Specifications

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Symbol Parameter Minimum Maximum Unit
T Operating Temp. 0 60* °C
Table 1-3 Operating Temperature
Note * : Test with heat sink
1.6 General Application Notes
Consider the following recommendations when designing application boards:
• Use a GND plane underneath the SB52.
• Do not use vias in high-speed interface lines such as USB and Ethernet.
• Rout high-speed interface lines differentially and leave several mm gap to other
signal lines when possible.
• Do not place any components which dissipate heat close to or underneath the
module.
• A heat sink is suggested to allow prolonged operation under full CPU speed. Connect
heat sink to CPU and WiFi via thermal pad, ensure that heat sink is not tilted or
applying high force onto the module.