Datasheet
www.irf.com 1
12/30/03
IRLR7843
IRLU7843
HEXFET
®
Power MOSFET
Notes through are on page 11
Applications
Benefits
l Very Low RDS(on) at 4.5V V
GS
l Ultra-Low Gate Impedance
l Fully Characterized Avalanche Voltage
and Current
l High Frequency Synchronous Buck
Converters for Computer Processor Power
l High Frequency Isolated DC-DC
Converters with Synchronous Rectification
for Telecom and Industrial Use
D-Pak
IRLR7843
I-Pak
IRLU7843
Absolute Maximum Ratings
Parameter Units
V
DS
Drain-to-Source Voltage V
V
GS
Gate-to-Source Voltage
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C
= 100°C
Continuous Drain Current, V
GS
@ 10V
A
I
DM
Pulsed Drain Current
P
D
@T
C
= 25°C
Maximum Power Dissipation
W
P
D
@T
C
= 100°C
Maximum Power Dissipation
Linear Derating Factor W/°C
T
J
Operating Junction and °C
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.05
R
θJA
Junction-to-Ambient (PCB Mount)
––– 50 °C/W
R
θJA
Junction-to-Ambient ––– 110
140
Max.
161
113
620
± 20
30
0.95
71
300 (1.6mm from case)
-55 to + 175
V
DSS
R
DS(on)
max
Qg
30V
3.3m
34nC
PD - 94638A