Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence
4     Thermal and Mechanical Design Guidelines 
4.2.10  Digital Thermal Sensor.............................................................39 
4.2.11  Platform Environmental Control Interface (PECI)..........................40 
5  Intel
®
 Enabled Balanced Technology Extended (BTX) Reference solution.................41 
5.1  Overview of the Balanced Technology Extended (BTX) Reference Design......41 
5.1.1  Target Heatsink Performance ....................................................41 
5.1.2  Acoustics ...............................................................................42 
5.1.3  Effective Fan Curve .................................................................43 
5.1.4  Voltage Regulator Thermal Management.....................................44 
5.1.5  Altitude..................................................................................45 
5.1.6  Reference Heatsink Thermal Validation.......................................45 
5.1.7  Fan Performance for Active Heatsink Thermal Solution..................45 
5.2  Environmental Reliability Testing............................................................46 
5.2.1  Structural Reliability Testing .....................................................46 
5.2.2  Power Cycling.........................................................................48 
5.2.3  Recommended BIOS/Processor/Memory Test Procedures ..............48 
5.3  Material and Recycling Requirements ......................................................48 
5.4  Safety Requirements ............................................................................49 
5.5  Geometric Envelope for Intel
®
 Reference Balanced Technology 
Extended (BTX) Thermal Module Assembly...............................................
49 
5.6  Preload and TMA Stiffness .....................................................................50 
5.6.1  Structural Design Strategy........................................................50 
5.6.2  TMA Preload vs. Stiffness .........................................................50 
6  ATX Thermal/Mechanical Design Information.......................................................53 
6.1  ATX Reference Design Requirements.......................................................53 
6.1.1  Target Heatsink Performance ....................................................53 
6.1.2  Acoustics ...............................................................................54 
6.1.3  Altitude..................................................................................55 
6.1.4  Heatsink Thermal Validation .....................................................55 
6.1.5  Fan Performance for Active Heatsink Thermal Solution..................55 
6.2  Environmental Reliability Testing............................................................56 
6.2.1  Structural Reliability Testing .....................................................56 
6.2.2  Power Cycling.........................................................................58 
6.2.3  Recommended BIOS/Processor/Memory Test Procedures ..............59 
6.3  Material and Recycling Requirements ......................................................59 
6.4  Safety Requirements ............................................................................60 
6.5  Geometric Envelope for Intel
®
 Reference ATX Thermal Mechanical Design ....60 
6.6  Reference Attach Mechanism..................................................................61 
6.6.1  Structural Design Strategy........................................................61 
6.6.2  Mechanical Interface to the Reference Attach Mechanism ..............62 
7  Intel
®
 Quiet System Technology (Intel
®
 QST) .....................................................65 
7.1  Intel
®
 QST Algorithm............................................................................65 
7.1.1  Output Weighting Matrix ..........................................................66 
7.1.2  Proportional-Integral-Derivative (PID)........................................66 
7.2  Board and System Implementation of Intel
®
 QST......................................68 
7.3  Intel
®
 QST Configuration and Tuning.......................................................70 
7.4  Fan Hub Thermistor and Intel
®
 QST ........................................................70 
Appendix A  LGA775 Socket Heatsink Loading ......................................................................71 
A.1  LGA775 Socket Heatsink Considerations ..................................................71 










