User's Manual
Table Of Contents
- 1.0 General Device Overview
- 2.0 Basic Operating Information
- 3.0 eUniStone Interfaces
- 4.0 General Device Capabilities
- 5.0 Bluetooth Capabilities
- 6.0 Electrical Characteristics
- 7.0 Package Information
- 8.0 Bluetooth Qualification and Regulatory Certification
- 8.1 Reference Design
- 8.2 FCC Class B Digital Devices Regulatory Notice
- 8.3 FCC Wireless Notice
- 8.4 FCC Interference Statement
- 8.5 FCC Identifier
- 8.6 European R&TTE Declaration of Conformity
- 8.7 Bluetooth Qualified Design ID
- 8.8 Industry Canada Certification
- 8.9 Label Design of the Host Product
- 8.10 Regulatory Test House
- 9.0 Assembly Guidelines
- References
- Terminology
eUniStone
PBA 31309
Package Information
User’s Manual Intel Public 30
Hardware Description Revision 1.0, 1-Feb-2013
7.2 Production Package
Figure 7. Production Package
All dimensions are in mm.
Tolerances on all outer dimensions, height, width and length, are +/- 0.2 mm.
7.2.1 Pin Mark
Pin 1 (A1) is marked on bottom footprint and on the top of the shield on the module
according to Figure 8. Diameter of pin 1 mark on the shield is 0.40 mm.
Figure 8. Top View and Bottom View
121011_ PAN1322_V1.0.vsd
1,56
1,80
0,60
15,60
8,70
To l era nce s: + -0. 2mm
i intel
GYYWW /D FYWW9EXX
PD9PBA31309
PBA31309 V1.00
Top_and_Bottom_Views.vsd
Pin 1 marking bottom side
F2F3F4F5F6
E1E2E3E4E5E6E7E8E9
D1D2D3D4D5D6D7D8
C1C2C3C4C5C6C7C8
B1B2B3B4B5B6B7B8B9
A2A3A4A5A6A7A8 A1
F9 F7 F1F8
D9
C9
A9
Pin 1 marking top side
A11
F12 F11
A12