Datasheet

03/30/12
IRFH8330PbF
HEXFET
®
Power MOSFET
Notes  through  are on page 9
Features and Benefits
www.irf.com 1
Applications
PD - 97652C
PQFN 5X6 mm
Note
Form
Quantity
IRFH8330TRPBF
PQFN 5mm x 6mm
Tape and Reel
4000
IRFH8330TR2PBF
PQFN 5mm x 6mm
Tape and Reel
400
Orderable part number Package Type
Standard Pack
• Control MOSFET for high frequency buck converters
• Synchronous MOSFET for high frequency buck converters
Absolute Maximum Ratings
Parameter Units
V
DS
Drain-to-Source Voltage
V
GS
Gate-to-Source Voltage
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C(Bottom)
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C(Bottom)
= 100°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V (Source Bonding
Technology Limited)
I
DM
Pulsed Drain Current
P
D
@T
A
= 25°C
Power Dissipation
P
D
@T
C(Bottom)
= 25°C
Power Dissipation
Linear Derating Factor
W/°C
T
J
Operating Junction and
T
STG
Storage Temperature Range
V
W
A
°C
Max.
17
36
210
± 20
30
14
56
25
-55 to + 150
3.3
0.026
35
V
DS
30 V
V
GS max
± 20
V
R
DS(on) max
(@V
GS
= 10V)
6.6
(@V
GS
= 4.5V)
9.9
Q
g typ.
9.3 nC
I
D
(@T
c(Bottom)
= 25°C)
25 A
m
Ω
Features Benefits
Low Thermal Resistance to PCB (< 3.6°C/W) Enable better thermal dissipation
Low Profile (<1.2mm) results in Increased Power Density
Industry-Standard Pinout
⇒
Multi-Vendor Compatibility
Compatible with Existing Surface Mount Techniques
Easier Manufacturing
RoHS Compliant Containing no Lead, no Bromide and no Halogen
Environmentally Friendlier
MSL1, Consumer Qualification Increased Reliability