Data Sheet

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7. PRODUCT HANDING
7.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric
environment of < 40 °C/90% RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and 60% RH.
The module needs to be baked if the above conditions are not met.
7.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V
7.3 DIP Type Product Pass Wave Solder Graph
Figure 6: DIP Type Product Pass Wave Solder Graph
Table 19: Bluetooth Transmitter Characteristics – Bluetooth LE 500 Kbps