TLE6251-2G High Speed CAN-Transceiver with Wake and Failure Detection Data Sheet Rev. 1.
TLE6251-2G Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 3.1 3.2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High Speed CAN-Transceiver with Wake and Failure Detection 1 TLE6251-2G Overview Features • • • • • • • • • • • • • • • • • • • • • • HS CAN Transceiver with data transmission rates up to 1 MBaud Compliant to ISO 11898-5 Very low power consumption in Sleep Mode Bus Wake-Up and local Wake-Up Inhibit output to control external circuitry Split termination to stabilize the “Recessive” level Separate VIO input to adapt different micro controller supply voltages Separate output for failure diagnosis Optimize
TLE6251-2G Block Diagram 2 Block Diagram VS SPLIT CANL 7 3 VCC CANH 10 VCC 11 6 INH EN Mode Control Logic 13 Driver Output Stage 12 14 Temp.Protection NSTB + timeout 5 VIO Diagnosis & Failure Logic VCC/2 1 Wake-Up Detection TxD VIO Normal Receiver 8 RxD Output Control Low Power Receiver NERR VS VIO WK 9 Wake-Up Comparator 4 RxD 2 GND Figure 1 Data Sheet Block Diagram 4 Rev. 1.
TLE6251-2G Pin Configuration 3 Pin Configuration 3.1 Pin Assignment TxD 1 14 NSTB GND 2 13 CANH VCC 3 12 CANL RxD 4 11 SPLIT VIO 5 10 VS EN 6 9 WK INH 7 8 NERR Figure 2 Pin Configuration 3.2 Pin Definitions and Functions 9 Table 1 Pin Definitions and Functions Pin Symbol Function 1 TxD Transmit Data Input; integrated pull-up resistor to VIO, “Low” for “Dominant” state.
TLE6251-2G Pin Configuration Table 1 Pin Definitions and Functions Pin Symbol Function 7 INH Inhibit Output; Open drain output to control external circuitry; High impedance in Sleep mode 8 NERR Error Flag Output; Failure and Wake-Up indication output, active “Low” Output voltage level depends on the VIO supply 9 WK Wake-Up Input; Local Wake-Up input; Wake-Up input sensitive to a level change in both directions, “High” to “Low” and vice versa.
TLE6251-2G Functional Description 4 Functional Description CAN is a serial bus system that connects microcontrollers, sensor and actuators for real-time control applications. The usage of the Control Area Network (abbreviated CAN) within road vehicles is described by the international standard ISO 11898. According to the 7 layer OSI reference model the physical layer of a CAN bus system specifies the data transmission from one CAN node to all other available CAN nodes inside the network.
TLE6251-2G Functional Description The TLE6251-2G is a High Speed CAN transceiver, operating as an interface between the CAN controller and the physical bus medium. A High Speed CAN network (abbreviated HS CAN) is a two wire differential network which allows data transmission rates up to 1 MBaud. Characteristic for a HS CAN network are the two CAN bus states “Dominant” and “Recessive” (see Figure 3). A HS CAN network is a Carrier Sense Multiple Access network with Collision Detection.
TLE6251-2G Operation Modes 5 Operation Modes Five different operation modes are available on TLE6251-2G. Each mode with specific characteristics in terms of quiescent current, data transmission or failure diagnostic. For the mode selection the digital input pins EN and NSTB are used. Both digital input pins are event triggered. Figure 4 illustrates the different mode changes depending on the status of the EN and NSTB pins.
TLE6251-2G Operation Modes In Sleep mode the power supply VCC and the logic power supply VIO are usually turned off. A Wake-Up event, via the CAN bus or the local Wake-Up pin, shifts the device from Sleep mode into Stand-By mode.
TLE6251-2G Operation Modes • • • • • • The SPLIT pin is set to VCC/2. The bus biasing is set to VCC/2. The low power receiver and the bus Wake-Up function is inactive. The local Wake-Up pin WK is disabled. The failure diagnostic is active and local failures are indicated at the NERR pin (see Chapter 8). The under-voltage detection on the all 3 power supplies VCC, VIO and VS is active.
TLE6251-2G Operation Modes 5.4 Go-To-Sleep Command The Go-To-Sleep command is a transition mode allowing external circuitry like a microcontroller to prepare the ECU for the Sleep mode. The TLE6251-2G stays in the Go-To-Sleep command for the maximum time t = thSLP, after exceeding the time thSLP the device changes into Sleep mode. A mode change into Sleep mode is only possible via the Go-To-Sleep command.
