User's Manual

Chapter 3 – Electrical Characteristics
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 31
GND
SIMVCC
IK
1
SIMRST
SIMCLK
SIMDATA
SIMPRES1 8
7
3
2
VCC
RST
CLK
CC4
GND
VPP
I/O
CC8
Figure 3-12: SIM Socket
SPI Bus
The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard. The
maximum speed transfer is 3.25Mb/s.
Table 3-26 : SPI Bus Pin Description
Signal Pin Number I/O I/O Type* Description
SPI_CLK 44 O 1X SPI Serial Clock
SPI_IO 43 I/O CMOS/1X SPI Data
SPI_EO 42 O 1X SPI Enable
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Keypad Interface
This interface provides 10 connections: 5 rows (R0 to R4) and 5 columns (C0 to C4).
The scanning is a digital one, and the de-bouncing is done in the integrated modem. No discrete components
like R, C (Resistor, Capacitor) are needed. It is possible to scan the column and rows using the AT+CMER
command. See AT Command manual for more details.
Table 3-27: Keypad Interface Pin Description
Signal Pin Number I/O I/O Type* Description
ROW0 39 I/O CMOS / 1X Row scan
ROW1 40 I/O CMOS / 1X Row scan
ROW2 37 I/O CMOS / 1X Row scan
ROW3 38 I/O CMOS / 1X Row scan
ROW4 35 I/O CMOS / 1X Row scan
COL0 36 I/O CMOS / 1X Column scan
COL1 33 I/O CMOS / 1X Column scan
COL2 34 I/O CMOS / 1X Column scan
COL3 31 I/O CMOS / 1X Column scan
COL4 32 I/O CMOS / 1X Column scan
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.