Specifications

January 13, 2021
Page 28/31
Document Ref: isp_lora_DS4520_R7
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
LoRa / BLE MODULE
ISP4520
8.3. Soldering information
Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.
Preheat/Soak
Temperature Min (T
smin
)
Temperature Max (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
150 °C
200 °C
60-120 sec
Peak package body temperature (T
p
)
260°C
(+0/-5°C)
Classification Temperature (T
c
)
Time (t
p
) maintained above T
C
-5 °C
260 °C
30 sec
Ramp-up rate (T
L
to T
p
)
3 °C/sec max
Ramp-down rate (T
p
to T
L
)
6 °C/sec max
Liquidous temperature (T
L
)
Time (t
L
) maintained above T
L
217 °C
60-150 sec
Time 25 °C to peak temperature
8 mn max