603 Pin Socket Design Guidelines

2. Processor Pin Field Description:

Information provided in this section is to ensure dimensional compatibility of the 603 Pin Socket with

that of the Intel Xeon processor. The processor must be inserted into the 603 Pin Socket with zero

insertion force when the socket is not actuated.

2.1. Processor pin field without Heatsink:

The outline of the processor that can be used with the 603 Pin Socket is illustrated in Figure 9-1

(Appendix A.1). This drawing does not include potential heat sinks since these are used at the OEM's

discretion. Specific details can be obtained from Intel



Xeon



Processor Thermal Design Guidelines,

consult your Intel field representative to obtain this document.

2.2. Pin Dimensions:

Details of the pin dimensions are shown in Figure 9-3 (Appendix A.3). All dimensions are Metric.

Note that the pin diameter may vary by +0.05/-0.025mm and effective pin length by ±0.076mm. The

pin base material is Kovar. The plating material and thickness is 8µin of Au over 80µin of Ni. The

package Critical To Function (CTF) Dimensions are presented in Table 2-1.

Table 2-1: Package Critical To Function (CTF) Dimensions

Dimension Minimum mm Maximum mm

Shoulder Diameter (Land Solder Fillet Shoulder Inclusion ) N/A 0.76 max

Pin Diameter 0.28 0.36

Shoulder Diameter Protrusion (Land Solder Fillet Shoulder

Inclusion)

N/A 0.254

Pin Socketable Length 1.96 2.11

Pin TP N/A 0.254

Flatness of Processor N/A 0.007mm/mm