64-bit Intel Xeon Processorwith up to 8MB L3 Cache Thermal/Mechanical Design Guidelines

R
Testing Methods
64-bit Intel
®
Xeon™ Processor MP with 8 MB L3 Cache 43
Thermal/Mechanical Design Guidelines
B.7 Curing Process
1. Let the thermocouple attach set in the open-air for at least 1/2 Hr. It is not recommended to
use any curing accelerator like Loctite* Accelerator 7452 for this step, as rapid contraction of
the adhesive during curing may weaken bead attach on the IHS.
2. Reconfirm electrical connectivity with DMM before removing the micromanipulator.
3. Remove the 3D Arm needle by holding down the processor unit and lifting the arm.
4. Remove the Kapton* tape, straighten the wire in the groove so it lays flat all the way to the
end of the groove.
5. Using a blade to shave excess adhesive above the IHS surface.
Take usual precautions when using open blades.
1. Install new Kapton* tape to hold the thermocouple wire down and fill the rest of groove with
adhesive. Make sure the wire and insulation is entirely within the groove and below the IHS
surface.
2. Curing time for the rest of the adhesive in the groove can be reduced using Loctite*
Accelerator 7452.
3. Repeat step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact
to the heatsink surface.
B.8 Thermocouple Wire Management
Figure B-11. Thermocouple Wire Management in the Groove