Datasheet

Datasheet 79
Thermal Specifications and Design Considerations
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T
J
has been reached. Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than TDP in HFM.
6. At Tj of 100
o
C.
7. At Tj of 50
o
C.
8. At Tj of 35
o
C.
9. 2-M L2 cache.
Table 21. Power Specifications for the Intel Core 2 Duo Processor - Ultra Low Voltage
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit Notes
TDP
U7700
U7600
U7500
1.33 GHz & HFM V
CC
1.20 GHz & HFM V
CC
1.06 GHz & HFM V
CC
0.80 GHZ & LFM V
CC
10
10
10
9.2
W 1, 4, 5, 6, 9
Symbol Parameter Min Typ Max Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
CC
at LFM V
CC
3.1
2.6
W2, 5, 7
P
SLP
Sleep Power
at HFM V
CC
at LFM V
CC
3.0
2.5
W2, 5, 7
P
DSLP
Deep Sleep Power
at HFM V
CC
at LFM V
CC
1.5
1.3
W2, 5, 8
P
DPRSLP
Deeper Sleep Power 1.0 W 2, 8
P
DC4
Intel Enhanced Deeper Sleep Power 0.7 W 2, 8
T
J
Junction Temperature 0 100 °C3, 4