Specifications

January 13, 2021
Page 3/31
Document Ref: isp_lora_DS4520_R7
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
LoRa / BLE MODULE
ISP4520
Contents
1. Block Diagram ............................................................................................................................................................... 4
2. Specifications ................................................................................................................................................................ 4
2.1. Important Notice ............................................................................................................................................... 5
2.2. Absolute Maximum Ratings ............................................................................................................................. 5
2.3. Operating Conditions ....................................................................................................................................... 5
2.4. Current Consumption ....................................................................................................................................... 5
2.5. Clock Sources .................................................................................................................................................. 6
2.6. LoRa Radio Specifications ............................................................................................................................... 6
2.7. BLE Radio Specifications ................................................................................................................................. 7
2.8. Antenna Performance ...................................................................................................................................... 8
2.9. Electrical Schematic ....................................................................................................................................... 11
2.10. Internal Module Connections ......................................................................................................................... 13
3. Pin Description ............................................................................................................................................................ 14
4. Mechanical Outlines ................................................................................................................................................... 16
4.1. Mechanical Dimensions ................................................................................................................................. 16
4.2. SMT Assembly Guidelines ............................................................................................................................. 18
4.3. Antenna Keep-Out Zone ................................................................................................................................ 18
5. Product Development Tools ..................................................................................................................................... 19
5.1. Hardware ........................................................................................................................................................ 19
5.2. Firmware ........................................................................................................................................................ 19
5.3. Development Tools ........................................................................................................................................ 20
5.4. LoRa Rx/Tx Switch and TCXO Control .......................................................................................................... 20
6. Reference Design ....................................................................................................................................................... 21
6.1. Sensor Board Design ..................................................................................................................................... 21
7. Packaging & Ordering information.......................................................................................................................... 24
7.1. Marking .......................................................................................................................................................... 24
7.2. Prototype Packaging ...................................................................................................................................... 24
7.3. Jedec Trays.................................................................................................................................................... 25
7.4. Tape and Reel ............................................................................................................................................... 26
7.5. Ordering Information ...................................................................................................................................... 26
8. Storage & Soldering information ............................................................................................................................. 27
8.1. Storage and Handling .................................................................................................................................... 27
8.2. Moisture Sensitivity ........................................................................................................................................ 27
8.3. Soldering information ..................................................................................................................................... 28
9. Quality & User information ....................................................................................................................................... 29
9.1. Pending Certifications .................................................................................................................................... 29
9.2. USA – User information ................................................................................................................................. 29
9.3. Canada – User information ............................................................................................................................ 29
9.4. RF Exposure Information ............................................................................................................................... 30
9.5. Informations concernant l'exposition aux fréquences radio (RF) .................................................................. 30
9.6. Discontinuity ................................................................................................................................................... 30
9.7. Disclaimer ...................................................................................................................................................... 31