PD - 96284 IRF7815PbF HEXFET® Power MOSFET Applications l Synchronous MOSFET for Notebook Processor Power l Synchronous Rectifier MOSFET for Isolated DC-DC Converters in Networking Systems Benefits l Very Low RDS(on) at 10V VGS l Low Gate Charge l Fully Characterized Avalanche Voltage and Current l 20V VGS Max. Gate Rating VDSS RDS(on) max Qg (typ.) 150V 43m @VGS = 10V 25nC : A A D S 1 8 S 2 7 D S 3 6 D G 4 5 D SO-8 Top View Absolute Maximum Ratings Parameter Max.
IRF7815PbF Static @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions BVDSS ∆ΒVDSS/∆TJ Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient 150 ––– ––– 0.17 ––– ––– V VGS = 0V, ID = 250µA V/°C Reference to 25°C, ID = 1mA RDS(on) VGS(th) ∆VGS(th) Static Drain-to-Source On-Resistance Gate Threshold Voltage ––– 3.0 34 4.0 43 5.0 mΩ V Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current ––– ––– -12.
IRF7815PbF 100 10 BOTTOM 100 VGS 15V 10V 8.0V 7.0V 6.5V 6.0V 5.5V 5.0V TOP ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) TOP 1 0.1 5.0V 0.1 1 10 BOTTOM 5.0V 1 ≤60µs PULSE WIDTH Tj = 150°C ≤60µs PULSE WIDTH Tj = 25°C 0.01 10 0.1 100 0.1 V DS, Drain-to-Source Voltage (V) 1 10 100 V DS, Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 2.
IRF7815PbF 100000 VGS, Gate-to-Source Voltage (V) ID= 3.1A C oss = C ds + Cgd 10000 C, Capacitance (pF) 14.0 VGS = 0V, f = 1 MHZ C iss = C gs + Cgd, C ds SHORTED C rss = C gd Ciss 1000 Coss 100 Crss 12.0 VDS= 120V VDS= 75V 10.0 VDS= 30V 8.0 6.0 4.0 2.0 10 0.0 1 10 100 1000 0 VDS, Drain-to-Source Voltage (V) 15 20 25 30 35 Fig 6. Typical Gate Charge Vs.
IRF7815PbF 6 VGS(th), Gate threshold Voltage (V) 6.0 ID, Drain Current (A) 5 4 3 2 1 5.0 4.0 ID = 100uA ID = 150uA ID = 250uA ID = 1.0mA ID = 1.0A 3.0 0 2.0 25 50 75 100 125 150 -75 -50 -25 T A , Ambient Temperature (°C) 0 25 50 75 100 125 150 T J , Temperature ( °C ) Fig 10. Threshold Voltage Vs. Temperature Fig 9. Maximum Drain Current Vs. Ambient Temperature 100 Thermal Response ( Z thJA ) °C/W D = 0.50 10 0.20 0.10 0.05 0.02 0.01 1 τJ 0.1 0.
2500 100 EAS , Single Pulse Avalanche Energy (mJ) RDS(on), Drain-to -Source On Resistance (m Ω) IRF7815PbF ID = 5.1A 90 ID 0.30A 0.44A BOTTOM 3.1A TOP 2000 80 T J = 125°C 70 1500 60 1000 50 T J = 25°C 40 30 500 0 20 4 6 8 10 12 14 16 18 20 25 50 75 100 125 150 Starting T J , Junction Temperature (°C) VGS, Gate -to -Source Voltage (V) Fig 12. On-Resistance Vs. Gate Voltage Fig 13c. Maximum Avalanche Energy Vs. Drain Current V(BR)DSS 15V D.U.
IRF7815PbF Id Vds Vgs L VCC DUT 0 20K 1K Vgs(th) S Qgodr Fig 16b. Gate Charge Waveform Fig 16a. Gate Charge Test Circuit Driver Gate Drive D.U.T P.W. + + - * RG • • • • D.U.T. ISD Waveform Reverse Recovery Current VDD ** P.W. Period *** + dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T.
IRF7815PbF SO-8 Package Outline(Mosfet & Fetky) Dimensions are shown in milimeters (inches) ' ',0 % $ + > @ ( $ 0,1 $ E F ' ( H %$6,& H ; H H ; E > @ $ $ 0,//,0(7(56 0$; $ ,1&+(6 0,1 0$; %$6,& %$6,& %$6,& + .
IRF7815PbF SO-8 Tape and Reel TERMINAL NUMBER 1 12.3 ( .484 ) 11.7 ( .461 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 330.00 (12.992) MAX. 14.40 ( .566 ) 12.40 ( .488 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. Note: For the most current drawing please refer to IR website at http://www.irf.