Datasheet

XMC1100
XMC1000 Family
Package and Reliability
Data Sheet 52 V1.4, 2014-05
4 Package and Reliability
The XMC1100 is a member of the XMC1000 Derivatives of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the exposed die pad may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
4.1 Package Parameters
Table 29 provides the thermal characteristics of the packages used in XMC1100.
Note: For electrical reasons, it is required to connect the exposed pad to the board
ground V
SSP
, independent of EMC and thermal requirements.
4.1.1 Thermal Considerations
When operating the XMC1100 in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance R
ΘJA
” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 115 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (P
INT
+ P
IOSTAT
+ P
IODYN
) × R
ΘJA
Table 29 Thermal Characteristics of the Packages
Parameter Symbol Limit Values Unit Package Types
Min. Max.
Exposed Die Pad
Dimensions
Ex × Ey
CC
-2.7× 2.7 mm PG-VQFN-24-19
-3.7× 3.7 mm PG-VQFN-40-13
Thermal resistance
Junction-Ambient
R
ΘJA
CC - 104.6 K/W PG-TSSOP-16-8
1)
1) Device mounted on a 4-layer JEDEC board (JESD 51-5); exposed pad soldered.
- 70.3 K/W PG-TSSOP-38-9
1)
- 46.0 K/W PG-VQFN-24-19
1)
- 38.4 K/W PG-VQFN-40-13
1)
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