eUniStone BlueMoon™ Universal Platform Embedded PBA 31309 Version 1.x Intel Public User’s Manual Hardware Description Revision 1.
Information in this document related to the Intel product or, if any, related to its use is provided in connection with Intel products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document.
eUniStone PBA 31309 Revision History Page or Item Subjects (major changes since previous revision) Revision 1.0, 1-Feb-2013 , User’s Manual Hardware Description Intel Public 3 Revision 1.
eUniStone PBA 31309 Contents 1.0 General Device Overview........................................................................................... 8 1.1 Features ............................................................................................................ 8 1.2 Block Diagram .................................................................................................... 9 1.3 Pin Configuration LGA ........................................................................................
eUniStone PBA 31309 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 9.0 Reference Design .............................................................................................. 31 FCC Class B Digital Devices Regulatory Notice....................................................... 32 FCC Wireless Notice........................................................................................... 32 FCC Interference Statement ...............................................................................
eUniStone PBA 31309 Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Simplified Block Diagram of eUniStone ......................................................................... 9 Pin Configuration for eUniStone in Top View (footprint) ................................................. 10 System Architecture Example with eUniStone .............................................................. 13 UART Interface ...................................................................................
eUniStone PBA 31309 Tables 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Description ....................................................................................................... 11 UART Baud Rates .................................................................................................... 17 Default (non-inverted) behavior of UART signals ......................................................... 17 Absolute Maximum Ratings ..................................................................
eUniStone PBA 31309 General Device Overview 1.0 General Device Overview 1.1 Features General • Complete Bluetooth 2.1 + EDR solution • Implements a single point-to-point data link to other SPP capable Bluetooth devices • Ultra low power design in 0.13 µm CMOS • Temperature range from -40°C to +85°C • Integrates ARM7TDMI, RAM and patchable ROM • On-module voltage regulators. External supply 2.9 - 4.
eUniStone PBA 31309 General Device Overview Bluetooth • Bluetooth V2.1 + EDR compliant • Secure Simple Pairing • Device A (initiating link) or Device B (accepting link) role supported • Single point-to-point data link, role switch supported • Packet data mode and stream data mode supported • Sniff mode and Sniff Subrating is supported with above capabilities • 5 trusted devices stored in EEPROM • SW version available to configure specific RF certification tests 1.
eUniStone PBA 31309 General Device Overview 1.3 Pin Configuration LGA F1 VSS F2 P1.2 TDI F3 P0.11 F4 LPMin P0.14 F5 UARTCTS E1 P0.12 SDA0 E2 P013 SCL0 E3 P1.3 TDO E4 LPMout P0.0 D1 P0.10 D2 P0.8 D3 P1.1 TCK C1 VREG C2 P0.9 B1 P1.7 B2 P1.8 A1 VSS A2 P1.6 F6 F7 F8 VDDUART UARTTXD UARTRTS F9 VSS E5 P0.1 E6 UARTRXD E7 (NC) E8 VSS E9 VSS D4 P0.3 D5 P0.2 D6 (NC) D7 VSS D8 VSS D9 (NC) C3 JTAG# C4 TRST# C5 VDD1 C6 (NC) C7 (NC) C8 VSS C9 VSS B3 P1.0 TMS B4 P1.
eUniStone PBA 31309 General Device Overview 1.4 Pin Description The non-shaded cells indicate pins that will be fixed for the product lifetime. Shaded cells indicate that the pin might be removed/changed in future variants. Pins not listed below shall not be connected. Table 1. Pin No. Pin Description Symbol Input / Output Supply Voltage During Reset After Reset Function A2 P1.6 I/O/OD Internal1 Z Z Port 1.6 A3 RESET# AI Internal1 Input Input Hardware Reset A8 P1.
eUniStone PBA 31309 General Device Overview Table 1. Pin No. Symbol A1, A7, A9, A11, A12, C8, C9, D7, D8, E8, E9, F1, F9, F11, F12 VSS B6, B7, B8, C6, C7, D6, D9, E7 NC 1. Pin Description (Continued) Input / Output - Supply Voltage - During Reset After Reset Function - - Ground - - No connection Fixed pull-up/pull-down if JTAG interface is selected, not affected by any chip reset. If JTAG interface is not selected the port is tristate.
