly
300% compared to the SOT-23.
l Ultra Low On-Resistance
l P-Channel MOSFET
l Surface Mount
l Available in Tape & Reel
l Low Gate Charge
l Lead-Free
l Halogen-Free
TSOP-6
PD -95340A