User's Manual

eUniStone
PBA 31309
User’s Manual Intel Public 5
Hardware Description Revision 1.0, 1-Feb-2013
8.1 Reference Design .............................................................................................. 31
8.2 FCC Class B Digital Devices Regulatory Notice....................................................... 32
8.3 FCC Wireless Notice........................................................................................... 32
8.4 FCC Interference Statement ............................................................................... 33
8.5 FCC Identifier ................................................................................................... 33
8.6 European R&TTE Declaration of Conformity........................................................... 34
8.7 Bluetooth Qualified Design ID ............................................................................. 36
8.8 Industry Canada Certification.............................................................................. 36
8.9 Label Design of the Host Product......................................................................... 36
8.10 Regulatory Test House....................................................................................... 36
9.0 Assembly Guidelines ............................................................................................... 37
9.1 General Description of the Module ....................................................................... 37
9.2 Printed Circuit Board Design ............................................................................... 38
9.3 Solder Paste Printing ......................................................................................... 39
9.4 Assembly ......................................................................................................... 39
9.4.1 Component Placement ............................................................................ 39
9.4.2 Pin Mark ............................................................................................... 39
9.4.3 Package................................................................................................ 40
9.5 Soldering Profile................................................................................................ 41
9.6 Rework........................................................................................................... 42
9.6.1 Removal Procedure ............................................................................... 42
9.6.2 Replacement Procedure .......................................................................... 42
9.6.2.1 Alternative 1: Dispensing Solder................................................. 42
9.6.2.2 Alternative 2: Printing Solder ..................................................... 43
9.7 Inspection........................................................................................................ 43
9.8 Component Salvage .......................................................................................... 44
9.9 Voids in the Solder Joints ................................................................................... 44
9.9.1 Expected Void Content and Reliability ....................................................... 44
9.9.2 Parameters with an Impact on Voiding ...................................................... 45