Datasheet
Datasheet 77
Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
Maintaining the proper thermal environment is key to reliable, long-term system
operation. A complete thermal solution includes both component and system level
thermal management features. The system/processor thermal solution should be
designed so that the processor remains within the minimum and maximum junction
temperature (Tj) specifications at the corresponding thermal design power (TDP) value
listed in Table 19 through Table 20.
Caution: Operating the processor outside these limits may result in permanent damage to the
processor and potentially other components in the system.
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T
J
has been reached. Refer to Section 5.1 for details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
Table 19. Power Specifications for the Intel Core 2 Duo Processor - Standard Voltage
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit Notes
TDP
T7800
T7700
T7500
T7300
T7250
T7100
2.6 GHz & HFM V
CC
2.4 GHz & HFM V
CC
2.2 GHz & HFM V
CC
2.0 GHz & HFM V
CC
2.0 GHz & HFM V
CC
1.8 GHz & HFM V
CC
1.2 GHZ & LFM V
CC
0.80 GHZ & SuperLFM V
CC
35
35
35
35
35
35
25
12
W
1, 4, 5, 6, 9
1, 4, 5, 6, 9
1, 4, 5, 6, 9
1, 4, 5, 6, 10
Symbol Parameter Min Typ Max Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
CC
at SuperLFM V
CC
13.5
6.9
W2, 5, 7
P
SLP
Sleep Power
at HFM V
CC
at SuperLFM V
CC
12.9
6.7
W2, 5, 7
P
DSLP
Deep Sleep Power
at HFM V
CC
at SuperLFM V
CC
7.7
4.3
W2, 5, 8
P
DPRSLP
Deeper Sleep Power 2.0 W 2, 8
P
DC4
Intel® Enhanced Deeper Sleep Power 1.2 W 2, 8
T
J
Junction Temperature 0 100 °C3, 4