64-bit Intel Xeon Processorwith up to 8MB L3 Cache Thermal/Mechanical Design Guidelines

Testing Methods

40 64-bit Intel

Xeon™ Processor MP with 8 MB L3 Cache

Thermal/Mechanical Design Guidelines

Figure B-4. Bending Tip of Thermocouple

B.6 Thermocouple Attachment to the IHS

1. Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple

attachment.

2. Place the thermocouple wire inside the groove letting the exposed wire and bead extend

about 3.2 mm [0.125 inch] past the end of groove. Secure it with Kapton* tape.

3. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the

thermocouple in the channel ensuring the tip is in contact with the end of the channel grooved

in the IHS.

4. Place the processor under the microscope unit to continue with process. It is also

recommended to use a fixture (like processor tray or a plate) to help holding the unit in place

for the rest of the attach process.

5. Press the wire down about 6mm [0.125"] from the thermocouple bead using the tweezers.

Look in the microscope to perform this task. Place a piece of Kapton* tape to hold the wire

inside the groove.

6. Using the micromanipulator, install the needle near to the end of groove on top of

thermocouple. Using the X, Y, and Z axes on the arm place the tip of needle on top of the

thermocouple bead. Press down until the bead is seated at the end of groove on top of the

step.

7. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the

IHS surface. This should be the same value as measured during the thermocouple

conditioning.

8. Place a small amount of Loctite* 498 adhesive in the groove where the bead is installed.

Using a fine point device, spread the adhesive in the groove around the needle, the

thermocouple bead and the thermocouple wires already installed in the groove during step 5

above. Be careful not to move the thermocouple bead during this step.

9. Measure the resistance from the thermocouple end wires again using the DMM and to ensure

the bead is still properly contacting the IHS.