eUniStone PBA 31309 General Device Overview 1.5 System Integration eUniStone is optimized for a low bill of material (BOM) and a small PCB size. Figure 3 shows a typical application example. HOST Buttons, Leds LPM UART RESET AT command interface GPIO SPP(Serial Port Profile ) Oscillator API RFCOMM EEPROM Configuration , SW patch I2 C BT Stack BT Baseband Voltage BT RF Regulator BALUN Antenna System_Architecture.vsd VSUPPLY Figure 3.
eUniStone PBA 31309 General Device Overview The UART interface is used for communication between the host and eUniStone. The lines UARTTXD and UARTRXD are used for commands, events and data. The lines UARTRTS and UARTCTS are used for hardware flow control. Low power mode control of eUniStone and the host can be implemented in by using the pins P0.14 and P0.0. P0.14 is used by the host to allow eUniStone to enter low power mode and P0.0 is used by eUniStone to wake-up the host when attention is required.
eUniStone PBA 31309 Basic Operating Information 2.0 Basic Operating Information 2.1 Power Supply eUniStone is supplied from a single supply voltage VSUPPLY. This supply voltage must always be present. The Bluetooth chip is supplied from an internally generated 2.5 V supply voltage. This voltage can be accessed from the VREG pin. This voltage shall not be used for supplying other components in the host system but can be used for referencing the host interfaces.
eUniStone PBA 31309 eUniStone Interfaces 3.0 eUniStone Interfaces 3.1 UART Interface The UART interface is the main communication interface between the host and eUniStone. AT commands are described in detail in the AT Commands specification [1]. The interface consists of four UART signals and two LPM control signals as shown in Figure 4. Host UARTTXD UARTRXD UARTRTS UARTCTS eUniStone UARTTXD UARTRXD UARTRTS UARTCTS WAKEUP_BT WAKEUP_HOST P0.14 input P0.0 output eUnistone_UART_Interface.
eUniStone PBA 31309 eUniStone Interfaces Table 2 shows the UART baudrates supported. Table 2. UART Baud Rates Standard Baud Rate Module Baud Rate Deviation in % 9600 9615 0.16 19200 19230 0.16 38400 38461 0.16 57600 57522 -0.14 115200 115044 -0.14 230400 230088 -0.14 460800 464285 0.76 921600 928571 0.76 1843200 1857142 0.76 3250000 3250000 0 3.1.1.
eUniStone PBA 31309 eUniStone Interfaces 3.1.1.3 UARTCTS Response Time Figure 5 shows the UARTCTS response time. Assuming non-inverted UART signals, the data flow stops within the “flow off response time” after UARTCTS has been set to high. If UARTCTS goes high during the transmission of a byte (phase 1 in the figure) this byte will be completely transmitted. While UARTCTS is high, no data will be transmitted (phase 2). When UARTCTS goes low again, data transmission will continue (phase 3).
eUniStone PBA 31309 General Device Capabilities 4.0 General Device Capabilities This chapter describes features available in the eUniStone (PBA 31309). Actual feature set and how to access the features can be found in the AT Command document [1]. Release specific performance characteristics, data throughput and current consumption are listed in the SW Release Notes [2]. 4.1 RF Test Application The eUniStone module can be programmed over UART with a specific application for RF test purposes, e.g.
eUniStone PBA 31309 Bluetooth Capabilities 5.0 Bluetooth Capabilities 5.1 Supported Features • Bluetooth V2.1 + EDR compliant • Enhanced Data Rate 2 and 3 Mbit/s symbol rate on the air • Secure Simple Pairing • Device A (initiating link) or Device B (accepting link) role supported • Single point-to-point data link, role switch supported • Packet data mode and stream data mode supported • Link in sniff mode supported. Device enters Low Power Mode in sniff intervals if permitted by the host.
