Data Sheet

Preliminary Data Sheet
April 23, 2020
Page 21/25
Document Ref: isp_ble_DS1907_R4.docx
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
BLE MODULE
ISP1907
7. Storage & Soldering information
7.1. Storage and Handling
Keep this product away from other high frequency devices which may interfere with operation such as
other transmitters and devices generating high frequencies.
Do not expose the module to the following conditions:
- Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX
- Extreme humidity or salty air
- Prolonged exposure to direct Sunlight
- Temperatures beyond those specified for storage
Do not apply mechanical stress
Do not drop or shock the module
Avoid static electricity, ESD and high voltage as these may damage the module
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
7.2. Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted
onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient temperature.
Any absorbed moisture is quickly turned into superheated steam. This sudden change in vapor pressure
can cause the package to swell. If the pressure exerted exceeds the flexural strength of the plastic mold
compound, then it is possible to crack the package. Even if the package does not crack, interfacial
delamination can occur.
Since the device package is sensitive to moisture absorption, it is recommended to bake the product before
assembly. The baking process for dry packing is 24 hours at 125°C.
ISP1907 has been tested MSL-3 according to standards. After baking, modules can be exposed to ambient
room conditions (approximately 30 °C/60%RH) during 168 hours before assembly on the PCB.
CAUTION
MOISTURE
SENSITIVE DEVICES
Specification subject to change without notice.