Datasheet

XMC1100
XMC1000 Family
General Device Information
Data Sheet 19 V1.4, 2014-05
VDDP 15 10 10 6 Power I/O port supply
VSSP 31 25 - - Power I/O port ground
VDDP 32 26 - - Power I/O port supply
VSSP Exp.
Pad
-Exp.
Pad
-Power Exposed Die Pad
The exposed die
pad is connected
internally to VSSP.
For proper
operation, it is
mandatory to
connect the
exposed pad to the
board ground.
For thermal
aspects, please
refer to the
Package and
Reliability chapter.
Table 6 Package Pin Mapping
Function VQFN
40
TSSOP
38
VQFN
24
TSSOP
16
Pad Type Notes
Subject to Agreement on the Use of Product Information