eUniStone PBA 31309 Bluetooth Capabilities 5.2.3 Sniff Mode The local host or the remote device can request sniff mode for the link. During sniff mode, the devices synchronize on sniff instants only. The module will enter low power mode in the sniff intervals, if allowed by the host LPM control signals. Data packets can be exchanged at the sniff instants only, so the data rate is reduced in sniff mode. The module will wake up the host when data is received or other responses need to be transmitted. 5.2.
eUniStone PBA 31309 Electrical Characteristics 6.0 Electrical Characteristics 6.1 Absolute Maximum Ratings Table 4. Absolute Maximum Ratings Parameter Symbol Values Unit Note / Test Condition – Min. Typ. Max. Storage temperature -40 – 125 °C VSUPPLY supply voltage -0.3 – 6.0 V – VDDUART supply voltage -0.9 – 4.0 V – – VDD1 supply voltage -0.9 – 4.0 V VREG -0.3 – 4.0 V VSUPPLY > 4 V VREG -0.3 – VSUPPLY V VSUPPLY < 4 V ONOFF -0.3 – VSUPPLY+0.
eUniStone PBA 31309 Electrical Characteristics 6.3 DC Characteristics 6.3.1 Pad Driver and Input Stages For more information, see Chapter 1.4. Table 6. Internal1 (1.5 V) Supplied Pins Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Input low voltage -0.3 – 0.27 V – Input high voltage 1.15 – 3.6 V – Output low voltage – – 0.25 V IOL = 1 mA Output high voltage 1.
eUniStone PBA 31309 Electrical Characteristics Table 8. VDDUART Supplied Pins Parameter Symbol Values Unit Note / Test Condition Min. Typ. Input low voltage -0.3 – Max. 0.2*VDDUART V – Input high voltage 0.7*VDDUART – VDDUART+0.3 V P0.5/UARTRXD Input high voltage 0.7*VDDUART – 3.6 V Other pins Output low voltage – – 0.25 V IOL = 5 mA VDDUART = 2.5 V Output low voltage – – 0.15 V IOL = 2 mA VDDUART = 2.5 V Output high voltage VDDUART -0.
eUniStone PBA 31309 Electrical Characteristics 6.3.2 Pull-ups and Pull-downs Table 11. Pull-up and Pull-down Currents Pin Pull Up Current Pull Down Current Unit Conditions Pull-up current measured with pin voltage = 0 V Min. Typ. Max. Min. Typ. Max. P0.12 P0.13 260 740 1300 N/A N/A N/A µA P0.0 P0.1 P0.2 P0.3 22 130 350 23 150 380 µA P0.4 P0.5 P0.6 P0.7 P0.10 P0.8 P0.9 P0.11 P0.14 P0.15 4.2 24 68 3.0 20 55 µA P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P1.8 1.1 6.3.
eUniStone PBA 31309 Electrical Characteristics 6.3.4 System Power Consumption Table 12. Max. Load at the Different Supply Voltages Parameter Symbol Vsupply Values Min. Typ. Max. – – 100 Unit Note / Test Condition mA Peak current Note: I/O currents are not included since they depend mainly on external loads. For more details see [2]. 6.4 RF Part 6.4.1 Characteristics RF Part The characteristics involve the spread of values to be within the specific temperature range.
eUniStone PBA 31309 Electrical Characteristics Table 13. BDR - Transmitter Part (Continued) Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Carrier frequency driftrate (three slots) |fdriftrate| – 5 20 kHz/50 ms – Carrier frequency driftrate (five slots) |fdriftrate| – 5 20 kHz/50 ms – Table 14. BDR -Receiver Part Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max.
eUniStone PBA 31309 Electrical Characteristics Table 15. EDR - Transmitter Part (Continued) Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. 1st adjacent channel power – -40 -26 dBc – 2nd adjacent channel power – – -20 dBm Carrier power measured at basic rate 3rd adjacent channel power – – -40 dBm Carrier power measured at basic rate Table 16. EDR -Receiver Part Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max.
