Computer Hardware User Manual

Intel

631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007 TMDG

Reference Thermal Solution—Intel

6321ESB ICH

7.0 Reference Thermal Solution

Intel has developed one reference thermal solution to meet the cooling needs of the

Intel® 6321ESB I/O Controller Hub component under operating environments and

specifications defined in this document. This chapter describes the overall requirements

for the Torsional Clip Heatsink reference thermal solution including critical-to-function

dimensions, operating environment, and validation criteria. Other chipset components

may or may not need attached thermal solutions, depending on your specific system

local-ambient operating conditions.

7.1 Operating Environment

The Intel

6321ESB ICH reference thermal solution was designed assuming a

maximum local-ambient temperature of 65°C. The minimum recommended airflow

velocity through the cross section of the heatsink fins is 150 linear feet per minute

(LFM). The approaching airflow temperature is assumed to be equal to the local-

ambient temperature. The thermal designer must carefully select the location to

measure airflow to obtain an accurate estimate. These local-ambient conditions are

based on a 55°C external-ambient temperature at sea level. (External-ambient refers

to the environment external to the system.)

7.2 Heatsink Performance

Figure 9 depicts the measured thermal performance of the reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction

factor would be required to estimate thermal performance at other altitudes.