Guidelines

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 19
Thermal Metrology
5 Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the MCH IHS temperatures. Section 5.1 provides guidelines on
how to accurately measure the MCH case temperature.
5.1 MCH Case Measurement
Intel
®
3210 and 3200 Chipset cooling performance is determined by measuring the
case temperature using a thermocouple. For case temperature measurements, the
attached method outlined in this section is recommended for mounting a
thermocouple.
Special case is required when measuring case temperature (Tc) to ensure an accurate
temperature measurement. Thermocouples are often used to measure Tc. When
measuring the temperature of a surface that is at a different temperature from the
surrounding local ambient air, errors may be introduced in the measurements. The
measurement errors can be caused by poor thermal contact between the thermocouple
junction and the surface of the integrated heat spreader, heat loss by radiation,
convection, by conduction through thermocouple leads, or by contact between the
thermocouple cement and the heatsink base. To minimize these measurement errors,
the approach outlined in the next section is recommended.
5.1.1 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended that you use
the equipment (or equivalent) given in Table 5-1.
Table 5-1. Thermocouple Attach Support Equipment (Sheet 1 of 2)
Item Description Part Number
Measurement and Output
Microscope Olympus* Light microscope or equivalent SZ-40
DMM Digital Multi Meter for resistance
measurement
Fluke 79 Series
Thermal Meter Hand held thermocouple meter Multiple Vendors
Test Fixtures (see notes for ordering information)
Special Modified Tip Solder
Block Fixture
40 W 120 V~60 Hz modified soldering
iron
Weller SP40L solder tool
Miscellaneous Hardware (see notes for ordering information)
Solder Indium Corp. of America
Alloy 57BI/42SN/1AG 0.010 Diameter
52124
Flux Indium Corp. of America 5RMA
Loctite* 498 Adhesive Super glue w/ thermal characteristics 49850
Adhesive Accelerator Loctite 7452 for fast glue curing 18490
Kapton* Tape for holding thermocouple in place
Thermocouple Omega*, 36 gauge, T type
(see note 2 for ordering information)
OSK2K1280/5SR TC-TT-T-36-72