eUniStone PBA 31309 Package Information 7.0 Package Information 7.1 Package Marking Product ID Date code FCC ID Version i intelC PBA31309 V1.00 GYYWW /D FYWW9EXX Machine readable 2D bar code PD9PBA313309 Intel usage only , could be changed without any notice PCB Case Example of marking P B A 3 1 3 0 9 V 1 .
eUniStone PBA 31309 Package Information 1,56 0,60 Production Package 1,80 7.2 8,70 15,60 Tolerances: +-0.2mm 121011 _ PAN1322 _V 1.0 .vsd Figure 7. Production Package All dimensions are in mm. Tolerances on all outer dimensions, height, width and length, are +/- 0.2 mm. 7.2.1 Pin Mark Pin 1 (A1) is marked on bottom footprint and on the top of the shield on the module according to Figure 8. Diameter of pin 1 mark on the shield is 0.40 mm. i intel F12 F11 PBA31309 V1.
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eUniStone PBA 31309 Bluetooth Qualification and Regulatory Certification PBA 31309 is intended to be installed inside end user equipment. PBA 31309 is Bluetoooth-qualified and also FCC-certified, and conforms to R&TTE (European) requirements and directives with the reference design described in Figure 9.
eUniStone PBA 31309 Bluetooth Qualification and Regulatory Certification If possible place PBA31309 in the center of the main PCB. 8.7 5.00 Min. 15mm Min. 40mm Top View 15.6 3.00 Restricted Area No copper in any layer Place PBA31309 at the edge of the main PCB. Min. 15mm Use a Ground plane in the area surrounding the PBA31309 module wherever possible. Dimensions are in mm. Visio-Source-PAN1322.vsd Figure 10.
eUniStone PBA 31309 Bluetooth Qualification and Regulatory Certification 8.6 European R&TTE Declaration of Conformity Hereby, Intel declares that the Bluetooth module PBA 31309 is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the end-customer equipment should be labelled as follows: Figure 11.
eUniStone PBA 31309 Bluetooth Qualification and Regulatory Certification Figure 12. Declaration of Conformity The product will be compliant to R&TTE Directive 1999/5/EC: EN 60950-1 2006, EN 50371: 2002 Health and Safety of the User EN301 489-1, v1.8.1, EN301 489-17 v2.1.1 Electromagnetic Compatibility EN300 328 v1.8.1 Effective use of spectrum allocated. User’s Manual Hardware Description Intel Public 35 Revision 1.
eUniStone PBA 31309 Bluetooth Qualification and Regulatory Certification 8.7 Bluetooth Qualified Design ID Intel has submitted End Product Listings (EPL) for eUniStone and eBMU in the Qualified Product List of the Bluetooth SIG. These EPLs are referencing the Bluetooth qualification of the SPP-AT application running on the eBMU chip under QD ID t.b.d. Manufacturers of Bluetooth devices incorporating eUniStone or eBMU can reference the same QD ID number. Bluetooth QD ID: B021246 8.
eUniStone PBA 31309 Assembly Guidelines 9.0 Assembly Guidelines The target of this chapter is to provide guidelines for customers to successfully introduce the eUniStone module in production. This includes general description, PCBdesign, solder printing process, assembly, soldering process, rework and inspection. 9.1 General Description of the Module eUniStone is a Land Grid Array (LGA 6x12) module made for surface mounting. The pad diameter is 0.6 mm and the pitch 1.2 mm.
eUniStone PBA 31309 Assembly Guidelines 9.2 Printed Circuit Board Design The land pattern on the PCB shall be according to the land pattern on the module, which means that the diameter of the LGA pads on the PCB shall be 0.6 mm. It is recommended that each pad on the PCB shall be surrounded by a solder mask clearance of about 75 µm to avoid overlapping solder mask and pad. If possible place PBA31309 in the center of the main PCB. 8.7 5.00 Restricted Area No copper in any layer Min.
eUniStone PBA 31309 Assembly Guidelines 9.3 Solder Paste Printing The solder paste deposited on the PCB by stencil printing has to be of eutectic or near eutectic tin leadfree / lead composition. A no-clean solder paste is preferred, since cleaning of the solder joints is difficult because of the small gap between the module and the PCB. Preferred thickness of the solder paste stencil is 100 - 127 µmm (4 - 5 mils). The apertures on the solder paste stencil shall be of the same size as the pads, 0.6 mm.
