Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines 19
Thermal/Mechanical Reference Design
Although designing to Thermal Profile B results in increased T
CASE
temperatures compared to
Thermal Profile A at a given power level, both of these Thermal Profiles ensure that Intel’s long-
term processor reliability requirements are satisfied. In other words, designing to Thermal Profile
B does not impose any additional risk to Intel’s long-term reliability requirements. Thermal
solutions that exceed Thermal Profile B specification are considered incompliant and will
adversely affect the long-term reliability of the processor.
Refer to the Dual-Core Intel® Xeon® Processor 2.80 GHz Datasheet or Section 2.2.4 for the
Thermal Profile A and Thermal Profile B specifications. Section 2.4 of this document also provides
details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the
Dual-Core Intel Xeon processor 2.80 GHz Thermal Profile A and Thermal Profile B respectively.
2.2.4 Performance Targets
The Thermal Profile specifications for this processor are published in the Dual-Core Intel® Xeon®
Processor 2.80 GHz Datasheet. These Thermal Profile specifications are shown as a reference in
the subsequent discussions.
Note: The thermal specifications shown in this graph are for reference only. Refer to the Dual-Core
Intel® Xeon® Processor 2.80 GHz Datasheet for the Thermal Profile specifications. In case of
conflict, the data information in the datasheet supersedes any data in this figure.
Table 2-2 describes thermal performance targets for the processor cooling solution enabled by
Intel.
Figure 2-5. Thermal Profiles A and B for the Dual-Core Intel Xeon Processor 2.80 GHz