User's Manual
Table Of Contents
- 1.0 General Device Overview
- 2.0 Basic Operating Information
- 3.0 eUniStone Interfaces
- 4.0 General Device Capabilities
- 5.0 Bluetooth Capabilities
- 6.0 Electrical Characteristics
- 7.0 Package Information
- 8.0 Bluetooth Qualification and Regulatory Certification
- 8.1 Reference Design
- 8.2 FCC Class B Digital Devices Regulatory Notice
- 8.3 FCC Wireless Notice
- 8.4 FCC Interference Statement
- 8.5 FCC Identifier
- 8.6 European R&TTE Declaration of Conformity
- 8.7 Bluetooth Qualified Design ID
- 8.8 Industry Canada Certification
- 8.9 Label Design of the Host Product
- 8.10 Regulatory Test House
- 9.0 Assembly Guidelines
- References
- Terminology
eUniStone
PBA 31309
User’s Manual Intel Public 6
Hardware Description Revision 1.0, 1-Feb-2013
1 Simplified Block Diagram of eUniStone ......................................................................... 9
2 Pin Configuration for eUniStone in Top View (footprint) ................................................. 10
3 System Architecture Example with eUniStone .............................................................. 13
4 UART Interface........................................................................................................ 16
5 UARTCTS Response Time .......................................................................................... 18
6 Package Marking...................................................................................................... 29
7 Production Package.................................................................................................. 30
8 Top View and Bottom View........................................................................................ 30
9 Reference Design Schematics .................................................................................... 31
10 Cutout Drawing ....................................................................................................... 33
11 Equipment Label...................................................................................................... 34
12 Declaration of Conformity ......................................................................................... 35
13 Pad Layout on the Module (top view).......................................................................... 37
14 Cutout Drawing ....................................................................................................... 38
15 Pin Marking............................................................................................................. 39
16 Tape on Reel........................................................................................................... 40
17 Eutectic Lead-Solder Profile....................................................................................... 41
18 Eutectic Leadfree-Solder Profile ................................................................................. 41
19 Solder Printing ........................................................................................................ 43
20 X-ray Picture Showing Voids Conforming to IPC-A-610D................................................ 44
Figures