TLE6251-2G Operation Modes 5.6 Enter Sleep Mode In order to enter the Stand-By mode or the Sleep mode, the EN signal needs to be set to logical “Low” a defined time after the NSTB pin was set to logical “Low”. Important for the mode selection is the timing between the falling edge of the NSTB signal and the EN signal.
TLE6251-2G Wake-Up Functions 6 Wake-Up Functions There are several possibilities for a mode change from Sleep mode to another operation mode. • • • • Remote Wake-Up via a message on the CAN bus. Local Wake-Up via a signal change on the pin WK. A status change of the logical signals applied to the mode control pins EN and NSTB. An under-voltage detection on the VS power supply.
TLE6251-2G Wake-Up Functions 6.2 Local Wake-Up The TLE6251-2G can be activated from Sleep mode by a signal change on the WK pin, also called local WakeUp. Designed to withstand voltages up to 40V the WK pin can be directly connected to VS. The internal logic on the WK pin works bi-sensitive, meaning the Wake-Up logic on the pin WK triggers on a both signal changes, from “High” to “Low” and from “Low” to “High” (see Figure 7).
TLE6251-2G Wake-Up Functions 6.3 Mode Change via the EN and NSTB pin Besides a mode change issued by a Wake-Up event, the operation mode on the TLE6251-2G can be changed by changing the signals on the EN and NSTB pins. Therefore the power supplies VCC and VIO have to be active. According to the mode diagram in Figure 4 the operation mode can be changed directly from Sleep mode to the Receive-Only mode and to the Normal Operation mode.
TLE6251-2G Fail Safe Features 7 Fail Safe Features 7.1 CAN Bus Failure Detection The High Speed CAN Transceiver TLE6251-2G is equipped with a bus failure detection unit.
TLE6251-2G Fail Safe Features 7.2 Local Failures If a local failure occurs during the operation of the TLE6251-2G, the devices sets an internal local failure flag. The local failure flag can be displayed to the microcontroller during the Receive-Only Mode and the failures are indicated by a logical “Low” signal on the NERR pin. The following local failures can be detected: • • • • • TxD time-out TxD to RxD Short RxD permanent Recessive Clamping Bus Dominant Clamping Over-Temperature Detection 7.2.
TLE6251-2G Fail Safe Features 7.2.2 TxD to RxD Short Circuit Feature A short between the pins TxD and RxD causes permanent blocking of the CAN bus. In the case, that the low side driver capability of the RxD output pin is stronger as the high side driver capability of the external microcontroller output, which is connected to the TxD pin of the TLE6251-2G, the RxD output signal overrides the TxD signal provided by the microcontroller. In this case a continuous “Dominant” signal blocks the CAN bus.
TLE6251-2G Fail Safe Features 7.2.5 Over-Temperature Detection The output stage is protected against over temperature. Exceeding the shutdown temperature results in deactivation of the output stage. To avoid any toggling after the device cools down, the output stage is enabled again only after a “Recessive” to “Dominant” signal change on the TxD pin (see Figure 11). An Over-Temperature event only deactivates the output driver stage, the TLE6251-2G doesn’t change its operation mode in this failure case.
TLE6251-2G Fail Safe Features The under-voltage monitoring on the power supply VCC and VIO is combined with an internal filter time. Only if the voltage drop on each of these two power supplies is longer present as the time tDrop > tUV(VIO) (tDrop > tUV(VCC)) the operation mode change will be activated (see Figure 12). Under-voltage events on the power supplies VCC or VIO are not indicated by the NERR pin nor by the RxD pin.
TLE6251-2G Fail Safe Features 7.3.2 Under-Voltage Event on VS If an under-voltage event is detected at the power supply VS, the TLE6251-2G immediately transfers into the Stand-By mode, regardless of the operation mode in which the TLE6251-2G might currently operate. After the power supply VS has been reestablished, the operation mode can be changed by applying a logical “High” signal to the EN pin or the NSTB pin.
