User's Manual
Table Of Contents
- 1.0 General Device Overview
- 2.0 Basic Operating Information
- 3.0 eUniStone Interfaces
- 4.0 General Device Capabilities
- 5.0 Bluetooth Capabilities
- 6.0 Electrical Characteristics
- 7.0 Package Information
- 8.0 Bluetooth Qualification and Regulatory Certification
- 8.1 Reference Design
- 8.2 FCC Class B Digital Devices Regulatory Notice
- 8.3 FCC Wireless Notice
- 8.4 FCC Interference Statement
- 8.5 FCC Identifier
- 8.6 European R&TTE Declaration of Conformity
- 8.7 Bluetooth Qualified Design ID
- 8.8 Industry Canada Certification
- 8.9 Label Design of the Host Product
- 8.10 Regulatory Test House
- 9.0 Assembly Guidelines
- References
- Terminology
eUniStone
PBA 31309
Assembly Guidelines
User’s Manual Intel Public 42
Hardware Description Revision 1.0, 1-Feb-2013
At the reflow process each solder joint has to be exposed to temperatures above solder
liquids for a sufficient time to get the optimum solder joint quality, whereas overheating
the board with its components has to be avoided. Using infrared ovens without
convection special care may be necessary to assure a sufficiently homogeneous
temperature profile for all solder joints on the PCB (especially on large, complex boards
with different thermal masses of the components). The most recommended types are
therefore forced convection or vapour phase reflow. Nitrogen atmosphere can generally
improve solder joint quality, but is normally not necessary.
The reflow profiles and other reflow parameters are dependent on the used solder
paste. The paste manufacturer provides a reflow profile recommendation for this
product.
Additionally it is important not to overheat the eUniStone module by a too large reflow
peak temperature. eUniStone contain several plastic packages and is there by sensitive
of the moisture content level at the time of board assembly.
Overheating in combination with excessive moisture content could result in package
delaminations or cracks (popcorn effect). The heating rate should not exceed 3°C/s and
max sloping rate should not exceed 4°C/s.
eUniStone shall be handled according to MSL3, which means a floor life of 168 h in
30°C/60% r.h.
The eUniStone module can be soldered according to max. J-STD-020C curve, assuming
that all other conditions are followed stated in Product Specification, Qualification
Report and in Application Note. Restriction is that PBA 31309 can be soldered two
times, since one time is already consumed when soldering devices on Module.
9.6 Rework
9.6.1 Removal Procedure
1. Heat the module with an appropriate heating nozzle according to the instruction of
the equipment or on a hot plate (about 225°C dependent on the board). Hot plate
can only be used if the board is single side assembled. The temperature of the
module shall be 200-220°C.
2. Use grippers or a pair of tweezers to remove the module. The module has to be
gripped on two opposite edges of the module (not on the shield).
3. Remove excess solder by using solder sucker, suction soldering irons or solder wick.
9.6.2 Replacement Procedure
Replacement can be done in two ways, dependent of how the solder is applied. Solder
can be applied either by dispensing on the mother board or by printing the solder paste
directly on the module.
9.6.2.1 Alternative 1: Dispensing Solder
A dispenser with controlled volume must be used to assure the same volume on every
pad. The volume on each pad shall be about 0.04 mm3.
1. Dispense 0.04 mm
3
on each LGA pad
2. Pick the module by a nozzle and place in the right position on the board
3. Reflow the solder.