Datasheet

XMC1100
XMC1000 Family
General Device Information
Data Sheet 17 V1.4, 2014-05
2.2.1 Package Pin Summary
The following general building block is used to describe each pin:
The table is sorted by the “Function” column, starting with the regular Port pins (Px.y),
followed by the supply pins.
The following columns, titled with the supported package variants, lists the package pin
number to which the respective function is mapped in that package.
The “Pad Type” indicates the employed pad type:
• STD_INOUT (standard bi-directional pads)
• STD_INOUT/AN (standard bi-directional pads with analog input)
• High Current (high current bi-directional pads)
• STD_IN/AN (standard input pads with analog input)
• Power (power supply)
Details about the pad properties are defined in the Electrical Parameters.
Table 5 Package Pin Mapping Description
Function Package A Package B ... Pad Type
Px.y N N Pad Class
Table 6 Package Pin Mapping
Function VQFN
40
TSSOP
38
VQFN
24
TSSOP
16
Pad Type Notes
P0.0 23 17 15 7 STD_INOUT
P0.1 24 18 - - STD_INOUT
P0.2 25 19 - - STD_INOUT
P0.3 26 20 - - STD_INOUT
P0.4 27 21 - - STD_INOUT
P0.5 28 22 16 8 STD_INOUT
P0.6 29 23 17 9 STD_INOUT
P0.7 30 24 18 10 STD_INOUT
P0.8 33 27 19 11 STD_INOUT
P0.9 34 28 20 12 STD_INOUT
P0.10 35 29 - - STD_INOUT
P0.11 36 30 - - STD_INOUT
P0.12373121- STD_INOUT
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