Data Sheet

Preliminary Data Sheet

April 23, 2020

Page 15/25

Document Ref: isp_ble_DS1907_R4.docx

Insight SiP

– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –

www.insightsip.com

BLE MODULE

ISP1907

4.2. SMT Assembly Guidelines

For PCB Land Patterns and Solder Mask layout, Insight SiP recommends to use the same dimensions as

module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads.

Please contact Insight SiP for more detailed information.

4.3. Antenna Keep-Out Zone

For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of the

board:no metal, no traces and no components on any application PCB layer except mechanical LGA pads.

Application PCB

Keep

Out

Zone

18.0 mm min

4.0

Specification subject to change without notice.