Intel Processor Material Declaration Data Sheets (MDDS)
COMMENTS
4. Material mass can be estimated by multiplying concentration (ppm) by product weight.
5. The remainder of this package consists of non-reportable metals (e.g., tin, iron, etc), epoxy resin and other non-metal materials.
3. Data in parts per million (ppm) can be used to estimate content for other packages assumed to be similar.
1. The information on materials and substances listed above is based on the following package: Item Market Name
BX80551PGxxxxFT. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS
Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data
and/or analytical testing. Results may vary due to differences in production and /or sensitivities of the methods and tools used for
analytical testing and modeling. Intel's certification of RoHS compliance at the homogenous material level is based on Supplier
Declarations of Conformance.
2. This data sheet is based on the product specified and other packages are assumed to be similar.
Nickel
Electronic and Mechanical
components and materials
FCLGA4-H: Zener diode 200000
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Resistor 36100
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Capacitor 27000
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Capacitor 42000
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Capacitor 62000
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Ball bearing (ball) 40000
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Ball bearing
(board)
89900
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Ball bearing
(outer ring)
90000
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Resistor 29100
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Ball bearing
(outer ring)
90000
Brominated Flame
Retardant
Flame retardant FCLGA4-H: Transistor 17500
Brominated Flame
Retardant
Flame retardant FCLGA4-H: Transistor 8800
Brominated Flame
Retardant
Flame retardant FCLGA4-H: Drive IC 12500
Brominated Flame
Retardant
Flame retardant FCLGA4-H: Drive IC 8200
Brominated Flame
Retardant
Flame retardant FCLGA4-H: Drive IC 13100
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Shaft 4400
Nickel Electronic and Mechanical
components and materials
FCLGA4-H: Coil Spring 84100
Nickel Electronic and Mechanical
components and materials
Smithfield: Substrate 20900
Brominated Flame
Retardant
Flame retardant FCLGA4-H: Transistor 20800
Brominated Flame
Retardant
Flame retardant Smithfield: Epoxy
encapsulation
material/Substrate
15300
INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO
THIS MDDS. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR
OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN
THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.