Datasheet

Datasheet 3
Contents
1Introduction..............................................................................................................7
1.1 Terminology .......................................................................................................8
1.2 References .........................................................................................................9
2 Low Power Features ................................................................................................11
2.1 Clock Control and Low Power States ....................................................................11
2.1.1 Core Low Power State Descriptions...........................................................13
2.1.2 Package Low Power State Descriptions......................................................15
2.2 Enhanced Intel SpeedStep® Technology ..............................................................18
2.2.1 Dynamic FSB Frequency Switching ...........................................................19
2.2.2 Intel® Dynamic Acceleration Technology...................................................19
2.3 Extended Low Power States................................................................................19
2.4 FSB Low Power Enhancements............................................................................20
2.5 VID-x ..............................................................................................................21
2.6 Processor Power Status Indicator (PSI-2) Signal....................................................21
3 Electrical Specifications...........................................................................................23
3.1 Power and Ground Pins ......................................................................................23
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking......................................................23
3.3 Voltage Identification.........................................................................................23
3.4 Catastrophic Thermal Protection..........................................................................26
3.5 Reserved and Unused Pins..................................................................................26
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................27
3.7 FSB Signal Groups.............................................................................................27
3.8 CMOS Signals ...................................................................................................29
3.9 Maximum Ratings..............................................................................................29
3.10 Processor DC Specifications ................................................................................30
4 Package Mechanical Specifications and Pin Information ..........................................41
4.1 Package Mechanical Specifications.......................................................................41
4.2 Processor Pinout and Pin List ..............................................................................49
4.3 Alphabetical Signals Reference............................................................................69
5 Thermal Specifications and Design Considerations ..................................................77
5.1 Thermal Specifications.......................................................................................80
5.1.1 Thermal Diode.......................................................................................81
5.1.2 Thermal Diode Offset..............................................................................83
5.1.3 Intel® Thermal Monitor...........................................................................84
5.1.4 Digital Thermal Sensor............................................................................86
5.1.5 Out of Specification Detection ..................................................................87
5.1.6 PROCHOT# Signal Pin.............................................................................87