TLE6251-2G Diagnosis-Flags at NERR and RxD 8 Diagnosis-Flags at NERR and RxD Table 3 Truth Table NSTB 1 EN 1 INH HIGH Mode NORMAL Event No CAN bus failure CAN bus failure 1) 1) NERR RxD SPLIT 1 LOW: bus dominant, HIGH: bus recessive ON LOW: bus dominant, HIGH: bus recessive ON 0 0 OFF 1 1 0 0 1 1 0 Wake-up via CAN bus/no wake- 1 up request detected Wake-up via pin WK2) 1 0 0 0 HIGH HIGH RECEIVE ONLY STAND BY No VS fail detected 0 3) 1 3) VS fail detected 0 No TxD
TLE6251-2G General Product Characteristics 9 General Product Characteristics 9.1 Absolute Maximum Ratings Table 4 Absolute Maximum Ratings 1) All voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. -0.3 40 V – -0.3 6.0 V – -0.3 6.0 V – -40 40 V – -40 40 V – -40 40 V – -27 40 V – -0.3 VS + 0.3 V – -40 40 V Max.
TLE6251-2G General Product Characteristics 9.2 Functional Range Table 5 Operating Range Pos. Parameter Symbol Limit Values Min. Max. Unit Conditions Supply Voltages 9.2.1 Supply Voltage Range for Normal Operation VS(nom) 5.5 18 V – 9.2.2 Extended Supply Voltage Range for Operation VS(ext) 5 40 V Parameter Deviations possible 9.2.3 Transceiver Supply Voltage 4.75 5.25 V – 9.2.4 Logic Supply Voltage VCC VIO 3.0 5.25 V – TJ -40 150 °C 1) Thermal Parameters 9.2.
TLE6251-2G Electrical Characteristics 10 Electrical Characteristics 10.1 Functional Device Characteristics Table 7 Electrical Characteristics 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Typ. Max. Unit Conditions Current Consumption 10.1.
TLE6251-2G Electrical Characteristics Table 7 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Typ. Unit Conditions Max. Transmission Input TxD 10.1.13 High level input range 10.1.14 Low level input range 10.1.15 HIGH level input current 10.1.
TLE6251-2G Electrical Characteristics Table 7 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Typ. Max. VS 2V – VS + - 27 – Unit Conditions Wake Input WK 10.1.27 High Level voltage range at WK VWK,H 10.1.
TLE6251-2G Electrical Characteristics Table 7 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Typ. Max. Unit Conditions Bus Receiver 10.1.42 Differential receiver input range - “Dominant” Vdiff,rdN 0.9 – 5.0 V Normal Operation mode, In respect to CMR 10.1.
TLE6251-2G Electrical Characteristics 10.2 Diagrams 10 VS NSTB 100 nF EN 13 CL CANH TxD RxD RL 12 6 1 4 CRxD CANL VIO 9 14 WK GND VCC 5 3 100 nF 2 Figure 14 100 nF = VCC = VIO Test Circuit for Dynamic Characteristics VTxD VIO GND VDIFF td(L),T 0.9 V 0.5 V td(L),R VRxD VIO t td(H),T t td(H),R td(L),TR td(H),TR 0.8 x VIO GND 0.2 x VIO t Figure 15 Data Sheet Timing Diagrams for Dynamic Characteristics 30 Rev. 1.
TLE6251-2G Application Information 11 Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. 11.1 Application Example 4.7 nF 1) 60 Ω VS 60 Ω TLE6251-2G 10 kΩ 9 VBat CAN Bus WK EN NSTB NERR 51 µH 13 1) 12 11 10 CANH RxD CANL TxD SPLIT VIO 6 14 8 4 Micro Controller E.g.
TLE6251-2G Application Information 11.2 ESD Robustness according to IEC61000-4-2 Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330 Ω) have been performed. The results and test conditions are available in a separate test report.
TLE6251-2G Application Information 11.4 Mode Change to Sleep mode Mode changes are applied either by a host command, an Wake-Up event or by an under-voltage event. To trigger a mode change by a host command or in other words by a signal change on the digital input pins EN and NSTB all power supplies, VS VIO and VCC need to be available.TLE6251-2G.
TLE6251-2G Package Outlines 12 Package Outlines gps09033 Figure 19 PG-DSO-14 (Plastic Dual Small Outline PG-DSO-14-24) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
TLE6251-2G Revision History 13 Revision History Revision Date Changes 1.1 2011-05-23 Updated Data Sheet Rev. 1.0 • • • • • • • • • • • • • • • • • • • • • • • • • 1.0 Data Sheet 2009-05-07 Cover page, new Infineon logo. All pages: Spelling, grammar and format failure corrected. Page 7, Figure 3: Updated. Page 9, Chapter 5: Updated description. Page 9, Figure 4: Updated. Page 11, Chapter 5.3: Timing Reference th(min) changed to thSLP. Page 12, Chapter 5.
Edition 2011-06-06 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