eUniStone PBA 31309 Assembly Guidelines 9.4.3 Package eUniStone is packed in tape on reel according to Figure 16. Figure 16. Tape on Reel User’s Manual Hardware Description Intel Public 40 Revision 1.
eUniStone PBA 31309 Assembly Guidelines 9.5 Soldering Profile Generally all standard reflow soldering processes (vapour phase, convection, infrared) and typical temperature profiles used for surface mount devices are suitable for the eUniStone module. Wave soldering is not possible. Figure 17 and Figure 18 shows example of a suitable solder reflow profile. One for leaded and one for leadfree solder. Recommended temp. profile for reflow soldering 10 1s 30 +20/-10s 235°C max. Temp.
eUniStone PBA 31309 Assembly Guidelines At the reflow process each solder joint has to be exposed to temperatures above solder liquids for a sufficient time to get the optimum solder joint quality, whereas overheating the board with its components has to be avoided.
eUniStone PBA 31309 Assembly Guidelines 9.6.2.2 Alternative 2: Printing Solder To print solder on the module a fixture must be used. The purpose of the fixture is to get a flat surface and fix the stencil and module for printing. An example of how this fixture can be designed is shown in Figure 19. S older paste stencil T ooling pins C avity of the module Vacuum hol es Fixture B ottom S older _P rint ing . v s d Figure 19. Solder Printing 1. Assemble the fixture to the bottom 2.
eUniStone PBA 31309 Assembly Guidelines 9.8 Component Salvage If it is intended to send a defect eUniStone module back to the supplier for failure analysis, please note that during the removal of this component no further defects must be introduced to the device, because this may hinder the failure analysis at the supplier.
eUniStone PBA 31309 Assembly Guidelines 9.9.2 Parameters with an Impact on Voiding If the void content has to be reduced following parameters have an impact. Solderability on module and PCB Bad solderability is often connected to oxidation and has therefore a major impact on voiding. Flux will get entrapped on oxidized surfaces. In general, Ni/Au pads show fewer voids than HASL and OSP. Solder paste Higher activity of the flux will remove oxide rapidly and less flux will get entrapped.
eUniStone PBA 31309 References [1] Intel AT Command Specification (eUniStone_1.00_UM_SD.pdf) [2] Release Notes for SPP AT application SW version 1.1 (eUniStone_1.00_SW_3.1_RN.pdf) User’s Manual Hardware Description Intel Public 46 Revision 1.
eUniStone PBA 31309 Terminology A ACK Acknowledgement ACL Asynchronous Connection-oriented (logical transport) AFH Adaptive Frequency Hopping AHS Adaptive Hop Sequence ARQ Automatic Repeat reQuest B b bit/bits (e.g. kb/s) B Byte/Bytes (e.g.
eUniStone PBA 31309 FHS Frequency Hop Synchronization (packet) FIFO First In First Out (buffer) FM Frequency Modulation FW Firmware G GFSK Gaussian Frequency Shift Keying (modulation) GPIO General Purpose Input/Output GSM Global System for Mobile communication H HCI Host Controller Interface HCI+ Intel Specific HCI command set HEC Header Error Check HV High quality Voice (packet type) HW Hardware I I2C Inter-IC Control (bus) I2S Inter-IC Sound (bus) IAC Inquiry Access Code ID
eUniStone PBA 31309 PLC Packet Loss Concealment PLL Phase Locked Loop PMU Power Management Unit POR Power-On Reset PTA Packet Traffic Arbitration PTT Packet Type Table Q QoS Quality Of Service R RAM Random Access Memory RF Radio Frequency ROM Read Only Memory RSSI Received Signal Strength Indication RTS Request To Send (UART flow control signal) RX Receive RXD Receive Data (UART signal) S SCO Synchronous Connection-Oriented (logical transport) SIG Special Interest Group (Blue
