PD - 97275B IRF7862PbF HEXFET® Power MOSFET Applications l Synchronous MOSFET for Notebook Processor Power l Synchronous Rectifier MOSFET for Isolated DC-DC Converters VDSS RDS(on) max 3.3m:@VGS = 10V 30V Benefits l Very Low RDS(on) at 4.5V VGS l Ultra-Low Gate Impedance l Fully Characterized Avalanche Voltage and Current l 20V VGS Max. Gate Rating l 100% tested for Rg l Lead-Free Qg 30nC A A D S 1 8 S 2 7 D S 3 6 D G 4 5 D SO-8 Top View Absolute Maximum Ratings Parameter Max.
IRF7862PbF Static @ TJ = 25°C (unless otherwise specified) Parameter BVDSS ∆ΒVDSS/∆TJ RDS(on) Min. Typ. Max. Units 30 ––– ––– Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance ––– ––– 0.023 3.0 ––– 3.3 Gate Threshold Voltage ––– 1.35 3.7 ––– 4.5 2.35 IDSS Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current ––– ––– -5.4 ––– ––– 1.
IRF7862PbF ≤60µs PULSE WIDTH Tj = 25°C 1000 TOP ID, Drain-to-Source Current (A) 100 BOTTOM 10 VGS 10V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V 2.3V ≤60µs PULSE WIDTH Tj = 150°C ID, Drain-to-Source Current (A) 1000 100 1 0.1 2.3V 0.01 BOTTOM VGS 10V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V 2.3V 10 2.3V 1 0.1 1 10 100 0.1 V DS, Drain-to-Source Voltage (V) 1 10 100 V DS, Drain-to-Source Voltage (V) Fig 2. Typical Output Characteristics Fig 1. Typical Output Characteristics 1000 1.
IRF7862PbF 100000 5.0 VGS = 0V, f = 1 MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd VGS, Gate-to-Source Voltage (V) ID= 16A C, Capacitance (pF) C oss = C ds + C gd 10000 Ciss Coss 1000 Crss VDS= 24V VDS= 15V 4.0 3.0 2.0 1.0 100 0.0 1 10 100 0 VDS, Drain-to-Source Voltage (V) 10 15 ID, Drain-to-Source Current (A) 1000 100 35 T J = 25°C 100µsec 1msec 10 10msec 1 T A = 25°C Tj = 150°C Single Pulse VGS = 0V 1.0 0.1 0.2 0.4 0.6 0.8 1.
IRF7862PbF 2.5 VGS(th) , Gate Threshold Voltage (V) 25 ID, Drain Current (A) 20 15 10 5 2.3 2.0 1.8 ID = 250µA 1.5 1.3 1.0 0 25 50 75 100 125 -75 -50 -25 150 0 25 50 75 100 125 150 T J , Temperature ( °C ) T A , Ambient Temperature (°C) Fig 9. Maximum Drain Current vs. Ambient Temperature Fig 10. Threshold Voltage vs. Temperature 100 Thermal Response ( Z thJA ) °C/W D = 0.50 0.20 0.10 0.05 0.02 0.01 10 1 SINGLE PULSE ( THERMAL RESPONSE ) 0.1 0.01 τJ 0.
IRF7862PbF 1600 EAS , Single Pulse Avalanche Energy (mJ) RDS(on), Drain-to -Source On Resistance (m Ω) 12 ID = 21A ID TOP 1.0A 1.4A BOTTOM 16A 1400 10 1200 1000 8 T J = 125°C 6 4 T J = 25°C 800 600 400 200 2 0 2 3 4 5 6 7 8 9 10 11 12 25 50 75 100 125 150 Starting T J , Junction Temperature (°C) VGS, Gate -to -Source Voltage (V) Fig 13. Maximum Avalanche Energy vs. Drain Current Fig 12. On-Resistance vs. Gate Voltage V(BR)DSS tp 15V L VDS DUT DRIVER 0 D.U.
IRF7862PbF D.U.T Driver Gate Drive P.W. + + - - * D.U.T. ISD Waveform Reverse Recovery Current + Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt RG • • • • dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test V DD P.W.
IRF7862PbF SO-8 Package Outline(Mosfet & Fetky) Dimensions are shown in milimeters (inches) ' ',0 % $ + > @ ( $ 0,1 $ E F ' ( H %$6,& H ; H H ; E > @ $ $ 0,//,0(7(56 0$; $ ,1&+(6 0,1 0$; %$6,& %$6,& %$6,& + .
IRF7862PbF SO-8 Tape and Reel Dimensions are shown in millimeters (inches) TERMINAL NUMBER 1 12.3 ( .484 ) 11.7 ( .461 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 330.00 (12.992) MAX. 14.40 ( .566 ) 12.40 ( .488 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. Notes: Repetitive rating; pulse width limited by max.